Advanced UT Camera Scan of Composite Laminate Defect Standards with Teflon Wafers
This document outlines the results of ultrasonic testing (UT) using a camera scan on a graphite/epoxy laminate that incorporates embedded Teflon wafers. The study employs a stitching algorithm and features a scan increment of 0.3 inches. The testing utilizes a conventional immersion scan method at a frequency of 2.25 MHz with a 0.25-inch diameter transducer and a 0.075-inch scan increment. This research contributes to improved defect detection in large composite structures, as demonstrated in collaboration with ATK Thiokol.
Advanced UT Camera Scan of Composite Laminate Defect Standards with Teflon Wafers
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Presentation Transcript
Scanning Results Hex nut and paper clip placed on surface Graphite/epoxy laminate defect standard with embedded Teflon wafers
UT camera scan with stitching algorithm applied - 0.3” scan increment Conventional immersion scan - 2.25 MHz, 0.25” diameter transducer - 0.075 scan increment Courtesy: ATK Thiokol