Suggestions for a MPGD Workshop in Frascati

1. Suggestions for a MPGD Workshop in Frascati Rui de Oliveira

2. outline • 1- Rapid presentation of typical manufacturing processes for MPGDs (GEM ,  Micromegas, R-WELL ... as examples) • 2- machines needed • 3- know-how and manpower needed • 4- space needed • 5- cost • 6- possible synergy with CERN • 7- time estimate to set-up the workshop and go in “production” • 8-Futures detectors processes

3. Detector = structures with high local field Electrons liberated by ionization drift towards the anode wire. Electrical field close to the wire (typical wire Ø ~few tens of mm) is sufficiently high for electrons (above 10 kV/cm) to gain enough energy to ionize further → avalanche – exponential increase of number of electron ion pairs. Cylindrical geometry is not the only one able to generate strong electric field: wire mwpc parallel plate strip hole groove/well

4. Ions 40 % 60 % Electrons By reducing structure sizes MPGDs have improved a lot the detector capabilities in many domains • Micromegas • GEM • Thick-GEM, Hole-Type Detectors and RETGEM • MSHP • MPGD on ASICs : Ingrid • Higher rate • higher granularity • friendly gases • less aging • better energy resolution Micromegas MHSP Ingrid GEM THGEM 4

5. Process description for a few of them

6. Micromegas PCB Lamination Bulk MicroMegas Process Mesh deposit Standard Bulk MicroMegas suffers from limited efficiency at high rates due to discharges induced dead time Lamination Development ATLAS small wheels upgrade project resistive MicroMegas prototype 6

7. I+ 5 µm e- 50 µm Ions 40 % 60 % Induction gap Electrons e- 55 µm 70 µm GEM Fabio Sauli Thin, metal coated polyimide foil perforated with high density holes.

8. GEM process • Double mask • Single mask • Same base material • Hole patterning in Cu • Polyimide etch • Bottom electro etch • Second Polyimide Etch • Limited to 40cm x 40cm due to • Mask precision, alignment and cost • Limited to 2m x 60cm due to • Base material • Equipment

9. R-Well description (preliminary) Goal: -1Mhz/cm2 rate -<100um spacialresolution -single foil detector -sparkprotected Micro via + new resistivecoating Base material Bottompatterning Dielcoating + Microvia + Metalic layer Resistivecoating Microwell pattern Dielectriccoating Processesneeded: -Photolithography -screen printing -Copper plating -Polyimideetching

10. In the 3 examples we can see thatchemistry is the main technique to build MPGD. It allows: • 3D structure with a size around 100um • Possibility of large sizes • Edges defined with a few um accuracy • Uses equipment existing in industry

11. outline • 1- Rapid presentation of typical manufacturing processes for MPGDs (GEM ,  Micromega , R-WELL ... as examples) • 2- machines needed • 3- know-how and manpower needed • 4- space needed • 5- cost • 6- possible synergy with CERN • 7- time estimate to set-up the workshop and go in “production” • 8-Futures detectors processes

12. Machine needed • All kind of machines are interresting • The idea for a good workshop is to group in the same place under the same supervision all kind of technologies . • Photolithography • Mechanics • Chemistry • Screen printing • Plasma • Laser • Ink jet printing • If youcan’t put them all, the 4 first are crutial to startsomething , and Chemistryisprobably the first

13. Let’stake the GEM process to seewhat are the machines behind

14. Image transfert/ Photolithography GEM Base material 5/50/5 Apical NP Laminator Solid resistdeposition New: 35 000 CHF Second hand: 10 000 CHF UV lamp Resistexposure New: 18 000 CHF Development machine Solid resistdevelopment New: 60 000 CHF

15. Etching/ stripping Etching Copper etching New: 60 000 CHF Stripping Alcaline Resist stripping New: 60 000 CHF Stripping Solventresist stripping New: 15 000 CHF

16. Chemical polyimideetch Kaptonetching Bath + Hood: 15 000 CHF Machine 80 000 CHF

17. Other important equipments

18. Milling -Drilling Milling machine For PCB production New: 70 000 CHF Second hand: 30 000 CHF Drilling machine For PCB production New: 70 000 CHF Second hand: 30 000 CHF

19. Screen printing Screen printer Resist, conductor, dielectricdeposit Second hand: 30 000 CHF

20. Press Isostaticpress Vacuum gluingunder pressure at high temp Honeycombs panels, thinflexes, multilayerboards New: 250 000 CHF Second hand : 50 000CHF

21. Control Microscope with camera X 1000 New: 20 000 CHF Binocularwith camera X 100 New: 15 000 CHF

22. ovens Ovens 2 to 3 are needed Up to 300 deg at least for 1 Size depending on application New: 7 000 CHF/ piece

23. Platingholes • Deasmering (or plasma) line • Clean the holesafterdrilling • Brown oxyde line • Prepare the copper for gluing • Palladium or Carbonpre-coating line • Plate dielectrics • Electrolyticcopper line • Createthickercopperlayers • Total investment • 500 000 CHF Subcontractingthis part isprobably a betteridea

24. outline • 1- Rapid presentation of typical manufacturing processes for MPGDs (GEM ,  Micromega , R-WELL ... as examples) • 2- machines needed • 3- know-how and manpower needed • 4- space needed • 5- cost • 6- possible synergy with CERN • 7- time estimate to set-up the workshop and go in “production” • 8-Futures detectors processes

25. Know-how and man power • Twopersonsis the minimum to start R&D activities • Bachelor or Master in Electronics, Mecatronics • Good Knowledge in chemistry • A connectionwith an academicinstitute on chemistrywillbe a real + • Experience in PCB production • CAD experience on UCAM or GENESIS software • Good knowledge in physics

26. Spaceneeded • Clean room for final cleaning and test 40m2 min • Main room around 200 m2 shouldbe ok • Needs a detailledstudy to besure • We have presently 1000m2 at CERN • Wet area • DI water production • Watertreatmentequipment • Fume cupboards for trials • Storage for chemistry

27. Cost • Alreadygiven in the talk • Pay attention to hiddencosts • Software maintenance • Machine maintenance • Efluentstreatments • Chemistryanalysis • Fume cupboards and large sinks for chemistry

28. Possible synergywith CERN • Whatwillbeyourworking model?: • R&D or Service workshop • R&D model  hidding a bit the activity • Select the projects • Financed by budgets • Service  open all yourpossibilities to anyrequest at any time • Acceptanyproject • Self financed • Hot subjects that could be shared in the future • Resistors production survey • Converter survey • Review all the single board detector , and find a way to protect them • High rate single board protected detectors • Embedded electronics for ultra-thin detectors • Embedded cooling • We should set up regular meetings • We should also exchange personnel

29. To be re-studied 200 mm MSGC FGLD Dot structures Micro dot structures Micro-slit Micro well and groove

30. Time estimate for a working workshop • 1 year to buy all the machines • Marketsurveys • Buyingprocedures • ½ Year to connect machines • ½ Year to fill and start machines

31. Futur detector processes • DRIE Plasma • 10um scale 3D structures MicrobulksMicromegas • Laser ? • 10um scale patterns are difficult • Carbonizationis a reallybigproblem • Large sizes is still a big chalange • Resistivematerial • DLC : Diamonlikecarbon • ALD : Atomic layer deposition • Ink jet printing • Open 3D micron level patterns in large size • Probably cheaper • A new world to discover

39. Conclusion • 500 000 CHF • 2 years • 220m2 • 2 engineers • Good ideas

40. Thank you