1 / 18

Review of the EC-ASIC

Review of the EC-ASIC. S. Ahmad, P. Barrillon , S.Blin , D. Cuisy , S. Dagoret - Campagne , P. Dinaucourt , R. Sliwa , JL. Socha March 1 st 2012 - LAL. Outline. Specifications Asic description Constraints Interface with PDM board Planning Summary. The EC-ASIC board.

more
Télécharger la présentation

Review of the EC-ASIC

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Review of the EC-ASIC S. Ahmad, P. Barrillon, S.Blin, D. Cuisy, S. Dagoret-Campagne, P. Dinaucourt, R. Sliwa, JL. Socha March 1st 2012 - LAL

  2. Outline • Specifications • Asic description • Constraints • Interface with PDM board • Planning • Summary

  3. The EC-ASIC board • Specifications: An ASIC is assigned to each MAPMT 36 ASICs have to be distributed on the boards of the EC-back electronic. They should also include the connectors toward the EC-anode and PDM boards as well as all the passive components needed. • The idea is to go for 6 boards perpendicular to the PDM mechanical structure. They would be fixed on a mechanical structure perpendicular to the one of the PDM • Each board would have 6 connectors (toward EC-anode boards) and 6 ASICs, many passive components and 1 connector toward PDM board. Volume for Electronics: EC_asic, HV box, PDM board Connector toward the PDM board As close as possible ASICs Rigid from EC-ANODE Connector PDM Frame With EC_front Flex from EC-ANODE MAPMT

  4. EC_asic design block 120 pins • 3 ASICs, with their associated passive components, on each side of the pcb • 6 connectors (68 pins: 64 anodes + 4 gnd) on one top side • 1 connector (120 pins) on top side ASIC A ASIC B ASIC C ASIC D ASIC E ASIC F A B C D E F 68 pins 68 pins 68 pins 68 pins 68 pins 68 pins

  5. The ASIC: SPACIROC (1/3) Spatial Photomultiplier Array Counting and Integrating ReadOutChip • Specifications: • Readout MAPMT signals • Consumption: 1mW/channel • Photon counting: 100% trigger efficiency@50fC (1/3pe, 106 Gain) • Charge/time converter input range : 2pc – 200pc (10pe - 1000pe) • Radiation hardness • 1st version received in October 2010 • Technology: AMS 0.35µm SiGe • Dimensions : 4.6mm x 4.1mm (19 mm²) • Power supply: 0-3V • Packaging : P(C)QFP240(160)

  6. The ASIC: SPACIROC (2/3) • 64 channels • Preamplifier with individual 8-bit gain adjustment • Photo-electron counting (10-bit DACs) • 3 discriminator outputs : Trig_PA, Trig_FSU & Trig_VFS • Multiplexed discriminator outputs to Digital part • Many parameters available • Charge to time converters (called KIs) • Designed in collaboration with JAXA/RIKEN • 9 outputs : 8 channels (8-pixel-Sum) + Last Dynode • Many parameters available • Continuous Data acquisition & Readout every 2.5 ms (GTU) • 8 identical digital module for PC • 1 digital module for KI • First version of SPACIROC showed good behavior (intensive lab tests with and without MAPMT)

  7. The ASIC: SPACIROC (3/3) • Package: CQFP 160pins by MATRA • Quantity: 100 • Cost: 105€/asic • Delay: • Package material : 2 weeks • 3 prototypes: 2 weeks • 100 asic: 2 weeks • One test board has been produced to sort asic • Cabling ok • Firmware is the same as the previous spaciroc test board • Software should be modified to perform automatic tests

  8. 68 pin-connectors constraints (1/3) 1 with a straight flexible part Connector on top • 2 types of pcbs are foreseen: • 1 with a curved flexible part • Connector on bottom

  9. 68 pin-connectors constraints (2/3) • Connectors choice: • EC_asic: HIROSE FX2CA-68S-1.27DSA • - Receptacle • - Straight type • - Dimension=49mm x 7.5mm • - Throughhole type • Not exactly the same pinout • => For EC_asic design, we need to know which connector corresponds to which type of EC_anode

  10. 68 pin-connectors constraints (3/2) Pmt 1 Pmt 2 • 3 EC_unit + 2 EC_ASIC boards • CurveEC_anode: connector A, C, E • StraigthEC_anode: connector B, D, F • One EC_asicreadshalf of the EC_unit F E D C A B A C D E F B Pmt 4 Pmt 3

  11. Asic: input routing constraints ki5 ki1 ki1 ki2 • Ki input: sum of 8 consecutive anodes ki6 ki2 ki3 ki4 Pmt 1 Pmt 2 F E D C A B A C D E F B ki4 ki3 ki2 ki6 ki2 ki1 ki1 ki5 • To check the routing feasibility: • Schematic simpler: • 2 connectors: curve kapton connector A and straight kapton connector B • 2 SPACIROC • Connector 120pins

  12. EC_asic schematic The ASIC: SPACIROC (2/3)

  13. EC_asic schematic

  14. Mechanical constraints • Material: Aluminum • Weight: 0.300 kg • Overall dimensions: 167mm x 128mm x 130mm • Available area for elect. : 115mm x 100mm 167 Pair of EC-ASIC boards 130 • Modifications: • Vertical red parts should be modified • Increase area for EC_ASIC boards • Support structures have to  be aligned with the holes  like the central one otherwise cables do not pass • Need room for the HV boards 128 ~ 55 mm • Need to study how to screw the boards: EC_asic, HV box and PDM board As short as possible

  15. EC_ASIC board • Dimension couldbe 140mm x 110mm

  16. Interface: EC_asic inputs/outputs • Connector 120 pins shouldbeenough • Choice: HIROSE FX2-120P-1.27DS • Header • Right angle type • Dimension=82mm x 7.5mm • What will be the connection between the EC_ASIC and the PDM board? • Kapton or cable ? • Who is in charge of this connection

  17. The planning • Week 9: 24 Jan-3 Feb • Feasibility routing inputs with 2 through hole connectors • Week 10: 5 -9 Mar • Feasibility routing inputs with 2 surface mounted connectors • Schematic of whole EC_asic • Week 11-14: 12 Mar- 6Apr • Routing whole EC_asic=> the dimensions will be set • Schematic of a test board (test_ec_asic) to check functionalities of one EC_ASIC • Week 15-16: Easter holidays • Week 17-21: 23 Apr- 25May • Routing test_ec_asic board • Production PCBs will be done when the money is available • Cabling and component procurement will be managed by us

  18. Summary • LAL team manage schematic, routing and production of EC_ASIC • To Be Defined: • Who can do the mechanical modifications? • Who is in charge of the connection between EC_ASIC and the PDM board (lack of manpower and time at LAL)?

More Related