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GLAST Large Area Telescope: Electronics, Data Acquisition & Instrument Flight Software

Gamma-ray Large Area Space Telescope. GLAST Large Area Telescope: Electronics, Data Acquisition & Instrument Flight Software Peer Critical Design Review March 19-20, 2003 Gunther Haller Stanford Linear Accelerator Center Manager, Electronics, DAQ & FSW LAT Chief Electronics Engineer

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GLAST Large Area Telescope: Electronics, Data Acquisition & Instrument Flight Software

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  1. Gamma-ray Large Area Space Telescope GLAST Large Area Telescope: Electronics, Data Acquisition & Instrument Flight Software Peer Critical Design Review March 19-20, 2003 Gunther Haller Stanford Linear Accelerator Center Manager, Electronics, DAQ & FSW LAT Chief Electronics Engineer haller@slac.stanford.edu (650) 926-4257

  2. CDR Agenda Day 1 - March 19 (all times PST) Section 1: Electronics, DAQ, FSW Overview 8:00 – 8:40 Section 2: Management 8:40 – 9:20 Section 3: System Engineering 9:20 – 10:30 BREAK 10:30 – 10:45 Section 4: Electronics 10:45 – 12:00 LUNCH 12:00 – 13:00 Section 5: Instrument Software Overview 13:00 – 13:30 Section 6: Instrument Software I 13:30 – 14:45 BREAK 14:45 – 15:00 Section 7: Instrument Software II 15:00 – 15:30 Section 8: Instrument Software III 15:30 – 16:15 Discussion 16:15 – 17:00

  3. CDR Agenda (Con’t) Day 2 - March 20 Section 9: Mechanical & Thermal 8:00 – 9:00 Section 10: Power - EMI 9:00 – 9:30 Section 11: Monitoring & Thermal Control 9:30 – 10:00 BREAK 10:00 – 10:10 Section 12: EEE Parts 10:10 – 10:40 Section 13: Manufacturing 10:40 – 11:10 Section 14: Summary 11:10 – 11:20 Discussion/Closeout 11:20 – 12:00 Adjourn 12:00

  4. Review Board Team • Hartmut Sadrozinski/UCSC Chairman • Al Vernacchio/GSFC Co-Chairman - GLAST Deputy Project Manager • Fred Huegel /GSFC Electrical Engineering • John Fox/SLAC Electrical Engineering - Applied Physics • Steve Smith/SLAC Electrical Engineering – System Engineering • Bob Jackobsen/LBL Software • Rick Schnurr/GSFC Software • Lowell Klaisner/SLAC LAT Chief Engineer • Steve Scott/GSFC Systems Engineering • Ron Zellar/GSFC Software

  5. Gamma-ray Large Area Space Telescope GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software Overview Gunther Haller Stanford Linear Accelerator Center Manager, Electronics, DAQ & FSW LAT Chief Electronics Engineer haller@slac.stanford.edu (650) 926-4257

  6. Overview Outline • Overview of LAT and Electronics • Level III Requirements Summary • Meeting Key Requirements • Flowdown – Requirements to Design • Design Evolution • Optimization • Technical Heritage • Status of July DPDR Recommendation Items

  7. e– e+ Overview of LAT • Precision Si-strip Tracker (TKR) 18 XY tracking planes. Single-sided silicon strip detectors (228 mm pitch) Measure the photon direction; gamma ID, ~880,000 channels. • Hodoscopic CsI Calorimeter(CAL) Array of 1536 CsI(Tl) crystals in 8 layers. Measure the photon energy; image the shower. • Segmented Anticoincidence Detector (ACD) 89 plastic scintillator tiles. Reject background of charged cosmic rays; segmentation removes self-veto effects at high energy. • Electronics System Includes flexible, robust hardware trigger and software filters. Tracker ACD [surrounds 4x4 array of TKR towers] Calorimeter DAQ Electronics Systems work together to identify and measure the flux of cosmic gamma rays with energy 20 MeV - >300 GeV.

  8. LAT Electronics TKR Front-End Electronics (MCM) 16 Tower Electronics Modules • DAQ electronics module (DAQ-EM) • Power-supplies for tower electronics ACD Front-End Electronics (FREE) CAL Front-End Electronics (AFEE) TKR CAL Global-Trigger/ACD-EM/Signal-Distribution Unit* 3 Event-Processor Units (2+1 spare) • Event processing CPU • LAT Communication Board • SIB Spacecraft Interface Unit • Spacecraft Interface Board (SIB): Spacecraft interface, control & data • LAT control CPU • LAT Communication Board (LCB): LAT command and data interface Power-Distribution Unit (PDU)* • Spacecraft interface, power • LAT power distribution • LAT health monitoring * Primary & Secondary Units shown in one chassis

