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Engineering Design Development for Stave Layout - sLHC Strip Tracker Meeting Overview

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This document provides an overview of the sLHC Strip Tracker Module Envelopes meeting held in Glasgow on June 13, 2011. Key topics include the development of engineering design for stave layout, the importance of understanding core thickness, and an exploration of module envelopes. It covers the measurement of z-heights for various components, such as silicon wafers, hybrids, ASICs, wirebonds, and capacitors, as well as expected wirebond heights for future modules, highlighting their impact on overall module design.

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Engineering Design Development for Stave Layout - sLHC Strip Tracker Meeting Overview

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  1. sLHC Strip Tracker Module Envelopes (Tim) WP4 Meeting Glasgow, 13th June 2011

  2. Overview • Development of engineering design for stave layout requires knowledge of likely stave core thickness. • Components • Core Dimensions • outer dimensions, bus-tape to bus-tape • Core Envelope • Twists, bows local ‘roughness’, thermo-mechanical deformations • Module-to-tape adhesive • Module Envelope • Module Envelope • Use experience from ABCN25’s with likely extrapolation to ‘final’ ABCN13 modules

  3. ABCN25 Module Z Heights • SmartScope survey of one hybrid glued to a sensor • Mount wire-bonding jig on SmartCcope and measure z-height • Locate module and establish vacuum • Measure z-heights of:- • Silicon wafer • Hybrid • ASICs • Wirebonds • Capacitors

  4. Results • Wirebonds • Intended difference in loop-height is 0.2mm • 4-row wirebonding establishes on LHCbVeLo Beetle ASICs – 0.2mm bond height difference maintained. • Expect 4-row ABCN13 wirebonding to be similargiving wirebond height of 0.8mm above ASICs • Total height = 1.30 + 0.80 = 2.21mm • Capacitors • Measured height = 2.17 above local hybrid height of 0.65mm • Hybrid unsupported so measured height affected • Corrected height = 2.17 + 0.8 - 0.65 = 2.32mm

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