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Radiation Tolerant Source Interface Unit for the ALICE Experiment

Radiation Tolerant Source Interface Unit for the ALICE Experiment. E. D énes et al. LECC 2005 12- 16 September 2005,  Heidelberg. Outline. Introduction DLL Radtol Project Component test FPGA tests Actel SIU tests Radtol SIU status Conclusions. Introduction: ALICE DAQ. Detector.

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Radiation Tolerant Source Interface Unit for the ALICE Experiment

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  1. Radiation Tolerant Source Interface Unit for the ALICE Experiment E. Déneset al. LECC 200512- 16 September 2005,  Heidelberg

  2. Outline • Introduction • DLL Radtol Project • Component test • FPGA tests • Actel SIU tests • Radtol SIU status • Conclusions LECC 2005, Heidelberg

  3. Introduction: ALICE DAQ Detector Detector Readout Electronics Readout Electronics Detector Data Link SIU SIU SIU SIU SIU SIU Source Interface Unit DIU DIU HLT Farm H-RORC H-RORC FEP FEP Duplex, multimode opticalfiber 262 DDLs 123 DDLs SIU SIU 10 DDLs Destination Interface Unit DIU DIU DIU DIU DIU DIU DIU DIU DIU DIU DAQ Readout Receiver Card D-RORC D-RORC D-RORC D-RORC D-RORC D-RORC LDC LDC LDC LDC LDC LDC Local Data Concentrator Event Building Network GDC GDC GDC Global Data Collector LECC 2005, Heidelberg

  4. Introduction: Detector Data Link • Simple, yet efficient standard interface between the detectors and the data-acquisition system • User provided clock signal; flexible readout speed • Simple FIFO-like front-end interface • Data-push architecture • Full-duplex flow control • Bi-directional, high-speed optical link • Sustained data rate up to 200 MB/s • Backward channel (towards the detectors) supports front-end electronics control or bulk download • Radiation tolerant Source Interface Unit LECC 2005, Heidelberg

  5. Radiation Levels in ALICE • Detectors listed have the SIU’s directly installed on the front-end electronics • The other detectors have the SIU’s in shoeboxes close to TPC or in racks in the UX area or in one of the counting rooms LECC 2005, Heidelberg

  6. DDL Radtol Project • Collaboration between CERN, RMKI - KFKI and its partners in Hungary (Cerntech, TU Budapest) • Several tests were carried out to test components that were going to be used on the DDL SIU card • Several reports and publications have been presented • Further tests of the SIU cards are being performed LECC 2005, Heidelberg

  7. SIU Components Xtal IDprom RXCLK Data path(32 bits)+ control Data path(2x16 bits)+ control RXCLK TXCLK TXCLK Data path (Serial) PLD SERDES OpticalTransceiver FEE interface PowerRegulator PowerRegulator Powermonitor Power LECC 2005, Heidelberg

  8. ComponentsTests (1/2) • Crystal oscillators • Four oscillators from four manufacturers (Pletronics, Saronix, CFP, Ecliptek) have been passed the test • TID: 100 krad (req. 5 krad) • Neutron: 1012 n/cm2 (req. 4x1011) • Voltage regulators • Two different device family have been tested • TID: 100 krad (req. 5 krad) • Neutron: 1012 n/cm2 (req. 4x1011) • Micrel’s MIC5209 family (1.8V and 2.5V) failed • Linear Technology’s LT1963 family (1.8V and 2.5V) passed LECC 2005, Heidelberg

  9. ComponentsTests (2/2) • SERDES • TI TLK 2501 have been passed the tests • Neutron: 1012 n/cm2 (req. 4x1011) • Optical transceivers • Two different device family (Agilent HFBR5910EandInfineon V23818-K305-L57) have been passed the tests • TID: 22.8 krad (req. 5 krad) • Neutron: 1012 n/cm2 (>20 yrs of ALICE) • 2.125 Gbps SFP (HFBR5720L and V23818-M305-B57) version of those transceivers were tested as part of the DDL prototype card • TID: tested up to 10 krad (no damage) • SEU: Only a few errors may be accounted to the optical transceivers when tested with neutrons up to 1011 n/cm2 LECC 2005, Heidelberg

  10. SRAM-based FPGA Tests • Earlier tests show that the required TID values are tolerated • Many experiences show that SRAM-based devices are sensitive to SEU effects Two SRAM-based FPGA devices have been tested • Altera APEX-E device (EP20K60E, used on SIU prototypes) was tested with p and n in 2003 • Embedded memory test • Logic cell test • Xilinx Virtex II device was tested with p in 2004 • Logic cell test Special test firmware and software has been developed to capture SEU induced bit errors and configuration loss LECC 2005, Heidelberg

