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Source ：全球產研整理， 2001/11

Source ：全球產研整理， 2001/11. 純玻璃 觸控技術比較. Capacitive_ Surface process. Capacitive Operation Principle. Grounding. Input Current. Input Current. Input Current. Input Current. 電阻式 觸控面板構成及種類. Dot Spacer. (Film or Plastic ). Source ：全球產研整理， 2001/11. 電阻式觸控面板電極配線方式. X1. X3. X1. X2. X2. X4.

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Source ：全球產研整理， 2001/11

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  1. Source：全球產研整理，2001/11 純玻璃觸控技術比較

  2. Capacitive_Surface process

  3. Capacitive Operation Principle Grounding Input Current Input Current Input Current Input Current

  4. 電阻式觸控面板構成及種類 Dot Spacer (Film or Plastic) Source：全球產研整理，2001/11

  5. 電阻式觸控面板電極配線方式 X1 X3 X1 X2 X2 X4 Y1 Y1 Y1 Y1 Y2 X1 X1 X2 X2 Y2 Y2 Y2 Y3 Y4 Source：全球產研整理，2001/11

  6. 手指或筆等介質 手指或筆等介質 ( ( 硬殼層 Hard Coat Layer) ( ( ITO Membrane) ITO Membrane) 薄膜電極 薄膜電極 薄膜 薄膜 ( ( Film Electrode) Film Electrode) ( ( Electrode X1) Electrode X1) 上部電極 上部電極 ( ( Dot Spacer) Dot Spacer) 點隔片 點隔片 ( ( Electrode Y1) Electrode Y1) 下部電極 下部電極 玻璃電極 玻璃電極 玻璃基板或薄膜 玻璃基板或薄膜 ( ( Glass Electrode) Glass Electrode) ( ( Glass or Film Plate) Glass or Film Plate) Source：全球產研整理，2001/11 電阻式面板結構

  7. Cover and Protective Glass LCD Display Sensor Board Battery Free, Digital Pen 電磁感應式 Digitizer_ structure

  8. Optical_ Infrared http://www.elotouch.com/products/Touchscreens/CarrollTouch/howitworks.asp *Ref.[5]

  9. Integrated Touch Panel AUO Proprietary & Confidential

  10. Optical_ Photo sensor Readout TFT Select line Cst2 Blue pixel Photo TFT W/L=6/6 Data line Sense line *Ref.[6]

  11. Operating of Press_Type Touch Panel Press Display Area Sensor Area △Clc2 will depend on the pressure. Release Clc Clc reset VCOM Clc2 changed to Short Cst on Com Address TFT Cfb VOUT Clc Select Readout TFT － Clc2 ＋ Charge Amplifier CF VCOM(DC is better) VREF Provide by RSEF0 JM

  12. Touch Panel Touch Panel: PS on CF CF 1.4mm Photo Spacer Photo Spacer Cell Gap (normal area) 4.8mm Photo Spacer (4.0mm) ITO (0.075mm) Cell Gap (Sensing Area) 0.6mm Pixel electrode Space > 5mm Pixel electrode • Similar Hybrid PS structure • No need to add bump, but CF ITO is deposited on PS. • The space between PS and PX should be larger than 5mm in case of alignment shift.

  13. Touch Panel for New User Interface UI focusing on finger input (UI defines how user operates the device; not touch panel) Finger input only applications: DSC, Car navigation, PMP, MP3, information display For PDA, smart phone or GPS, UI can cover the need of pen writing using on-screen keypad.

  14. Non-Contact Presence Sensors (Proximity) • Capacitive Type Touch Panel • Proximity of object to sensor provide different capacitance value for sensors • Detection of sensor can be done with two types • E-field Sensor • Detection of capacitance by change of electric field • Capacitive Sensor • Detection of capacitance by measuring holding charge • Other sensor types • Inductive Sensors • Detection of the proximity of metal objects only (electro-magnetic) • Optical Sensors

  15. Capacitive Touch Panel • Sensor Design Consideration

  16. Glass(0.5mm) Touch Sensor Set PF CF Glass Color Resist LC TFT TPII Proposal v1 AG AG PF CF Glass Color Resist LC TFT • Feature: • Easy Process- Not necessary to be traIt could be attached by 雙面膠 in module process. • Issue: • Thick module-An extra glass and AG film is necessary.

  17. PF Touch Sensor Set CF Glass Color Resist LC TFT TPII Proposal v2 • Feature: • Thin module—No need extra glass. Issue: • Process complexity– Due to CF maker could not pattern ITO, it is necessary to finish touch panel in Array Fab before CF process.

  18. TP side process

  19. Glass 入料 ITO Sputter ITO Etching OC1 deposit Metal Etching OC2 deposit APR Printing Metal Sputter OC1 Moly ITO Glass TP Sensor Process Flow 3F ITO line 2F TBM line 3F OC line On cell 3F PS line 3F PI coater line 3F Metal etching line 2F Cr line TP2

  20. Glass ITO Etching ITO Sputter OC2 Process Moly Etching APR Process OC1 Process TP side process ITO target

  21. TP sensor BM Glass TP Sensor One Glass Process ( 5PEP ) ITO Sputter ITO Etching Glass 入料 BM deposit APR Printing Metal Etching Metal Sputter OC1 deposit OC2 deposit

  22. OC2 ITO Metal OC0 BM OC2 Metal ` ITO OC1 BM Compare 5 pep with 6 pep process • The original 6 peps design to a new 5 peps design. • 2. The new 5 peps design has few advantages, as cost down, lead time reduced and etc.

