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Advanced Heat Transfer & Materials Research for Temperature Control of Sensors & Electronics

Research focused on temperature control of sensors and electronics using advanced heat transfer techniques and materials development. Areas of study include high-performance coolers, heat exchangers, woven surfaces, porous media applications, hybrid thermal energy storage, and multifunctional materials.

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Advanced Heat Transfer & Materials Research for Temperature Control of Sensors & Electronics

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  1. Joint COE/MSMHeat Transfer & Materials Development Research R.A. Wirtz Mechanical Engineering Department University of Nevada, Reno Rawirtz@unr.edu (775) 784-6714 February 9, 2001 Wirtz

  2. Mechanical EngineeringHeat Transfer & Thermal Process Lab Research Focus Temperature Control of Sensors & Electronics High Performance MCM Coolers and Heat Exchangers Enhanced Heat Transfer surfaces (Woven surfaces) Porous media applications Hybrid Thermal Energy Storage Coolers/Devices Hybrid TES Coolers Phase change materials (PCM) Multifunctional Materials (thermal/mechanical performance & fab.) Thermal Characterization of Devices and Systems Infrared Imagery Wirtz

  3. Principal Facility (HRL 305/306) • Specialized Flow Facilities, Temperature and Heat Flux Instrumentation, Materials Processing Equipment (vacuum ovens, furnaces, testing machines), Infrared Imaging, Microscopic Inspection and Imaging, Interferometers (Mach-Zhender, Holographic), Thermal Conductivity Apparatus (plates, powders,structures) • Computer Workstations (Flotherm, Fluent, Ansys), Data Acquisition Systems, Web-access • Access to: Low-Force Mechanical Test (ME), Differential Scanning Calorimeter (MSM) , Dynamic Mechanical Analyzer (MSM), SEM (MSM) Wirtz

  4. Faculty Associates Dhanesh Chandra (Met.E.), Matls. Alan Fuchs (Ch.E.), Polymers Miles Greiner, (M.E.) H.T. Aug. Yanyao Jiang, (M.E.) Mech. char. Staff/Consultants Ping Fang, Textile Engineer Mike Lemich, Machinist Graduate Assistants Patricia Connors (MS, ChE) Ji-Wook “Jay” Park (MS, ME) Shuo Ping (Ph.D., Ch.E.) Dan Ruch (MS, ME) Jun “Richard” Xu (MS, ME) Ahmet Yilmaz (Ph.D., Met) Ning Zheng (Ph.D., ME) Tianwen Zhuo (Ph.D., ME) Undergraduates Candice Bauer Jason Erickson Neil Gavrich Research AssociatesR.A. Wirtz Wirtz

  5. Research Sponsors • BMDO/AFOSR (Nevada EPSCoR, 2 projects) • Intel Corporation • National Science Foundation • Nevada Applied Research Initiative • Sierra Nevada R & D Inc, Incline Village Wirtz

  6. BMDO/AFOSR Wirtz (ME) Jun “Richard” Xu (MS, ME) Chandra (Met) Ahmet Yilmaz (Ph.D., Met) Fuchs (ChE) Patricia Connors (MS, ChE) Jiang (ME) Tianwen Zhuo (Ph.D., ME) Intel / NV ARI Wirtz (ME) Ning Zheng (Ph.D., ME) Fuchs (ChE) Shuo Ping (Ph.D., Ch.E.) TES-Systems/MF-Materials Wirtz

  7. Motivation • Hybrid Thermal Energy Storage (TES) coolers for variable power MCM’s • Cooler sized for intermediate heat load • TES component stores/releases heat during high/low power operation • Smaller, simpler, less power consuming cooler, quieter • Utilize “dry” Phase Change Materials (latent heat) • g-load, orientation insensitive operation • Simple packaging • Passive, reliable (no moving parts) • Multi-functionality (TES + Structural) • Save space Wirtz

  8. C B A Heat Source COOLANT A, C = Metalized Storage Volumes B = Heat Exchange Volume AIR FAN HEAT EXCHANGER METALIZED PCM VOL. q’’(t) TES Hybrid Coolers Wirtz

  9. Hybrid SEM-E FTM PAO flow rate = 2.5 #m/min Nominal load = 1000 watt Load factor = 1.5, Duty cycle = 30% Wirtz

  10. TES-Systems/Matls (INTEL / NV-ARI) Objectives: Develop methodologies and materials for commercial application of TES-systems (low-$). • Approach: • Develop and Benchmark Design/Analysis Tools • Fabricate and evaluate prototype systems and materials • Results: • Benchmarked Thermal Models  Optimal Designs & Figures of Merit • Plate-type TES Cooler having a 2 hr capacity of 100W+30W • Thermoset and Thermoplastic composites having capacities of 100 – 150 joule/cc (85% PCM) Wirtz

  11. 105 d t s 100 C] 95 0 90 Temperature [ 85 Test data Simulation data 80 75 0 10 20 30 40 50 60 70 80 Time [min] Comparison of simulation and experimental data TES-System Design Finite Volume Heat Transfer Model + Design Optimization Algorithm 10030 watt capacity unit Wirtz

  12. s = r = 17 min Hybrid Figure of Merit C” = 20 watt/m2oC, Ttr = 81oC, Ttr = 1oC Wirtz

  13. Figure 10 – Thermal conductivity of paraffin / epoxy composite, 85 wt% paraffin. Figure 8 – Loss modulii of DER 324, paraffin and paraffin/DER 324 composite. Figure 5 – Storage modulii of DER 324, paraffin and paraffin/DER 324 composite. Polymeric TES-Composites Wirtz

  14. Multi-functional Materials for Thermal Control of Sensors and Electronics (BMDO/AFOSR) Objectives: Develop composites that can store heat (via latent heat effect) while they serve a structural function. Approach: Encapsulate Phase Change Materials in metal or polymer matrix materials to form structural elements. Results: Plate-like structures having heat capacity of 118 j/cc and thermal conductivity approaching 8 W/mK. Moldable polymer composites having heat capacity of 50 j/cc and conductivity of 1 – 4 W/mK. Wirtz

  15. Methodology Encapsulate Phase Change Materials to form structural elements • Macro-encapsulations • Composite plates • PCM in honeycomb, metal foam, Rigimesh • Structural + k-enhance • Aluminum, graphite/epoxy skin • Micro-encapsulations • molded components • Metal encapsulate + sintering • K-enhance • Molecular deposition (CVD, etc.) • Polymer encapsulation • Epoxy, silicone, thermo-plastic matrix • Nano-precipitation Wirtz

  16. Macro-EncapsulationPG, Foam Al, Al-sheet 118 j/cc heat storage capacity Potentially, a 40-fold increase in keff Wirtz

  17. DMA testing for the Cerrolow-140-3250-1 / silicone composite. Micro-Encapsulation  Moldable Composite25% (vol) Cerrolow powder in Silicone50 j/cc heat storage capacity at 60C Wirtz

  18. Conductivity Enhanced TES-CompositesSierra-Nevada Research & Development, Inc. Wirtz

  19. The End Wirtz

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