  11. Results of the FPGA Tests Altera APEX-E test results Xilinx Virtex II test results LECC 2005, Heidelberg

  12. Consequences Prototype DDL cards • FPGA: Altera APEX-E (EP20K60E, 160 kgates - 0.18 m) • Amongst all consequences of radiation, one is really problematic:the loss (or corruption) of the device configuration (= configuration cell changes its state due to high-energy particle interacting with the device) • Radiation tests have shown that we should expect 1 loss of configuration in 1 of the 400 DDL SIUs every hour New DDL card is needed • 4 different solutions have been discussed (Altera Cyclon, Xilinx Virtex, Actel ProASIC+, Custom ASIC) • The one based on Actel ProASIC+ has been selected • 0.22 m flash-based CMOS process LECC 2005, Heidelberg

  13. Actel ProASIC+ Bright side • Irradiation tests are encouraging • Capacity: no problem to fit the DDL SIU in. (PQFP 208 pins 75k to 1Mgates) • Lower power consumption • Instant-on device (no configuration at power-on) • No external device needed for storing the configuration Not so bright… • Lot of design work was needed because of different architecture • Learn the peculiarities of the Actel software tools • Timing-critical modules to be re-engineered (framing/de-framing @ 110 MHz) • Less internal resources (e.g. high-speed global network) • Less complex logic elements • Special voltage (+16 V and -13.8 V) required to reload configuration • remote configuration is not supported LECC 2005, Heidelberg

  14. Radtol SIU Block Diagram Xtal IDprom FEE interface Optical interface Data path(32 bits)+ control Data path(2x16 bits)+ control RXCLK TXCLK RXCLK TXCLK Data path (Serial) ActelAPA150 TITLK2501 AgilentHFBR-5720L 106.25 MHz +3.3V LVTTL 50 MHz +3.3V LVTTL 2125 Mbps LVPECL 2125 MBd 850 nm optical 2.5V 2.5V Powermonitor +3.3V • Notes: • PCB design is compatible for APA150 (ProASIC+) and A3P250 (ProASIC3) devices • Four prototype boards have been manufactured LECC 2005, Heidelberg

  15. Radtol SIU Firmware ACTEL APA 150 version • Modules have been ported from the ALTERA DDL firmware • Timing critical modules have been reengineered and optimized • Complete firmware is being simulated and then tested on real hardware • DDL transactions are being tested using the RORC utilities(both in CERN and in RMKI-KFKI, Budapest) • Long term tests are being executed using DATE LECC 2005, Heidelberg

  16. Actel ProASIC+ Test Results (1/2) May 2004, TSL, Uppsala, Sweden • Tests were done using the evaluation board (APA075) • Proton beam @ 171, 94 and 48 MeV • No configuration loss June 2004, ATOMKI, Debrecen, Hungary • Tests were done using the evaluation board (APA075) • TID tests with Co60, dose rate of approx. 20 krad/h • No problem up to 12 krad, when the device stopped functioning • After 1 hour at room temperature the device started to work (annealing) March 2005, ATOMKI, Debrecen, Hungary • Tests were done using both the evaluation board and the new SIU (APA150) • Neutron beam with the energy < 15 MeV • No errors have been detected on the evaluation board (5*1010 n/cm2) • One error on the SIU provoked link down after the equivalent of 5 yrs(1011 n/cm2). It could be fixed by cycling the power of the card LECC 2005, Heidelberg

  17. Actel ProASIC+ Test Results (2/2) May 2005, ATOMKI, Debrecen, Hungary, Neutron beam with the energy < 15 MeV • Tests were done using the new SIU; short data block were circulated through the loop-back implemented in the SIU firmware • Neutron beam with the energy < 15 MeV • Few errors have been detected; during initialization the SIU stuck in power-on reset state (link initialization error has been fixed remotely) May 2005, TSL, Uppsala, Sweden, Neutron beam with energy 95 MeV • Combined test of the TPC Readout Electronics (FECs + RCU) and the new SIU performed by the TPC group • SIU contribution to transmission errors: 0 (preliminary) June 2005, ATOMKI, Debrecen, Hungary, Neutron beam with the energy < 15 MeV • Tests were done using the new SIU; long data block were received from FEE emulator and send to DIU and RORC • Data errors have been detected; tests have shown that we should expect 1 bit error every 4 hour in the DAQ system containing 400 DDL SIUs LECC 2005, Heidelberg

  18. Project Status • Prototype boards have been manufactured • Firmware is extensively tested using the RORC utilities(both in CERN and in RMKI-KFKI, Budapest) • Long term tests are being executed using DATE • Many radiation tolerance test have been made, results are promising • Production Readiness Review (PRR) successfully held in June • Tests recommended by the PRR referees has been started • ACTEL released the ProASIC3 device, test board ordered • Everything is prepared for series production LECC 2005, Heidelberg

  19. The Future • Actel ProASIC3 (3rd generation) • Pin compatible with existing ProASIC+ devices • Higher performance, lower power consumption • Improved global network supporting up to 18 global signals • We continue the radiation tolerant tests • To find out the reason of data errors • SEU produced in memory or register cells? • Special test firmware developed • Develop error correcting firmware • We continue tests recommended by the PRR referees • 12 DDLs for TPC tests at Point 2 will be available in October LECC 2005, Heidelberg

  20. Thank you!

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