  9. Specification Tree

  10. Level III Key Requirements Summary Electronics Ref: LAT-SS-00019

  11. Level III Key Requirements Summary (2) Power System Ref: LAT-SS-00136

  12. Flowdown – Requirements to Design

  13. Evolution of DAQ Design Proposal Design: • No global trigger, ability to reduce hardware trigger rate from tracker marginal • Data router to move partial event fragments into central processor • Event building in software • 16 processors, one on each tower to process data • Communication to TKR/CAL/ACD systems very unique Current Design: • Global trigger, ability to reduce hardware trigger rate from tracker • Event building in hardware • Data switch to move complete event fragments from hardware event builder to processor • 2 processors for event processing • Communication to TKR/CAL/ACD systems unified

  14. Optimization – Summary • Serial LVDS (Low-Voltage-Differential-Swing) protocol with Data, Clock, Reset, Return-Data to each front-end system and between DAQ modules (see LAT-TD-00606) • Buffering of event data fragments at each module stage to meet dead-time requirements • TKR front-end -> TEM -> Event-Builder -> LAT Communication Board -> CPU -> Spacecraft Solid-State Recorder • Flow-control between buffer stages to meet non-overwriting and data consistency requirements • Utilization of ASIC’s to meet volume, power, and cost constraints

  15. Heritage • Similar data-acquisition system was used on balloon flight (TEM, one event-processing CPU, one spacecraft-interface-equivalent control CPU) • Electronics components: mostly components with flight-heritage (FPGA’s, LVDS converters, memories) • ASIC technology same as for tracker, calorimeter, ACD systems • Trigger, dataflow, event assembly, and event filter processing very similar to past high-energy physics experiments

  16. Summary of July Delta-PDR Review • “The electronics including software was already baselined at the January PDR review” • “Work with GSFC branch to qualify poly-switches for use in the LAT electronics” • Approved • “Ensure that FPGA design practices adhere to GSFC guidelines and recommendations for space-flight applications” • Working with Rich Katz at GSFC to review LAT FPGA designs. In process of sending designs to GSFC for review

  17. Summary of July Delta-PDR Review (Con’t) • “Determine the need date for processor down-select based on software design impact” • Have selected BAE RAD750 • “Finalize the flight-software management plan and test plan” • Flight software management plan (LAT-MD-00104-02) entered into cyberdocs 6 November 2002 • Flight software test plan (LAT-TD-00786-01) entered into cyberdocs 10 June 2002

  18. Summary of July Delta-PDR Review (Con’t) • “Identify solution path to replace the functionality that would have been provided by SCL COTS tool in the flight software. Coordinate with I&T and mission operations” • I&T has adopted a low level toolset (Python, Qt, XML, MySQL) to implement the EGSE side of the I&T test environment. FSW provides the hardware drivers for the embedded system. Code already exists and is running on test stands to replace the SCL register manipulation model. FSW has adopted the I&T low level toolkit for its Test Executive.

  19. Gamma-ray Large Area Space Telescope GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software Management Gunther Haller Stanford Linear Accelerator Center Manager, Electronics, DAQ & FSW LAT Chief Electronics Engineer haller@slac.stanford.edu (650) 926-4257

  20. Management Outline • Team Leads • Team Partners • Contingency (Mass, Power, Cost) • Organization Chart • Work Flow • Testing Overview • Fabrication Plan • Schedule & Critical Path • Cost • Procurements • Configuration Management • Issues and Concerns • Summary

  21. Team Leads • Gunther Haller • Project Manager Electronics, DAQ, Instrument Software • Chief Electronics Engineer • PCMS Schedule & Cost Lead • JJ Russell • Instrument (Flight) Software Lead • Mike Huffer • Data-Acquisition System Lead • Dave Nelson • Mechanical & Thermal Engineering Lead • I&T Lead • Power/EMI System Lead • Jobe Noriel • Packaging Engineering Lead • Jerry Clinton • Manufacturing Lead • Nick Virmani/Darren Marsh • Mission/Quality Assurance

  22. Team Partners • Naval Research Lab • Spacecraft interface board (Silver Engineering) • Instrument flight software (Boot Code, SC Interface) • CAL front-end electronics • University of Santa-Cruz • Tracker front-end electronics • Goddard Space Flight Center • ACD front-end electronics

  23. Contingency Handling • All contingency (Power, Mass, Cost) is held at LAT project level • Change requests to LAT Change Control Board are required to account for variance • 4.1.7 Changes which required increase in cost, mass, power:

  24. Organization Charts Electronics, DAQ & Flight Software G. Haller SU-SLAC WBS 4.1.7 Reliability Quality Assurance DAQ Enclosures/Harness D. Nelson D. Marsh/N. Virmani M. Huffer M .Freytag SU-SLAC SU-SLAC/NRL SU-SLAC SU-SLAC WBS 4.1.7.2 WBS 4.1.7.2 WBS 4.1.7.4/4.1.7.5 WBS 4.1.7.7/4.1.7.8 Instrument Software Power System GSE & Operation Instrument I&T D. Nelson J. Russell M. Huffer G. Haller SU-SLAC SU-SLAC SU-SLAC SU-SLAC WBS 4.1.7.6 WBS 4.1.7.9 WBS 4.1.7.A WBS 4.1.7.C Front-End Elex G. Haller SU-SLAC Tracker Elex WBS 4.1.4 CAL Elex WBS 4.1.5 ACD Elex WBS 4.1.6 Section 7.4 Elec, DAQ, Flt SW Overview

  25. Development Testing LAT System COM-card 1: LAT Communication Module COM-card 2: Trigger Module • Processor: Motorola Power-PC • Flight Software • LAT COM engineering modules for • LAT Communcation • Trigger • TEM DAQ Assembly • TEM Power-Supply Assembly • 28-V Supply • LAT-TD-00861 Power-PC Processor Flight Software TEM DAQ Assembly Tower Power Supply Assembly (1.5V/2.5V/3.3V/ 0-100V/0-150V) 28-V Power Supply

  26. Testing Plan • ASIC’s are 100% acceptance tested before assembly on boards • Radiation performance is lot tested for single event effects and total ionizing radiation. • Function/Performance is tested at the board level • Qualification and acceptance tests including performance, vibration, EMI/EMC, and thermal vacuum are performed at the component sub-assembly (box) level.

  27. Fabrication Plan • ASIC’s • Design: SLAC • Fabrication: Agilent • Packaging: ASAT • Printer-Circuit Boards • Design: • Spacecraft Interface Board: Silver Engineering • All other DAQ custom modules: SLAC • Fabrication: qualified vendor • Parts procurements: SLAC • Assembly: qualified vendor • Enclosures • Design: SLAC • Fabrication: qualified vendor • Module Assembly (PCB’s/cables/enclosure) • Design: SLAC • Assembly: qualified vendor • Tower Power Supplies • Circuit & board design, fabrication, assembly: qualified vendor • Enclosure design: SLAC • Assembly: qualified vendor • Harness • Design: SLAC • Assembly: qualified vendor • Installation at SLAC

  28. Work Flow GCCC, GTCC ASICs First layer DAQ modules TEM DAQ Board TEM DAQ Assembly Acceptance Test TEM DAQ Enclosure TEM Assembly LAT Integration 1st stage TEM PS Board TEM PS Assembly Acceptance Test TEM Power Supply Enclosure GLTC ASIC GASU DAQ Board GASU Assembly Acceptance Test Second layer DAQ modules GASU Enclosure LAT Integration 2nd stage GLTC ASIC PDU DAQ Board PDU Assembly Acceptance Test PDU Enclosure SIB Board SIU Assembly Acceptance Test Add Harness GLTC ASIC LCB Board LAT Integration 3rd stage Acceptance Test CPU Board EPU Assembly PS Board Acceptance Test Crate Enclosure Harness Acceptance Test Software

  29. Key Milestones

  30. Key Milestones

  31. Critical Path • TEM DAQ Assembly • Flight TEM DAQ PC Board fab and loading Feb 04 • Requires flight TEM ASICs • Tower Power Supplies • Flight assemblies by March 04 • Is out for RFP, expected back March 25 • Depends on vendor response

  32. Cost by Fiscal Year • W.B.S. 4.1.7 without contingency

  33. Cost Contingency and Schedule • Status below is as of Jan 31-03 • Software-specific contingency: see Instrument Software presentation *contingency is held at project level

  34. Manpower Plan 4.1.7 Electronics FTEs

  35. Procurements • Long-Lead Procurements • Tower power supplies (RFP close March 25) • Processor (RFP in April) • Voltage regulators (after CDR) • Major Upcoming Procurements Near-Term (< 4 months) • FPGA’s • Connectors • MOS Transistors • DC/DC Converters & Filters • ASIC’s • Major Upcoming Procurements Long-Term (>4 months) • Enclosures • Harness • Minor Upcoming Procurements • Miscellaneous electrical components

  36. Configuration Management and Information Technology • SLAC CM System • Cyberdocs (web-based document storage): Electronically stored documents, drawings, procedures, Work-Order-Authorization (WOA’s) • Risk Item Database • Document Library • Electronics, DAQ, Flight Software web-site • http://www-glast.slac.stanford.edu • Website is used to share information and store draft documents, • Directly access CM documents stored in cyberdocs

  37. Issues and Concerns • Schedule is very tight • Critical path has little room for delay • Dependency on delivery of procured items

  38. Summary • Technically the electronics and instrument software are on track • Schedule and budget plan are fully in PCMS down to level 7 since PDR, both are on track • Critical path and contingency analyzed • No unusual risks besides risks of any high-energy physics experiment and space flight instrument • Testing, fabriation, and workflow plans in place • Experienced management and technical team

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