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Examination of vibrated boards to identify solder cracks, mask lifting, and possible pad cratering. Includes SEM inspection and future X-ray analysis for further investigation and analysis.
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NASA/DoD Vibration Boards Nicholas Clore August 8, 2010 pDIP Failure Analysis
Vibrated Boards • Three pDIPs were sectioned out of vibrated boards for SEM inspection. • Solder was cracked at various leads, but was not conclusive for daisy chain failure. (Christian) • Mask lifting was investigated for possible mouse bites in traces SAIC – Vibration Board Component prepared for SEM Nihon Superior – Mechanical Shock Board SAIC – SEM Image of Vibration Board Component
Vibrated Boards • Lifted Mask
Vibrated Boards • Lifted Mask • Possible Pad Cratering • (cracked mask along traces)
Vibrated Boards • Lifted Mask • Solder along mask-less traces • Possible Pad Cratering
Vibrated Boards • Lifted Mask • Solder along mask-less traces • Possible Pad Cratering • Cracked traces
Virgin Boards • Solder along mask-less traces SAIC – USB Microscope, Virgin QFN with repair stencil SAIC – USB Microscope, Virgin pDIP SAIC – USB Microscope, Virgin QFP144
Future Work • X-ray analysis at crane for broken daisy chains • Cross sectioning of pDIPs to investigate pad cratering and “mouse bites.”