  23. BM OC0 OC0 BM BM ITO OC0 BM One glass _ Original design with OC0 process Process sequence : BM, black matrix (black matrix frame)  OC0, over coat layer0 (isolated BM and ITO)  ITO, (patterned sensor) 

  24. ITO OC0 BM Metal ITO OC0 BM One glass _ Original design with OC0 process Process sequence : OC1, over coat layer1 (isolated ITO & metal)  Metal, metal bridge (sensor connection)  OC2, over coat layer2 (Protection coating)  OC2 Metal ITO OC0 BM

  25. BM ITO BM One glass _ New design remove OC0 process Process sequence : BM, black matrix (black matrix frame)  ITO, (patterned sensor)  OC1, over coat layer1 (isolated ITO & metal)  ITO OC1 BM

  26. Metal ` OC1 BM Metal ` OC1 BM One glass _ New design remove OC0 process Metal, metal bridge (sensor connection)  OC2, over coat layer2 (Protection coating)  ITO OC2 ITO

  27. CF side process

  28. R resistor coating B resistor coating Glass reserve BM Formation G resistor coating OC PS ITO CF Process Flow 2F RED line 2F BLU line 2F PS line 2F ITO line 2F Thermal OC line 2F GRN line

  29. 鍍第一層Cr膜 空白玻璃 上光阻(coating) 光罩 強酸液 去光阻液 顯影液 對準,曝光(stepping) 蝕刻(etching) 顯影(developing) 去光阻(striping) Cr BM Process

  30. 空白玻璃 光罩 顯影液 對準,曝光(exposing) 顯影成膜及硬烤 RBM Process 塗佈Resin film

  31. Slit coater 光罩 R光阻塗佈 => Spin 曝光 曝光 BM玻璃 Slit coater 光罩 R顯影成膜及硬烤 B光阻塗佈 => Spin RGB Process _ part 1 (2F_RGB line)

  32. 曝光 G光阻塗佈 => Spin RGB Process _ part 2 (2F_RGB line) Slit coater B顯影成膜及硬烤 三色成品檢驗 B顯影成膜及硬烤

  33. Spinless 烘烤 OC layer塗佈 RGB基板 OC Process (2F_Thermal OC line)

  34. ITO靶 濺鍍 RGB+OC基板 在基板上放遮罩 鍍好ITO膜之基板 移去遮罩之成品 ITO Process

  35. UV 燈 MVA光罩 MVA光阻塗佈及旋轉 曝光 烘烤 顯影 MVA Process (4F_MVA line)

  36. UV 燈 PS光罩 PS光阻塗佈及旋轉 曝光 烘烤 顯影 PS Process (2F_PS line)

  37. V2 TPII Mask Design 1. TPII 5m X 5m design ( Cypress Design ) TPII V1 : 根據Cypress Design Guide line 設計 Sensor size = 4.9mm x 4.9mm Sensor spacing = 0.3mm Sensor bridge width = 50um Space = 0.3mm Sensor density = 14*8 2. TPII 5m X 5m design ( for Yokohama ) Sensor size = 4.9mm x 4.9mm Sensor spacing = 0.3mm Dummy width = 240umITO spacing = 30um Sensor size = 4.9mm x 4.9mm Sensor spacing = 0.3mm Dummy width = 60umITO spacing = 30um

  38. ITO bridge B 30um 60um 30um sensor sensor sensor sensor dummy Glass Glass ITO300A ITO300A ITO300A PC4033.0um SiNx1000A PC4033.0um ITO300A ITO300A ITO300A PC4033um PC4033um PC4033um TPII Type G v2 Design Capacitive Sense Touch panel (Sample output:8/E) Sensors in the same plane Sensors in 2 plane A 30um dummy sensor dummy sensor dummy dummy Cypress : 10k TPII v2 : 40~50k (14X), 105pF (14X) Glass

  39. LCDs with Integrated Touch Panel (Current status) Currently, there are only 4 companies with multi-touch technology and patent license:1. Synaptics, 2. Cypress, 3. ALPS, 4. EMC

  40. Touch Panel Technology Comparison * Single hand operation can be achieved if pressure is < 20g ** Stylus with metallic tip required for pen writing ** Light Pen required for pen writing*** Single hand operation depends on software capability

  41. Touch Panel Technology Comparison Source: 全球產研整理2000/10 & 2001/11, 中華液晶資訊網2002/05, 工研院IEK-IT IS計畫2006/03, 時緯科技2003/05, Hi touch2005/04, Microtouch, G touch

  42. Touch Panel Technology Application △: 較少使用 * ATM, POI, POS, 公共查詢機(KIOSK), 工業用設備, 自動售票機, 醫療器材, OA事務機, 特殊用途設備 ** TABLET-PC Source: 全球產研整理2000/10 & 2001/11, 中華液晶資訊網2002/05, 工研院IEK-IT IS計畫2006/03, 時緯科技2003/05, Hi touch2005/04, Microtouch, G touch, KEYTEC

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