Design for Testability Theory and Practice

1. Design for TestabilityTheory and Practice January 15 – 17, 2005 Day-1 AM Lecture 1

2. Design for Testability Theory and PracticeLecture 1: Introduction • VLSI realization process • Verification and test • Ideal and real tests • Costs of testing • Roles of testing • A modern VLSI device - system-on-a-chip • Three-day course outline Day-1 AM Lecture 1

3. VLSI Realization Process Customer’s need Determine requirements Write specifications Design synthesis and Verification Test development Fabrication Manufacturing test Chips to customer Day-1 AM Lecture 1

4. Definitions • Design synthesis: Given an I/O function, develop a procedure to manufacture a device using known materials and processes. • Verification: Predictive analysis to ensure that the synthesized design, when manufactured, will perform the given I/O function. • Test: A manufacturing step that ensures that the physical device, manufactured from the synthesized design, has no manufacturing defect. Day-1 AM Lecture 1

5. Verification Verifies correctness of design. Performed by simulation, hardware emulation, or formal methods. Performed once prior to manufacturing. Responsible for quality of design. Test Verifies correctness of manufactured hardware. Two-part process: 1. Test generation: software process executed once during design 2. Test application: electrical tests applied to hardware Test application performed on every manufactured device. Responsible for quality of devices. Verification vs. Test Day-1 AM Lecture 1

6. Problems of Ideal Tests • Ideal tests detect all defects produced in the manufacturing process. • Ideal tests pass all functionally good devices. • Very large numbers and varieties of possible defects need to be tested. • Difficult to generate tests for some real defects. Defect-oriented testing is an open problem. Day-1 AM Lecture 1

7. Real Tests • Based on analyzable fault models, which may not map on real defects. • Incomplete coverage of modeled faults due to high complexity. • Some good chips are rejected. The fraction (or percentage) of such chips is called the yield loss. • Some bad chips pass tests. The fraction (or percentage) of bad chips among all passing chips is called the defect level. Day-1 AM Lecture 1

8. Testing as Filter Process Mostly good chips Good chips Prob(pass test) = high Prob(good) = y Tested chips Fabricated chips Prob(pass test) = low Prob(fail test) = low Mostly bad chips Defective chips Prob(bad) = 1- y Prob(fail test) = high Day-1 AM Lecture 1

9. Costs of Testing • Design for testability (DFT) • Chip area overhead and yield reduction • Performance overhead • Software processes of test • Test generation and fault simulation • Test programming and debugging • Manufacturing test • Automatic test equipment (ATE) capital cost • Test center operational cost Day-1 AM Lecture 1

10. Present and Future* 2003 - 2006 1997 -2001 Feature size (micron) 0.25 - 0.15 0.13 - 0.10 Transistors/sq. cm 4 - 10M 18 - 39M Pin count 100 – 900 160 - 1475 Clock rate (MHz) 200 – 730 530 - 1100 Power (Watts) 1.2 – 61 2 - 96 * SIA Roadmap, IEEE Spectrum, July 1999 Day-1 AM Lecture 1

11. Design for Testability (DFT) DFT refers to hardware design styles or added hardware that reduces test generation complexity. Motivation: Test generation complexity increases exponentially with the size of the circuit. Example: Test hardware applies tests to blocks A and B and to internal bus; avoids test generation for combined A and B blocks. Int. bus Primary outputs (PO) Primary inputs (PI) Logic block A Logic block B Test input Test output Day-1 AM Lecture 1

12. Cost of Manufacturing Testing in 2000AD • 0.5-1.0GHz; analog instruments; 1,024 digital pins: ATE purchase price • = $1.2M + 1,024 x $3,000 = $4.272M • Running cost (five-year linear depreciation) • = Depreciation + Maintenance + Operation • = $0.854M + $0.085M + $0.5M • = $1.439M/year • Test cost (24 hour ATE operation) • = $1.439M/(365 x 24 x 3,600) • = 4.5 cents/second Day-1 AM Lecture 1

13. Roles of Testing • Detection: Determination whether or not the device under test (DUT) has some fault. • Diagnosis: Identification of a specific fault that is present on DUT. • Device characterization: Determination and correction of errors in design and/or test procedure. • Failure mode analysis (FMA): Determination of manufacturing process errors that may have caused defects on the DUT. Day-1 AM Lecture 1

14. A Modern VLSI DeviceSystem-on-a-chip (SOC) DSP core RAM ROM Transmission medium Data terminal Mixed- signal Codec Inter- face logic Day-1 AM Lecture 1

15. Course OutlinePart I: Introduction • Basic concepts and definitions • Yield and product quality • Fault modeling • Day 1 AM • Reference, Chapters 1 – 4: • M. L. Bushnell and V. D. Agrawal, Essentials of Electronic Testing for Digital, Memory and Mixed-Signal VLSI Circuits, Springer, 2000. • http://www.eng.auburn.edu/~vagrawal/BOOK/books.html Day-1 AM Lecture 1

16. Course Outline (Cont.)Part II: Test Methods • Logic and fault simulation • Testability measures • Combinational circuit ATPG • Sequential circuit ATPG • Memory test • Analog test • Day 1 PM and Day 2 AM • Reference, Chapters 5 – 11: • M. L. Bushnell and V. D. Agrawal, Essentials of Electronic Testing for Digital, Memory and Mixed-Signal VLSI Circuits, Springer, 2000. • http://www.eng.auburn.edu/~vagrawal/BOOK/books.html Day-1 AM Lecture 1

17. Course Outline (Cont.)Part III: DFT • Scan design • Built-in self-test (BIST) • Boundary scan and analog test bus • System diagnosis and core-based design • Day 2 PM • Reference, Chapters 14 – 18: • M. L. Bushnell and V. D. Agrawal, Essentials of Electronic Testing for Digital, Memory and Mixed-Signal VLSI Circuits, Springer, 2000. • http://www.eng.auburn.edu/~vagrawal/BOOK/books.html Day-1 AM Lecture 1

18. Course Outline (Cont.)Part IV: Advanced DFT • Test compression techniques • At-speed testing techniques for SoC • Signal integrity issues in test • Power issues in test • Day 3 – AM and PM Day-1 AM Lecture 1