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ECE 477 Design Review Team 1 Fall 2011

ECE 477 Design Review Team 1 Fall 2011. Justin Huffaker, Aaron Garrett, Ryan Hannah, Brendon McCool. Outline. Project overview Project-specific success criteria Block diagram Component selection rationale Packaging design Schematic and theory of operation PCB layout

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ECE 477 Design Review Team 1 Fall 2011

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  1. ECE 477 Design Review Team 1 Fall 2011 Justin Huffaker, Aaron Garrett, Ryan Hannah, Brendon McCool.

  2. Outline • Project overview • Project-specific success criteria • Block diagram • Component selection rationale • Packaging design • Schematic and theory of operation • PCB layout • Software design/development status • Project completion timeline • Questions / discussion

  3. Project Overview Our project, code named Virtual Imaging Peripheral for Enhanced Reality or VIPER, is an augmented/virtual reality system. It will track a user’s head location and perspective and use this information to find the location of a camera position in a virtual environment. With a pair of video glasses the user would then see the virtual environment at the cameras location. As the user moves around a table top sized environment their actual and virtual perspective changes, allowing them different viewing angles of the virtual space.

  4. Project-Specific Success Criteria • An ability to communicate time stamp data using RF between the base unit and head unit. • An ability to display images to the video glasses. • An ability to estimate the angle and position of a user’s head with respect to an origin point unit using accelerometer, gyroscope, compass, visual data, and ultrasonic data. • An ability to find angle displacement of head relative to IR beacon origin using glasses mounted camera. • An ability to find distance from base to head unit using ultrasonic emitter and receiver.

  5. Block Diagram

  6. Component Selection Rationale • Implementing a Kalman Filter • Requires interfacing with • Accelerometer • Gyroscope • Magnetometer • Camera Process Module • Ultrasonic Module

  7. Component Selection Rationale • General Sensor Requirements • Small size • Resolution in expected data range • Low cost • Fast/simple communication protocol • Fast sample data rate • 3-axis (or two cheaper 2-axis sensors) • 3.3 Volts

  8. Component Selection Rationale • Accelerometer • Specific Requirements • Data range ± 2g • Greater than 160 Hz data rate • MMA8452Q • 3-axis • 12bit ±2g, ->0.488mg sensitivity • I2C interface 1.5 to 800 Hz data rate • 1.95 V to 3.6 V supply voltage

  9. Component Selection Rationale • Gyroscope • Specific Requirements • Track ± 200 °/sec • Greater than 80 Hz data rate • ITG-3200 • 3 axis • 16-bit ±2000°/sec, -> 0.0305176 °/sec resolution • I2C interface • 3.9 – 8000 samples/sec • 2.1 V to 3.6 V supply voltage

  10. Component Selection Rationale • Magnetometer • Specific Requirements • 25–65 μT (average magnetic field due to Earth’s Magnetic Poles) • Greater than 40 Hz data rate • MAG3110 • 3 axis • ±1000 μT range • 0.10 μT sensitivity • I2C interface • Output data rate up to 80 Hz • 1.95 V to 3.6 V supply voltage

  11. Component Selection Rationale • Head Unit • Camera • Specific Requirements • At least 126x96 pixels • 40 fps • Common Camera interface • TCM8230MD • Max 30 fps • 660x492 pixels • Camera Visual Processer Chip • Specific Requirements • 40 Hz camera data processing rate • At least 12 Kbytes flash • AT91SAM9XE256 • 256 Kbytes flash • Dedicated camera peripheral • 180Mhz clock

  12. Component Selection Rationale • Head Unit • Microcontroller requirements • Large number of interfacing peripherals • 1 I2C • 2 UART • 1 SPI • 1 USB slave • 1 ATD • ATD response rate of at least 8.5 KHz • PIC32MX534F064 • Cheap • 80 MHz frequency • All required Interfaces and enough pins to pin them out

  13. Component Selection Rationale • Table Unit • Microcontroller requirements • 40 KHz PWM output for Ultrasonic • PWM for IR LED • UART for Xbee • PIC24FJ16GA002 • 32 MHz • 2 PWMs • UART • 3 to 3.6 V operating voltage

  14. Component Selection Rationale • Microprocessor/Motherboard • Required Specifications • Estimate position and orientation using Kalman Filter • OpenGL for graphics • BeagleBoard-XM • 1 GHz ARM Cortex-8TM • Composite and DVI out • 3D graphics accelerator and OpenGL support • Small footprint • Supports I2C and RS-232 • 5 V input voltage • Floating point hardware

