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Advanced UT Camera Scan of Composite Laminate Defect Standards with Teflon Wafers

This document outlines the results of ultrasonic testing (UT) using a camera scan on a graphite/epoxy laminate that incorporates embedded Teflon wafers. The study employs a stitching algorithm and features a scan increment of 0.3 inches. The testing utilizes a conventional immersion scan method at a frequency of 2.25 MHz with a 0.25-inch diameter transducer and a 0.075-inch scan increment. This research contributes to improved defect detection in large composite structures, as demonstrated in collaboration with ATK Thiokol.

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Advanced UT Camera Scan of Composite Laminate Defect Standards with Teflon Wafers

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Presentation Transcript

  1. Scanning Results Hex nut and paper clip placed on surface Graphite/epoxy laminate defect standard with embedded Teflon wafers

  2. UT camera scan with stitching algorithm applied - 0.3” scan increment Conventional immersion scan - 2.25 MHz, 0.25” diameter transducer - 0.075 scan increment Courtesy: ATK Thiokol

  3. Camera Scanning of Large Composite Structure

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