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EC-Design Review

EC-Design Review. EC-HV Board. The EC-HV Board. First Design : Single-Layer PCB, 1,5mm FR4. The EC-HV Board. Second Design: Single-Layer PCB, 1,5mm FR4. IPE - Experience. Balloon -Experiments Atmospheric m easurements with MIPAS, developed @ KIT

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EC-Design Review

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  1. EC-Design Review EC-HV Board

  2. The EC-HV Board First Design: Single-Layer PCB, 1,5mm FR4 A. Ebersoldt

  3. The EC-HV Board Second Design: Single-Layer PCB, 1,5mm FR4 A. Ebersoldt

  4. IPE - Experience Balloon-Experiments Atmosphericmeasurementswith MIPAS, developed @ KIT - manyflightswith MIPAS flownby CNES also in Kiruna (same asmaidenflightfor EUSO-Balloon) - Flight altitudeupto 40km and 18 hours - @ IPE developedelectronics: instrumentcontrol, communication, power-management, thermal design, forballoonsandaircrafts Potting Use of 2 component silicon materials. Mass production @ IPE: Project Quench Detection (W7X, TOSKA, KATRIN, HZ-Berlin) Company-Connection: Coating & Potting: A. Ebersoldt

  5. IPE Test Facilities Climate chamber: Vibrating table: IPE assemblycenterfor PCB andmanymore: • Pick-and-Place machine • Flying-Prober • Camerainspectionsystems • Wirebonder • Clean room • Dry cabinets • Laser-Labeler • … • Laboratories: • Electronics • Mechanics • Optics • Hybrid-Technology A. Ebersoldt

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