  15. Project Packaging Specifications • Our project will have three main packaging componets: • 1. The “head unit” will contain the sensors, IR camera, microcontrollers, ultrasonic receiver, and Xbee module • 2. The “beacon unit” will contain the IR LED, a microcontroller, an ultrasonic emitter array, and the other Xbee module • 3. The “Beagleboard” will contain just the microprocessor and battery

  16. Project Packaging Constraints • Head unit: must be lightweight and bring as little discomfort to the user as possible • Beacon unit: must be portable, only enough to move from tabletop to tabletop during non-use; will be stationary during use • Beagleboard: must be lightweight enough to be attached to the user without being cumbersome

  17. Packaging Dimensions • 208 pins, 31.2mmx31.2mm, QFP;AT91SAM9XE256 • 28pins, 8.20mmx10.5mm, SSOP;PIC24FJ6GA002 • 64 pins,12mmx12mm,TQFP;PIC32MX534F06H • 7.62mm height by 11 mm diameter;40TR12B-R • 6mmx6mmx4.5mm; TCM8230MD • 24.38mmx32.94mmx8.12mm, WRL-08664 • 4mmx4mmx0.9mm,QFN(chip);17.78mmx13.97(breakout);ITG-3200 • 3mmx3mmx1mm,QFN(chip);17.78mmx13.97(breakout); MMA8452Q • 13.3mmx14.5mm(breakout); MAG3110 • 82.55mmx82.55mm; 296-25798-ND • Estimated head unit package: 100mmx121mmx20mm • Estimated beacon unit package:54mmx100mmx20mm • Estimated Beagleboard package: 130mmx100mmx20mm

  18. Packaging Illustration: Head Unit

  19. Packaging Illustration: Beacon Unit

  20. Packaging Illustration: Beagleboard Front View Back View

  21. Head Unit USB Arbiter - Schematic

  22. Head Unit USB Arbiter - Schematic Pinned Out Optional Inputs RS-232 Xbee Sensors Ultrasonic Input PIC32MX534F064H USB 3.3V Regulator RJ-11 IC BP Filter 5V Input

  23. Head Unit USB Arbiter - Schematic 3.3V 5V Power Jack LM3671 USB Switch

  24. Head Unit USB Arbiter - Schematic Reset RJ-11

  25. Head Unit USB Arbiter - Schematic USB micro-b 8 MHz crystal

  26. Head Unit USB Arbiter - Schematic ITG-3200 Bulk Cap Xbee SPI to Atmel MMA8452Q MAG3110

  27. Head Unit USB Arbiter - Schematic Signals From Micro DB-9

  28. Head Unit USB Arbiter - Schematic Input Output GND 3.3V

  29. Camera Module - Schematic

  30. Camera Module - Schematic Buck Voltage Regulators TCM8230MD (Camera) Microcontroller JTAG Programmer

  31. Camera Module - Schematic

  32. Camera Module - Schematic 2.8V(3.3V?) and 1.5V Interfacing to image sensor interface peripheral

  33. Camera Module - Schematic

  34. Camera Module - Schematic 2.8 V 1.8V 1.5V

  35. Camera Module - Schematic 2.8 V 1.8V 1.5V PCB Test Points

  36. Camera Module - Schematic

  37. Camera Module - Schematic Decoupling and Bulk Capacitors Reset Pushbutton Slow Crystal (Start up, USB, etc.)

  38. Camera Module - Schematic

  39. Camera Module - Schematic PLL Loop Back Filter Main Crystal (Actual Execution)

  40. Theory of Operation – TCM8230MD(Camera)

  41. Theory of Operation – TCM8230MD(Camera) Indicates that a new frame is ready

  42. Theory of Operation – TCM8230MD(Camera) Indicates that a new scanline is ready Indicates that a new frame is ready

  43. Theory of Operation – TCM8230MD(Camera) Indicates that a new scanline is ready Indicates that a new frame is ready Valid data on parallel port

  44. Theory of Operation – TCM8230MD(Camera) Indicates that a new scanline is ready Indicates that a new frame is ready This is handled by the Image Sensor Interface peripheral Valid data on parallel port

  45. Beacon Board Functionality • Transmit Ultrasonic Pulses to Head unit • Transmit Timestamps via Xbee module • Control IR LED via PWM

  46. Optical Isolator Amplifier PIC24FJ16GA002 XBee Module Headers for ultrasonic transmitters (4) Headers for IR LED RJ-11 External Power Supply (12V) SMPS Buck Converter (12-3.3V)

  47. External Power Supply (12V) AP1509 CIN Bulk Capacitor COUT

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