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Report from Module Bonding Working Group

This report provides a global review of module bonding quality indicators, discusses open issues, and highlights selected findings from individual centers. It includes information on module pull test results and the arrangements for TEC module production in Italy.

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Report from Module Bonding Working Group

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  1. Report fromModule BondingWorking Group Salvatore Costa Università di Catania and INFN – Sezione di Catania

  2. Outline • Global review of Module bonding quality indicators • Open issues • Selected highlights from individual Center reports

  3. Global review of Module bonding qualitythat is,Module Pull Test results

  4. # Modules Pull Tested

  5. Mean pull forces

  6. Mean pull forces

  7. StDev/Mean of pull forces

  8. StDev/Mean of pull forces

  9. Open issues

  10. TEC Module Production in Italy Bonding Preparation

  11. Arrangements - 1 • INFN will produce only R3 and R4 modules • The total number of modules to be produced in Italy: 530 • Prod should start mid-Oct 2005 and end mid-Feb 2006 [unless incompatible with a delayed TIB/TID prod] • Assembly will be done in Bari [if in mid Oct there still is a small tail of TIB/TID assembly, this will shift entirely to Perugia] • Bonding and ARC Testing will be done in Bari, Catania, Padova and Pisa • No LT Test is to be done in Italy

  12. Arrangements - 2 • For Bonding and ARC Testing: • Hamburg will provide the 2 needed  jigs (1 for R3, 1 for R4) to each of the 4 participating Bonding centers. • Already now, TEC will send an existing jig plus 1 R3 module plus 1 R4 module plus the ARC connection card (or 2 cards if different for the 2 different module types) to Catania to check compatibility with the Bonding machine workholder and existing ARC test setup. • Salvatore will take care of sending these sample pieces around all other participating Bonding centers for the same purpose.

  13. Something is already going on • Received in Catania: • From Hamburg: Jig R1 (ready, temporarily not needed, identical mechanically to R3 e R4) • From Aachen: Modules TEC (faulty): R1S, R3, R4 • Waiting in Catania for: • From Antwerpen: Electrical I/F board to ARC-Test TEC modules • Bonding Jig already tried in Catania: • Compatible with just some mechanical work that can be done with no problem in Catania’s mechanical shop • Jig now passed on to Padova • for similar compatibility test

  14. And for ARC test? • Mechanical Compatibility with existing italian setups: • Dimension-wise, TEC module (on) carrier fits with no problem inside existing Italian sealed test boxes, but one would need to build a dedicated frame to hold the TEC carrier and properly hold the optical fibers bundle. • It has to be clarified whether the mechanics is to be entirely provided by TEC or to be adapted by the INFN centers to their existing setups.

  15. Selected highlights fromindividual Center Reports

  16. Center’s highlights • Aachen: L3 change: W. Braunschweig  Martin Weber • Catania: New (rented) Delvotec 6400 works very well: • 81 modules bonded - No machine failures, no dead channels, only 2 failures to stick (blamed on PA quality) out of ~60000 bonds. • Optimized parameters found - Pull forces now ~12g as other Delvotec 6400’s, up from ~10g [was up to ~16g with older 60-kHz Hughes 2470] • Padova: 30 TID R3 modules bonded - Variable PA quality observed: • adjustment of parameters required • lift-offs observed in pull tests • Visible repairs to APV-PA bonds • FNAL+UCSB: Rearranging equipment for higher throughput: • Exchanging machines so that in the end each has 2 K&S 8090’s (and FNAL also 1 8060). • More 8090’s available at FNAL because of D0 module bonding end. • A 8090 shipped from FNAL to UCSB will be setup soon. • Another 8090 at FNAL had a failure and created ~4 PHL/mod on 11 modules. Fixed by service tech. • 8060 previously used at UCSB for Hyb bonding has problems, will get service soon, then will be shipped to FNAL.

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