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Flexible Hybrid Electronic Systems

Flexible Hybrid Electronic Systems. Ananth Dodabalapur. The University of Texas at Austin. Case I Electronic Paper. Original Proposal (with organic transistor backplanes) 1996 (Bell Labs) First demonstration 2000/2001(Lucent/E-Ink) Commercial prototypes Mid 2000.

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Flexible Hybrid Electronic Systems

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  1. Flexible Hybrid Electronic Systems Ananth Dodabalapur The University of Texas at Austin

  2. Case I Electronic Paper • Original Proposal (with organic transistor backplanes) • 1996 (Bell Labs) • First demonstration • 2000/2001(Lucent/E-Ink) • Commercial prototypes • Mid 2000

  3. Case II - OFET based RFID • First proposal (organic FET based RFID • 1995 (Philips) • Working prototypes • 2005 to 2008 • Commercial production • Beyond 2010

  4. Hybrid Flexible System Design • Communication • Wireless, wired • Circuit design • Semiconductor technology • Lumped silicon • Thin film semiconductors • Materials • Insulators, conductors • Other components and devices • Sensors, Actuators, display elements, etc.. • Fabrication • Roll-to-roll (RTR) or other

  5. Thin-Film Semiconductors • Organic and Polymer • Easiest to print • Proven compatibility with R2R • Mobilities limited to near 1 cm2/V-s* • Carbon Nanotube films • Can possess higher mobilities (near 80 cm2/V-s) for L = 100 micron devices (Rogers et al., Nature 2008) • Issues of metallic nanotubes • Separation of semiconducting nanotubes yielded 0.5-0.6 cm2/V-s. (Bao et al, Science 2008) • Inorganic Semiconductors/Nanowires • High mobilities with Indium oxide (Marks et al., Nature Materials 2006)

  6. Mobilities of organic FETs (Single Crystal, Thin-film small molecule, and polymer) – Complied from various data

  7. In2O3 FETs (Marks et al., Northwestern) Ion assisted deposition Mobility > 120 cm2/V-s Room temperature process

  8. Fabrication methods for Flexible Electronics • Ink-jet printing • Gravure • Flexo • Screen Printing • Nano-imprinting • Laser-based approaches • Photolithography for R2R

  9. Technical Themes for the Study • Circuit and system design • Device physics • Inorganic and organic semiconductor materials for transistors • Dielectrics and conductors • Functional devices and materials (for sensors etc) • Fabrication processes

  10. Tasks

  11. Timetable • Nov. 08 Kick Off meeting (All panelists meet with sponsors and WTEC staff at NSF) • Jan. 09 Baseline workshop at NSF (optional--this surveys US research in the field) • Feb. 09 Site visits in Asia • Mar. 09 Site visits in Europe (optional) • Apr. 09 Final Workshop at NSF • July 09 Draft Final Report goal

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