1 / 15

Work at OIF on Interfaces for Optical Modules including Very Short Reach (VSR) and Electrical Interfaces

Work at OIF on Interfaces for Optical Modules including Very Short Reach (VSR) and Electrical Interfaces . Raj Savara Network Elements Inc. Explosive growth in the demand for bandwidth is fuelling the development of optical networks

stormy
Télécharger la présentation

Work at OIF on Interfaces for Optical Modules including Very Short Reach (VSR) and Electrical Interfaces

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Work at OIF on Interfaces for Optical Modules including Very Short Reach (VSR) and Electrical Interfaces Raj Savara Network Elements Inc.

  2. Explosive growth in the demand for bandwidth is fuelling the development of optical networks Optical Networking has increased the number of NE in a carrier’s central office and the related NE –NE interconnecting Cost OIF recognized this and started a project on lowering the cost of these very short reach interfaces (<2Km) OIF has announced 4 VSR Implementation Agreements to address Low cost intra office interconnect applications Why VSR Interfaces?

  3. Very Short Reach (VSR) interfaces Vendor Specific Standards Interface Vendor Specific VSR VSR IP PXC/EXC VSR VSR VSR ADM VSR DWDM Transponders Transponders DWDM VSR VSR VSR ATM VSR • Standard SONET frame format • Promotes multiple vendors • Promotes interoperability • Reach 2m to 2km • Multiple client signals • Low cost

  4. VSR Reference Application Models Reference Application 2: 2m to 300m, with 0-2 patch panels Reference Application 1: 2m to between 50m and 100m direct connection Reference Application 3: 2m to 600m, with 0-2 patch panels Reference Application 4: 2m to 600m, one PXC, and 0-4 junction boxes

  5. Interface Definition for VSR-1 Implementation Agreement (IA) 16:12 SERDES chip 12:16 SERDES chip OC-192 FRAMER OC-192 FRAMER VCSEL Laser Array PIN PD Array • VSR-1 : 12 Fiber optical Link running at 1.25Gb/s between two Network Elements. • 10 fibers carry the data • 1 carries CRC error correction information • 1 fiber carries parity of the 10 data fibers • This enables hitless correction of errors on any single fiber, including the loss of a fiber. • Fiber Type : 400KHz, MM Fiber • Reach: 300m • Laser: 850nmVCSEL • Field termination is supported • link electronics automatically compensate for ribbon orientation. VSR-1 Satisfies Reference Application Model 1 and 2

  6. Interface Definition for VSR-2/5 IA 16:1 SERDES chip 1 :16 SERDES chip OC-192 FRAMER OC-192 FRAMER FP Laser PIN • VSR-2/5: 1310 nm serial OC-192 SMF VSR optical link between two network elements. • 1 Single Mode Fiber • Based on G.693, ITU Specifications • Fiber Type : G.652, SM Fiber • Reach: 600m • Link budget: 6dB VSR-2, 11dB VSR-5 • Laser: un-cooled 1310nm , FP • Field termination is supported VSR-2/5 Satisfies Reference Application Model 1 ,2 and 3

  7. Interface Definition for VSR- 3 IA 16:4 SERDES chip 4:16 SERDES chip OC-192 FRAMER OC-192 FRAMER VCSEL Laser Array PIN PD array • VSR-3 : 4 Fiber optical Link running at 1.25Gb/s between two Network Elements. • 4 fibers each carry the 2,5Gb/s data • Fiber Type : 500KHz, MM Fiber • Reach: 600m • Laser: 850nmVCSEL • Field termination is supported VSR-3 Satisfies Reference Application Model 1 and 2

  8. Interface Definition for VSR-4 IA 16:1 SERDES chip 1 :16 SERDES chip OC-192 FRAMER OC-192 FRAMER VCSEL Laser PIN VSR-4: 850 nm serial SMF VSR optical link (VSR-4) between two network elements. 1 Multi Mode Fiber Reach: 85m using 500MHz.km 50 mm fiber, 300m using 2000 MHz.km 50 mm fiber Laser: 850nm VCSEL Field termination is supported VSR-4 Satisfies Reference Application Model 1 and 2

  9. Explosive growth of 10Gb/s systems required a common interface to connect stream data from Chip to Chip, and Chip to Modules. SFI-4 SerDes Framer Interface is used for SONET, Forward Error Correction, and IEEE802.3ae (XSBI). SFI-4 phase 2 is a 4 lane interface with 64/66 encoding. Each lane does not require any clock, or alignment to adjacent lanes. CEI is a 10Gbps serial interface in development at OIF. Two speeds 10Gbps and 6Gbps. Lower speed for Fibre channel and backplanes. Higher speeds for XFI interfaces and backplanes. Two Distances for XFI and backplane applications. Why SFI Interfaces?

  10. OIF Electrical Interfaces • This interface is Demonstrated here at the OIF booth. • FEC chips also use SFI4 phase 1. This would be a block between the Framer and the 300 pin MSA module. Network Elements 300pin MSA transponder Framer or PHY MAC SFI-4 Phase 1 SPI-4 Phase 1/2 VSR-2/5

  11. OIF Electrical Interfaces • SFI4 Phase 1 • 16 bit LVDS with clock bi-directional • Used on all 300 pin MSA modules • Used on 200 pin MSA modules • See live demo of modules with this interface at SFI4 demo table.

  12. OIF Electrical Interfaces • SFI4 Phase 2 • 4 lane self clocking with de-skew, 64/66 encoding, and bi-directional. • Used for XenPak, X2, & XPAK modules with 70 pin connectors. XENPAK: 6.7 in2 / 4400 mm2 1.4 x 4.8 x 0.7 in 36 x 121 x 17mm X2: 5.2 in2 / 3400 mm2 1.4 x 3.7 x 0.5 in 36 x 95 x 11mm XPAK: 4.3 in2 / 2800 mm2 1.4 x 3.1 x 0.4 in 36 x 79 x 10mm

  13. OIF Electrical Interfaces • CEI 10Gbps serial interface (In work at OIF) • Single lane interface for Framer, backplane interconnect, self clocking, and bi-directional. • Used on all XFP modules with 30 pin connectors. • Capable of 1m and two connectors over FR4 for backplane applications. XFP: 2.1 in2 / 1400 mm2 0.7 x 3.0 x 0.3 in 18 x 78 x 9 mm

  14. NEI Modules using OIF interfaces MSA300: 6.6 in2 / 4100 mm2 2.2 x 3.0 x 0.5 in 56 x 74 x 14 mm XENPAK: 6.7 in2 / 4400 mm2 1.4 x 4.8 x 0.7 in 36 x 121 x 17mm X2: 5.2 in2 / 3400 mm2 1.4 x 3.7 x 0.5 in 36 x 95 x 11mm MSA200: 5.1 in2 / 3200 mm2 1.7 x 3.0 x 0.6 in 42 x 75 x 16 mm XPAK: 4.3 in2 / 2800 mm2 1.4 x 3.1 x 0.4 in 36 x 79 x 10mm XFP: 2.1 in2 / 1400 mm2 0.7 x 3.0 x 0.3 in 18 x 78 x 9 mm

  15. OIF Interfaces for Modules • OIF creates high speed electrical interfaces for true interoperability between component suppliers. • OIF’s Live demonstration proves Implementation agreements WORK! • OIF is paving the way for next generation interfaces such as CEI.

More Related