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HPD Development Project is DONE! The Future is Quality assurance Database management

HPD Development Project is DONE! The Future is Quality assurance Database management Alignment Production of cookies and mounts Electronics interfacing Test beams Installation. This has been a development project ( the diode).

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HPD Development Project is DONE! The Future is Quality assurance Database management

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  1. HPD Development Project is DONE! The Future is Quality assurance Database management Alignment Production of cookies and mounts Electronics interfacing Test beams Installation

  2. This has been a development project ( the diode) Custom Pixel Design: 19 ch (towers) and 73 ch (short stacks) Higher pin-out density: Glass feedthrus replace with ceramic from Kyocera Alignment to 50 mm: manufacturer tolerances tightened, new measurement procedures Improved rise time: Thinner silicon: 200 mm replaces 300 mm Guard ring and drain structure: 3 iterations as Canberra improves design lower leakage current, higher breakdown voltage, better uniformity for edge pixels Surface aluminization and edge traces: Reduce negative crosstalk reduce resistance between n+ contacts, surface resistance 300 W/sq => 1.7 W/sq, Anti-reflective coating: Reduce positive crosstalk from reflected light AR (14 nm sputtered Si)Metal (25 nm AL)Barrier (25 nm SiO2) n+ contact n bulk (200 mm thick) 2 side-contacts (200nm thick Al) n+ p+ p+ p+ p+ p+ n+ Bump-bonded vacuum feedthru

  3. This has been a development project (the tube) Larger active area: Less room for HV connection, possible field distortions HV coax cable : Reliability and compatibility with RBX Minimize gap: Improve tube components Gold-plated pins: Enables us to use ZIF sockets - questions of gold diffusion Design and produce electronic interface boards RBX mountings and cookies must be rubber insulated Electronics Interface Board HV Cable HPD Cookie RBX RBX FIBERS

  4. Positive crosstalk from backscatter can be focussed by B-field TotalDC crosstalkB=0 B=1.5 T Bare silicon18% 7%Aluminized 29% 16%Al with AR 12.4% 4.3% B=0 Al B=1.5T Al B=1.5T Al+AR

  5. Contract F 359 /EP/ CMS is finalized for $1.5M (2.43 MCHF) Negotiations includedHigher cost/tube = 3325 eurosonly 19-ch version (484 tubes) keep 11% QE more expensive diodes additional coatings + traces by DEP includes shipping DDU via TIB (Schenker Int’l) Bank guarantee removed 60 day provisional acceptance period after receipt 30 day payment from CERN after prov. accept. Financial liability signed (NEU lawyers) 2.302 MCHF (letter from Hanlon) Money in Team Account at CERN = 2.665 MCHF Letter of Intent received by DEP last Friday They have 4 tubes to send us UNDER CONTRACT

  6. Other contract details of interest ..and lots more bla bla...

  7. Tube Delivery Schedule One production station = 30 tubes/month Letter of Intent received by DEP Oct 12, 2001 Spare Tubes (20) Dec 20 ‘01 Spare Tubes (30) March 1 ‘02 HB- (72) May 12 ’02 HE- (72) Aug 23 ‘02 HB+ (72) Nov 3 ‘02 HE+ (72) Jan 28 ‘03 HO (146) June 23 ‘03

  8. Specifications are finalized in Contract

  9. Specifications are finalized in Contract...continued

  10. QUALITY ASSURANCE Evaluate 500 tubes, automated procedure, complete web-accessible database Vendor Tests (DEP) => leakage current per pixel vs bias => initial HV bake-out => QE, dark count => pulse width DC Test Station (Minnesota)=> boundary scans, uniformity, leakage current, optical crosstalk => diode capacitance and interpixel resistance => HV and bias gain curves, threshold, linearity, breakdown => alignment and registration AC Test Station (Minnesota) => one p.e. curves: dark current, resolution, vacuum check High Rate Tests (FNAL and Minnesota)=> risetime and pulse shape => rate dependent effects => capacitive crosstalk and AC uniformity Lifetime Studies(Minnesota)=> Total integrated charge => High Voltage stability and bake-out => Radiation Damage

  11. Quality Assurance Test Procedure is also specified in the contract

  12. Quality Assurance Test Procedure - cont.

  13. Quality Assurance Test Procedure - cont.

  14. Quality Assurance Test Procedure - cont.

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