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IT & D1 HeII cooling-variants

WP3 Meeting (24 th of April 2013). IT & D1 HeII cooling-variants. R. van Weelderen (CERN). Overview. Variants for placing cryo -equipment considered Actively cooled parts: ∆T, HX-size as function of total heat load

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IT & D1 HeII cooling-variants

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  1. WP3 Meeting (24th of April 2013) IT & D1 HeII cooling-variants R. van Weelderen(CERN)

  2. Overview Variants for placing cryo-equipment considered Actively cooled parts: ∆T, HX-size as function of total heat load Passively cooled parts: Conduction area as function of heat load per meter Summary of requirements as function of HeII-cooling-variant

  3. Variants for placing cryo-equipment considered (1 of 4) passively cooled actively cooled • Phase-separator & • Piping entries/exits • Phase-separator & • Piping entries/exits • Possible QRL-jumper • SM & • QRL-jumper Q1,Q2a,Q2b,Q3: actively cooled for about 41 m, double-HXs(80 mm Ø holes) needed CP & D1 : passively cooled for about 16 m, no HXs needed

  4. Variants for placing cryo-equipment considered (2 of 4) passively cooled actively cooled • Phase-separator & • Piping entries/exits • Phase-separator & • Piping entries/exits • Possible QRL-jumper • SM & • QRL-jumper Q1,Q2a,Q2b,Q3+CP: actively cooled for about 49 m, double-HXs (80 mm Ø holes) needed D1 : passively cooled for about 8 m, no HXs needed

  5. Variants for placing cryo-equipment considered (3 of 4) passively cooled actively cooled actively cooled • Phase-separator & • Piping entries/exits • Phase-separator & • Piping entries/exits • Possible QRL-jumper • SM & • QRL-jumper • Phase-separator • Piping entries/exits Q1,Q2a,Q2b,Q3: actively cooled for about 41 m, double-HXs needed CP : passively cooled for about 8 m, no HXs needed D1 : actively cooled for about 8m, double-HXs needed

  6. Variants for placing cryo-equipment considered (4 of 4) actively cooled actively cooled • Phase-separator & • Piping entries/exits • Phase-separator & • Piping entries/exits • Possible QRL-jumper • SM & • QRL-jumper • Phase-separator • Piping entries/exits Q1,Q2a,Q2b,Q3: actively cooled for about 41 m, double-HXs needed CP,D1 : actively cooled for about 16 m, double-HXs needed

  7. Actively cooled IT-parts Total power extraction limited by : # (2) size (80 mm holes) of the HXs For both variants 1 & 2, we can extract the total IT-CP-D1 heat up to a maximum of 550 W with a ∆T < 100 mK.

  8. Passively cooled parts Variant 1: D1+CP conduction area > 300 cm2 Variant 2: D1 conduction area > 130 cm2 Variant 3,4: CP conduction area > ~ 100 cm2 (t.b.c)

  9. Variant 3 and 4 HX comparison Give the saturation temperature at 1.800 the T of the D1 and CP helium bath is dominated by the available HX-Area and Kapitza resistance of the Cu-surfaces: ‘-’ : means HX overflowing and/or T > 2.0 K, non feasible configuration Variant 3, with HX-holes > 69 mm is critically dependent on the HX-area and variations in Kapitza resistance of the Cu surfaces risky configuration Variant 4, with HX-holes penetrating D1 and CP is more robust and can do with HX holes down to 49 mm

  10. Summary If Qtotal < 550 W: Variant 2 if 80 mm holes in CP allowed, if not Variant 3/4 If 550 W < Qtotal < 710 W: Variant 3/4, T-D1 will approach 2.0 K, if possible at least 2x49 (preferably 80 mm) mm holes through D1 and CP Qtotal > ~710 W becomes difficult!

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