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A wide dynamic range Charge Sensitive Amplifier. June 5, 2013. PV/BG. Luigi Gaioni. Dynamic Range Compression. Downward compression by means of a feed-back design. Inversion Mode MOS Varactor. Source-Drain are shortcircuited and Bulk is connected to VDD (PMOS) or GND (NMOS).
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A wide dynamic range Charge Sensitive Amplifier June 5, 2013 PV/BG Luigi Gaioni
Dynamic Range Compression Downward compression by means of a feed-back design
Inversion Mode MOS Varactor Source-Drain are shortcircuited and Bulk is connected to VDD (PMOS) or GND (NMOS) Standard MOS transistor Monotone slope
Inversion Mode MOS Varactor Only overlap capacitance when VGS << Vth Large capacitance when VGS > Vth In our simulations the NMOS is operated in off/triode regions Theoretical Cmax/Cmin = L/2∆L
Cmax/Cmin Ratio Other parasitic components should be added to Cmin The absence of an inversion layer allows the gate to “see” the inner wall of S and D this gives rise to an “inner fringing” capacitance Cif
Cmax/Cmin Ratio Cgse, Cgde account for Cov, Ctop and Cof All three capacitances are approximately proportional to W Cgse=Cgde=WCO’’
CSA signal amplitude VS energy High-Energy Gain Low-Energy Gain Low-Energy Gain (LEG) increases by increasing Vsb (increasing Vth) High-Energy Gain (HEG) depends on the WL product Equivalent Feedback capacitance Ceq = (dVout/dQin)-1
MOS geometry effects on LEG LEG increases with decreasing W (1/W behavior) 1/L behavior for L > 10 µm Why LEG is affected by L and Vth ?
MOS geometry effects on LEG We get Cmin for VGS < 0 For VGS ≈ 0 Ceq depends on Vth and on gate dimension MOSFET has to be DC biased with negative VGS
Equivalent Feedback Capacitance Model Cmin = 2ΔLCox, ΔL = 15 nm Cmax = WLCox α and β process dependent parameters (α=3.23×10-3, β=0.78 for the TSMC 65 nm process)