1. 2000 Test RoadmapUpdate Don Edenfeld Mike Rodgers ITRS Test TWG

2. US Members NameCompany Mark Baber Lucent Bill Ortner Lucent Yi Cai Lucent Richard Antley TI Marc Mydill TI Anne Gattiker IBM Don Wheater IBM Phil Nigh IBM Atul Goel Agilent Peter Maxwell Agilent Tim Sheen Teradyne Lee Song Teradyne Paul Roddy Motorola Jay Bedsole Motorola Don Edenfeld Intel Roger Barth Intel Michael Rogers Intel Rochit Rajsuman Advantest Yervant Zorian LogicVision International Members NameCompany Peter Muhmenthaler Infineon Rene Segers Philips Kazumi Hatayama Hitachi Mr. Ohta Matsushita Mr. Satou Hitachi Kang Chil Lee Hyundai Test TWG Membership

3. 2000 Test Chapter Update • DFT Tester Table • The DFT Tester Table debuted in the 1999 edition • The 2000 update represents the trends that were described in the 1999 edition • Significant changes are intended to clarify the requirements based on the significant industry confusion evident in 2000 • This table will receive significant focus for the 2001 edition • Commodity Flash Table • In 2000 minor adjustments were made to the trends that were described in the 1999 edition • Requirements for a scan vector capability were added to address a growing trend towards integration of logic on flash devices

4. Cost of Silicon Mfg and Test cost: cents /transistor 1 Fab capital / transistor 0.1 0.01 0.001 Test capital / transistor 0.0001 0.00001 0.000001 1999 Roadmap Based on ‘97 SIA Roadmap Data & ‘99 ITRS Roadmap 0.0000001 1994 1982 1985 1988 1991 1997 2000 2003 2006 2009 2012 Industry Trend - Cost • Manufacturing cost continues to be the dominant factor in test • Test represents an increasing percentage of overall device manufacturing cost • 1999 edition cost targets begin to trend cost in the right direction

5. RF Analog DSP Flash uController SRAM Industry Trend - SoC • Demand for small form factors and low power solutions drive increased integration • Increasing levels of design integration drive new test challenges • Integration of logic, analog, RF, RAM, ROM, and/or Flash on a single chip is on the horizon • How to test highly integrated components at a cost consistent with the market for these devices?

6. Industry Trend - Wireless • Dramatic growth in the consumer wireless market segment over the foreseeable future requires cost effective solutions for RF testing • 2.4GHz and 5.2GHz bands are targeted for a large number of products in many applications (Bluetooth, 802.11x, …)

7. Industry Trend - HSS • High speed serial (HSS) technologies are not just for long range communication anymore • Serial communication is becoming the technology of choice for peripheral connectivity • Slow parallel bus architectures are being replaced by Firewire, Infiniband, and other HSS solutions • Traditional rack and stack approach to test of high speed ports is too expensive

8. Industry Trend – Burn-in • Shrinking fab process feature sizes and increasing transistor performance challenge device burn-in infrastructure and capability • Increased transistor performance leads to increasing power and thermal demand in burn-in • Burn-in cost trend is increasing faster than other parameters as a component of overall test cost Mean Power in Burn-In Technology Development Required $$$$ BI Power (W) Technology Exists $$ Capability Exists Die Size (mils)

9. DUT Current Load Step IDD 0A Voltage as Seen by DUT VCC Time Industry Trend - Power • Once an afterthought, precise power delivery is crucial for high performance designs • Voltage droop during test has a direct impact on manufacturing yield • High current power delivery requires accurate modeling and simulation of the entire power path • High precision analog circuits require very stable references

10. Industry Trend - Diagnosis • Validation and debug of complex designs require an increased level of interactivity between design automation and test equipment • Correlation must be established between a device failure and the actual failing circuit node • Automation tools are needed to shorten the process of tracing failures to the failing circuit as a direct impact to time to market • Emerging packaging technologies compromise existing failure analysis techniques • Flip-chip and multi-chip packaging require new approaches to probing for diagnosis and failure analysis

11. Industry Challenge • The ATE business model must change to adapt to evolving market directions • The high performance functional tester market segment is declining • Low performance functional tester and DFT tester market segments are growing • The industry must come together to define common requirements for DFT tester capability

12. Manufacturing Cost Initiatives • Technologies are emerging to lower equipment capital cost and increase test module throughput • The industry is driving toward DFT technology to move test complexity onto the die and away from the test equipment • Reduction in test equipment complexity should result in a significant decrease in tester cost over the 5 year horizon • DFT will be used to enable lower performance functional testers to test high performance designs • DFT techniques that reduce device pin count requirements for test enable increased parallelism and module throughput • Wafer level burn-in and test exploits high parallelism to increase throughput and decrease unit cost

13. System-on-a-Chip • Solutions must emerge to solve Big D / Big A test challenges • Today’s environment is structured for Little D / Big A or Big D / Little A • SoC testing requires a disciplined DFT approach • Fundamental research is needed to define and prove Analog BIST and DFT techniques • Extensive digital DFT techniques must be applied • Embedded flash and PROM test time threatens test module throughput • Test cost is a primary concern

14. High Speed Serial • High performance digital interfaces are approaching the analog domain for testability • High speed serial digital interfaces must be characterized and tested in the analog domain • Analog compliance testing is time consuming • Trade-off between increased tester resources, test time, and test effectiveness

15. 2001 Edition Test Chapter Plans • Iddq Testing • High Frequency Serial Communications • High Performance ASIC • High Performance Microprocessor • Low-end Microcontrollers • Mixed Signal • Commodity DRAM • Commodity Flash • Embedded DRAM and Embedded Flash • DFT Test Equipment • Design-for-Test Automation Tools • System-on-a-Chip • Failure Analysis • ATE Software Proposed for 2001