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Status Report on Segmented Mesh Microbulk Development for Rare Event Detection

This report summarizes the current status of the RD51 collaboration’s efforts in developing a 2D low-mass intrinsic X-Y detector based on segmented mesh microbulk technology. The design evolution spans multiple production batches from February 2012 to September 2013, addressing challenges in charge collection and microbulk manufacturing complexity. Key findings include successful high-voltage operation and characterization of detectors, revealing differences in performance based on hole diameter. Future steps focus on further characterizing the detectors and optimizing designs for applications in rare event detection experiments.

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Status Report on Segmented Mesh Microbulk Development for Rare Event Detection

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  1. RD51 Common fund project Status report on segmented mesh microbulk FransiscoAznar1, Theopisti Dafni1, Martyn Davenport3,Rui De Oliveira3, Esther Ferrer Ribas2, Serge Ferry3, Theo Geralis Fransisco J. Iguaz1, ThanosKalamaris, Mariam Kebbiri2 ,Thomas Papaevangelou2 1University of Zaragoza, 2IRFU/CEA, 3CERN, 4NCSR Demokritos, 6thFebruary 2014, RD51 Collaboration Meeting

  2. Motivations • Develop a 2D low mass intrinsic X-Y detector • Strategyused up to now (CAST, MIMAC, NTOF…) • Disadvantages: • In the limit of no diffussion, the 2D capabilities are lost • Charge collection in X-Y is not completelyequivalent • Complexityin the manufacturing of a multilayerstackmicrobulk

  3. Intrinsic true 2D Microbulks • Signal X-Y completelycorrelated • Minimisation of the mass budget • Coupled to autotriggerelectronics Verylowthreshold X-strips Y-strips Interest: rare eventdetectionexperiments, neutron beamimagers…

  4. Segmented mesh microbulk

  5. Present design

  6. Evolution 1st batch: February 2012 Active area ~ 38 x 38 mm2, Cu strips, pitch 1mm, strips interspacing 100 μm, amplification gap 50 μm could not hold HV, only a few strips were operational 2nd batch: November 2012 New production technique, 4 Micromegas prototypes Hold HV, No spectrum from an 55Fe source, pitch 1mm, strips interspacing 100 μm, amplification gap 50 μm 3rd batch: September 2013 5 Detectors manufactured with different holes diameters: 2 with 45µm and 3 with 60 µm. Pitch is 1 mm and strip interspacing reduced to 40 µm Manufacturing: first the x-strips then the mesh holes and finally the y strips. No holes on top of the x-strips gaps.

  7. 3rd Batch

  8. Evolution

  9. First characterisations (3rd batch) Ar + 5% Isobutane Reading the mesh (PA Ortec+ Shaper+MCA) 55Fe source

  10. Testing the x-strips with Gassiplex electronics

  11. Testing the x-strips with Gassiplex electronics 12% FWHM

  12. Conclusions and perspectives • First operationalsegmentedmicrobulks have been produced: theybehave as standard microbulks (high gains, Eres=12% reached) • Differences of behaviour (Eres) between 40 and 60 µm holes: in the 60 µm therewas an alignmentproblemduringmanufaturing. • HV front end card has been validated • Characterisation on going • Nextsteps: • Read Y signalswithGassiplexelectronics • Test withautotriggerelectronics: VMM1/AGET • Optimise design • Built a large detector withconnector: NTOF neutron beam profiler

  13. BACK UP

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