1 / 1

Electrical Engineering Department

Design of a Test System and Packaging of SOI-MEMS Resonators for High Temperature Characterization. Electrical Engineering Department Presenter: Robert MacKinnon Jr. Advisor: Professor Mustafa Guvench Coauthor: Joshua Ward. MEMS Test Setup : HP 54504A Digital Oscilloscope

zenia
Télécharger la présentation

Electrical Engineering Department

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Design of a Test System and Packaging of SOI-MEMS Resonators for High Temperature Characterization Electrical Engineering Department Presenter: Robert MacKinnon Jr.Advisor: Professor Mustafa Guvench Coauthor: Joshua Ward MEMS Test Setup: HP 54504A Digital Oscilloscope HP 5335A Universal Counter HP 4194A Spectrum Analyzer KI 213 Programmable Source Micro-Electro-Mechanical-Systems (MEMS) devices bring some of the miniaturization that was portrayed in the 1966 classic film “Fantastic Voyage” to reality. These tiny machines are being used as pumps, motors and sensors for a variety of different applications. USM Electrical Engineering Professor Mustafa Guvench has recently designed and fabricated a MEMS resonator for use in gas sensing and frequency control applications. Ordinarily these types of devices can be tested utilizing micro-manipulated electro-probing, however given the unique and varied environmental conditions of the potential applications; a new means of testing will need to be developed as part of chip research and development. The scope of this project is the packaging and testing of the resonator at high temperatures and under exposure to different gases and concentrations of gases. Once successful tested under these conditions, the MEMS resonators will provide a very inexpensive, reliable and miniature means of testing and monitoring atmospheric conditions. Potential uses may include many health and safety uses, as well as space exploration and defense applications. MEMS wire bonding diagram Wire bonding machine Virtual temperature controller SOI- MEMS chip, size 5 mm x 5 mm wire bonded to a 44-pin J-LDCC gold package Frequency Response of a SOI-MEMS Resonator Magnitude(yellow) & Phase(blue)

More Related