ILD LoI (Calorimeter part)

1. ILD LoI (Calorimeter part) 2008/12/14 K. Kawagoe

2. Expected LOI contents:final wording of IDAG additional requests • Detector optimization: identification of the major parameters which drive the totaldetector cost and its sensitivity to variationsof these parameters. • Plans for getting the necessary R&D results totransform the design concept into a well-defined detector proposal. • Conceptual design and implementation ofthe support structures and the dead zones in the detector simulation. • Sensitivity of different detector components to machine background in the context of the beam parameter space considered in the RDR. • Calibration and alignment schemes. • Estimates of overall size, weight, andrequirements for crane coverage and shielding. • Push-pull ability with respect to technicalaspects (assembly areas needed, detector transport and connections, time scale) and maintaining the detector performance for a stable and time-efficient operation. • A statement about energy coverage,identifying the deterioration of theperformance at energies up to 1 TeVand the consequent detector upgrades.

3. Proposal of Jean-Claude, Based on a TOTAL of 12 pages • Introduction on PFA based calorimetry (1 page) • suppose the names of the mail are the good one (Kiyotomo, Felix, Imad and myself) • I would see here the R&D needed and the CALICE organization per project (who is doing what) and the expected test beam plan (Is it possible for you Felix,(as spokesperson of CALICE) to write a first draft of that part) • Mechanics (3 pages ) Resp: including (as Felix said), structure and specificity of each technology option • For ECAL Si and Scint. : Marc Anduze • For AHCAL : • For DHCAL : • VFE and FE (DIF) (1 page) Resp: • For ECAL (both Si and Scint., if Kiyotomo agrees) : Julien, Remi and Bart • For AHCAL : Ludovic and Mathias • For DHCAL : ??? (not Julie, since LAPP is not in ILD ) please Imad give us a name • DAQ (1 page) Resp Valeria (for LDA-ODR) , Vincent (for DHCAL) • TECHNOLOGY OPTIONS(1.5 page per option) • ECAL silicon – tungsten : Resp: Remi , Roman (1page, essentially on silicon wafers, long slab ASU) • ECAL scintillator – tungsten : Resp : Tohru, Kiyotomo, Satoru • HCAL sctinillator : Resp • DHCAL gas : Resp

4. Technology-specific sections, each with a different structure, example here for AHCALSi ECALSci ECALSci HCALactive layer overview, integration schemescintillators, photo-sensorsPCB integrationcalibration methods, calibration systemcabling, services and detector integrationtechnology-specific R&D issuesDHCALFE Electronicsto be worked out by JulienASICs, analogue, digital, trigger, power, packaging, testing, R&D Technology-specific sections (From Felix) Dear Jean-Claude, Kiyotomo, Imad, Technology-specific sections, each with a different structure, example here for AHCAL • Si ECAL • Sci ECAL • Sci HCAL • active layer overview, integration scheme • scintillators, photo-sensors • PCB integration • calibration methods, calibration system • cabling, services and detector integration • technology-specific R&D issues • DHCAL

5. Supplement: 担当 (2)　これまでの結果をふまえたR&Dの将来計画 (魚住がリスト案を作る) - MPPC - scintillator production - simulationの確立（データと合わせる） (4)　情報収集（竹下） (5)MIP calibration(信州)LED calibration(神戸) (8)ストリップクラスタリングについては小寺さん 　　そのうえで、これまでのR&Dで確立された点、有利な点などを強調するようにする。あとは、SiWやAHCALとの議論。こちらからコンタクトした方がよい。