Enabling High-Speed, Low-Power Connectivity with Dual-Band Wi-Fi 6 and Bluetooth SoCs

1. Enabling High-Speed, Low-Power Connectivity with Dual-Band Wi-Fi 6 and Bluetooth SoCs The rapid expansion of connected devices across consumer electronics, smart homes, and IoT ecosystems has created a growing demand for faster, more reliable, and power-efficient wireless solutions. Modern applications no longer rely on basic connectivity alone—they require high throughput, low latency, seamless coexistence, and compact integration. To meet these evolving requirements, dual-band Wi-Fi 6 + Bluetooth System-on-Chips (SoCs) are emerging as a critical technology enabler. These advanced SoCs integrate high-performance wireless capabilities into a single silicon platform, enabling device manufacturers to build scalable and future-ready products. At T2M Semi, our next-generation wireless SoCs are engineered to deliver robust connectivity while optimizing power consumption and system efficiency. The Shift Toward Integrated Wireless Platforms

2. Traditional wireless designs often relied on separate Wi-Fi and Bluetooth chips, increasing system complexity, cost, and power usage. As device form factors shrink and performance expectations rise, this approach is no longer sustainable. Integrated Wi-Fi 6 + Bluetooth SoCs address these challenges by combining multiple radios into a single, optimized solution. This integration offers key advantages: ● Reduced BOM and PCB footprint ● Improved RF coexistence ● Lower power consumption ● Simplified system design and certification T2M Semi’s solutions are designed with these goals in mind, enabling faster development cycles and reliable product performance. Dual-Band Wi-Fi 6: Designed for High-Density Environments Wi-Fi 6 (802.11ax) was developed to handle the increasing number of connected devices per network. Unlike earlier Wi-Fi standards, it focuses on efficiency and consistency, especially in dense usage scenarios.

3. Dual-Band Operation (2.4 GHz + 5 GHz) T2M Semi’s SoCs support dual-band connectivity, allowing devices to operate across both 2.4 GHz and 5 GHz bands. This flexibility enables: ● Improved coverage and range ● Higher data rates where needed ● Reduced congestion and interference Dual Band Dual Concurrent (DBDC) With DBDC capability, devices can transmit and receive data on both bands simultaneously. This ensures: ● Higher aggregate throughput ● Better load balancing ● Reliable performance for bandwidth-intensive applications 2×2 MU-MIMO Support Support for 2×2 MU-MIMO enables simultaneous communication with multiple clients, significantly improving network efficiency and reducing latency. This is particularly valuable for multimedia devices and shared network environments. Integrated Bluetooth with Advanced Low-Energy Features Bluetooth connectivity plays a crucial role in modern devices, supporting peripherals, audio streaming, and control interfaces. T2M Semi’s SoCs integrate Bluetooth with Low Energy (BLE) capabilities, ensuring reliable short-range communication with minimal power usage. Key Bluetooth Benefits ● Support for BLE Audio for next-generation wireless audio ● Energy-efficient operation for battery-powered devices

4. ● Stable connectivity for accessories and smart sensors ● Optimized coexistence with Wi-Fi radios By integrating Bluetooth directly into the SoC, manufacturers can reduce design complexity while improving overall system reliability. Power Efficiency at the Core Power consumption is a critical design consideration across consumer and IoT devices. T2M Semi’s wireless SoCs are built on low-power RF design principles, ensuring efficient operation across various use cases. Power optimization features include: ● Intelligent power management across subsystems ● Advanced sleep and standby modes ● Optimized RF front-end design These capabilities enable longer battery life and reduced thermal stress, making the SoCs suitable for compact and always-connected devices. RISC-V Architecture for Flexibility and Innovation T2M Semi leverages RISC-V architecture to provide a flexible and scalable computing foundation. As an open instruction set architecture, RISC-V enables: ● Customization for application-specific needs ● Long-term scalability and ecosystem support ● Efficient performance-per-watt ● Greater control over system design This approach allows device makers to innovate faster and adapt their products to evolving market requirements.

5. Optimized for a Wide Range of Applications T2M Semi’s dual-band Wi-Fi 6 + Bluetooth SoCs are designed to support diverse application segments: Smart TVs and Set-Top Boxes High-throughput Wi-Fi and DBDC enable smooth video streaming, fast content delivery, and reliable connectivity in crowded home networks. Tablets and Portable Electronics Compact integration and low-power operation make these SoCs ideal for portable devices requiring consistent wireless performance. IoT Gateways and Smart Home Devices Dual-band Wi-Fi, BLE support, and robust coexistence ensure reliable communication across multiple connected endpoints. Embedded and Compact Smart Devices Space-constrained designs benefit from reduced component count and efficient power usage without sacrificing performance. Ensuring Reliable Coexistence Operating Wi-Fi and Bluetooth simultaneously can lead to interference if not properly managed. T2M Semi’s SoCs include advanced coexistence mechanisms that coordinate radio activity to ensure stable operation. This results in: ● Reduced packet collisions ● Improved throughput consistency ● Enhanced user experience across wireless interfaces Building the Future of Connected Devices

6. As connectivity standards continue to advance, manufacturers need wireless platforms that deliver performance, efficiency, and scalability. T2M Semi’s dual-band Wi-Fi 6 + Bluetooth SoCs provide a strong foundation for next-generation products by combining advanced wireless technologies with flexible system architecture. By focusing on integration, power efficiency, and robust performance, T2M Semi enables customers to create innovative connected devices that meet today’s demands and tomorrow’s expectations. Conclusion The future of connectivity lies in highly integrated, power-efficient wireless solutions. Dual-band Wi-Fi 6 + Bluetooth SoCs from T2M Semi empower device manufacturers to deliver faster speeds, improved reliability, and streamlined designs across a wide range of applications. T2M Semi continues to drive innovation in wireless connectivity—enabling smarter, more efficient, and more connected devices. Contact Us T2M Technology India Private Limited Address: 4th Floor, C-56/30, C Block, Phase 2, Industrial Area, Sector 62, Noida, Uttar Pradesh 201301 https://maps.app.goo.gl/yoPWxLkmAysKCEor7 Contact Number: +919923060006 Email ID: contact@t2m-semi.com Website: https://t2m-semi.com