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This document provides a comprehensive overview of digital logic technologies, focusing on their tradeoffs, examples of Field Programmable Logic Devices (FPLDs), and advanced package types. It includes detailed insights into the architecture of the MAX 7000 CPLD and FLEX 10K series, highlighting components such as macrocells, logic elements, and lookup tables for gate modeling. Additionally, it presents images of FPLD die and silicon wafers containing gate FPGAs, alongside a CAD tool design flow for effective hardware description and implementation.
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Figure 3.3 Examples of FPLDs and advanced high pin count package types.
Figure 3.6 FLEX 10K100 FPLD die photo, PIA interconnects are visible.
Figure 3.8 Using a lookup table (LUT) to model a gate network.
Figure 3.11 Silicon wafer containing XC4010E 10,000 gate FPGAs.
Figure 3.12 Single XC4010E FPGA die showing 20 by 20 array of logic elements and interconnect.
Figure 3.13 Xilinx 4000 Family Configurable Logic Block (CLB).