2012 ITRS Lithography TWG Update: Solutions, Challenges, and Development Options
This document outlines the key updates from the 2012 Lithography Technology Working Group (TWG) meeting, focusing on potential solutions and major challenges in lithography. It provides insights into updated requirements for 2-D flash development, explores options for MPU/DRAM and Flash technologies, and highlights the shift towards incorporating 3-D flash without impacting lithographic needs. Further amendments to our challenges table and a collaborative approach with the ERM group for lithographic materials are also described, alongside an assessment of DSA capabilities to align with the lithography roadmap.
2012 ITRS Lithography TWG Update: Solutions, Challenges, and Development Options
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Presentation Transcript
2012 Litho ITRS Update Lithography TWG July 2012
Outline • Lithography Potential Solutions • Major Challenges • Some table updates
Litho Team(2012 Meeting attendees shown – there are many other contributors)
Updated Flash Options This table shows the requirements for 2-D flash development. The potential introduction of 3-D flash does not drive lithography.
Highlighted Table Changes • We will create a lithographic materials challenges table and work jointly with ERM group on these needs • Multiple patterning table will be changed to reflect typical industry pitch splitting practice. • Will start assessing DSA capabilities to meet litho roadmap requirements
![2012 ITRS Emerging Research Materials [ERM] December 5, 2012](https://cdn2.slideserve.com/5067631/2012-itrs-emerging-research-materials-erm-december-5-2012-dt.jpg)
