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SEMICONDUCTOR DEVICE FABRICATION

SEMICONDUCTOR DEVICE FABRICATION. AN OVERVIEW Presented to EE 1001 11 October 2012 by Stan Burns sburns@d.umn.edu MWAH 153. OUTLINE. What is a Monolithic Integrated Circuit (IC)? Dimensions State-of-the-art in size and density Materials Basic process sequence Photolithography

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SEMICONDUCTOR DEVICE FABRICATION

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  1. SEMICONDUCTOR DEVICE FABRICATION AN OVERVIEW Presented to EE 1001 11 October 2012 by Stan Burns sburns@d.umn.edu MWAH 153

  2. OUTLINE • What is a Monolithic Integrated Circuit (IC)? • Dimensions • State-of-the-art in size and density • Materials • Basic process sequence • Photolithography • Define some key terms • Typical Device Cross-Sections • Packaging • Challenges and Opportunities in the Semiconductor Industry For EE Graduates

  3. DIMENSIONS AND UNITS • 1 micrometer (1 mm) = 10-6m = 10-4cm • 1 Å = 10-10m = 10-8cm (Å =Angstrom) • 10,000 Å = 1 mm = 1000 nm • 1 nanometer (1 nm) = 10-9 m = 10 Å • Wavelength of visible light 0.4 mm(violet) to 0.7 mm(red) {400 nm to 700 nm, 4,000 Å to 7,000 Å } • 1 mil = 0.001 inch = 25.4 mm • Sheet of notebook paper about 4 mils • 1 human hair = 75 mm to 100 mm = 75,000-100,000 nm • Atomic spacing in a crystal ~ 3 to 5 Å • Fingernail growth rate about 1-3 mm/hour (Not personally verified) • Aggressive production minimum feature sizes ~0.022 to 0.12 mm • i.e. tens of nm • Research and some prototypes< 0.022 mm = < 22 nm

  4. Integrated Circuit Overview

  5. Stanley G. Burns UMD-ECE

  6. <$50

  7. OTHER DEVICES AND TECHNOLOGIES • Thin-Film Transistors (TFT) • Displays-Liquid Crystal Displays (LCD), Plasma, LED Backlit, etc. • Photonic-Light Emitting Diodes (LED), Organic Light Emitting Diodes (OLED), LASERS, Optical Chips, etc.) • Photovoltaics-Conventional Crystalline and Flexible Thin-Film • Devices and Systems on Flexible Substrates • Micro-Electro-Mechanical Systems (MEMS) integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. Electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes) • Micromechanical components are fabricated using compatible "micromachining" processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices.

  8. BASIC PROCESSING STEPSDesign ThenRepeated Application Of: Oxidation Nitridation Photolithography Wet Etching (Chemical) Dry Etching (Plasma) Diffusion Evaporation Sputtering Plasma Assisted Deposition Ion Implantation Epitaxy Many Processing Steps are at temperatures to 1200°C

  9. Design devices Design circuits and systems Device modeling System design and fabrication Circuit/system simulations Testability Materials How small? Nanomaterials? How large? Speed and performance, for analog, digital and mixed-mode applications Increased functionality Biological integration Optoelectronic integration Displays Sensors MEMs (Design/Application) Non-traditional substrates Packaging Process development Process Control “Tool” and plant design Cradle to grave materials handling EE Student Challenges in the Semiconductor Industry

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