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Device Production Status in the Clean Room Until 12-06-12: LHCb and NA62 Designs

This report outlines the status of device production in the clean room, including SEM pictures, snake design, membrane thickness, surface polishing, and channel cracks. It covers issues with broken devices, oxide/nitride layers, de-bonding, and cleaning concerns.

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Device Production Status in the Clean Room Until 12-06-12: LHCb and NA62 Designs

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  1. STATUS IN THE CLEAN ROOM Device production Until 12-06-12

  2. LHCb – Snake design 525 um thick! SS polished

  3. SEM PICTURES LHCb– Snake design

  4. NA62 – Frame 2 Channels toodeep Oxide +Nitride.... 2 devicesgluedfromJerome 525 um thick! SS polished 20475 and 20477  broken!

  5. NA62 – Dual Banana Surface not clean…. CMP  cracks!! DRY ETCHING with 601 Starts to de-bond!!! SEM PICTURES before after Pool 380 um OK!! Dirty on the backside..

  6. NA62 – Dual Banana 044 SEM PICTURES Pool: Channels: KOH insidechannels:

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