Convergence of RF & Digital Technologies

1. Convergence of RF & Digital Technologies Presented by: MohitKhanna R&D Operating Manager Agilent Technologies Working with Digital and RF can be as easy as ABC

2. Convergence of RF & Digital Technologies • Abstract: • With the rapid development of mixed signal technology to fulfill ever growing need to make • newer electronics gadgets smarter, smaller & cheaper throws out a unique challenges for • designers as these technologies pose interesting and often contradictory challenges. • As a recognized market & innovation leader in RF & Mixed Signal Simulation space alongwith • state-of-the-art T&M, Agilent Technologies provides competitive & technological edge to • designers/developers working in ever challenging environment to be successful. During the • course of presentation we shall provide insights on latest design & development challenges with • tools & techniques to be successful.

3. Presenter’s Profile • Mohit is B.Tech in Electronics and Telecommunication from Allahabad University and M.Tech from IT- BHU in RF. Previous to working in Agilent, Mohit worked with ISRO as Scientist for six years. For last 6 years, Mohit is working with Agilent Technologies. Currently Mohit is working as Operating Manager looking into Software Testing & Quality Assurance of Agilent EEsof software products. • He can be reached at mohit_khanna@agilent.com

4. What’s the Story?The Digital and the RF World are MERGING • It’s a REALITY: A standalone working Baseband and a standalone working RF front-end does not GAURANTEE a working system! Baseband Designer RF Designer RF Digital

5. Challenges for System Designer“Cross the A/D Converter Divide” • (1) Requires both Digital and RF Knowledge to understand the complete “picture” (2) Needs a tool to perform Baseband/RF co-simulation. Design paths has to remain in contact throughout the design process. Continuous cross-verification allows aggressive RF/Baseband partitioning, and reduced design margins with lower project risk. RF Digital

6. System engineer who are RF trained need to learn the digital way System engineer who are Digital trained need to understand the RF world Digital RF Fear Factor“Crossing the A/D Convertor Divide”

7. How do we ensure integration goes smoothly?Baseband and RF Cross verification is a MUST! Digital RF

8. Communication Link where Agilent tools have role to play PHY Architecture Research Analysis Partitioning Verification Instrument Links Baseband DSP Modeling Algorithms Code-GenerationFixed Point/HDL Verification MIMO/Channel Fading Jamming Noise Interference Arrays/Steering RF System ArchitectureBehavioral/Noise X-parameters Links from ADS/GG PHY Reference IP Wireless Standards Interoperability Virtual H/W Coded Test Vectors EDA/Test integration

9. Overcoming System Design Challenges • Using a Mixed Signal System Design tool which allows Digital/DSP as well as RF system modeling allows designers to partition their designs more accurately • This analysis also allows to mitigate the initial RF + Digital/DSP integration challenges and performance optimization

10. Mixed Signal PCB Challenges:Higher integration, higher complexity, smaller size Digital More complex multilayer, multifunctional RF-high speed mixed signal boards More mixed technology (RF, analog, digital) boards Globally dispersed, isolated design team specialists Continued pressure to meet an electronic company’s business needs: • Shorter design cycle times • Reduced development and end product costs • More competitive products • Lower price points RF Filters Digital Synthesizer RF RF Digital Controller Analog RF Converter RF Osc Agilent Spectrum Analyzer Mixed Technology RF PCB

11. Advanced Mobile Wireless IC Trends Cellular Base Band Apps Processor Cellular Radio/FEM GPS RF Switch WiFi+BT Higher Levels of Integration, More “Radios”, Advanced Technology

12. Wireless Design Complexity Growth for RFIC Segment • Radio design challenges associated with increased complexity: • Trend is complex signaling which requires a more complete verification flow: • Analysis of full RX/TX functional path with “real” signals • System Design and Circuit Realization May Be Misaligned • Cost is a Verification Bottleneck • Trend is for More Bands and Higher Frequencies: • Broadband Millimeter Wave ICs are Being Designed in CMOS! • Trend is toward most advanced process technologies for RF • RF Design Enablement is essential for success • New yield effects require additional verification before tapeout • Advanced technologies are driving new packaging alternatives LTE RX Band LTE TX Signal Upconverted Interferer

13. How Agilent can help?Agilent EEsof Software Solutions…. Device Modeling RFIC MMIC RF SiP / Hybrid RFBoard SignalIntegrity CommsESL SystemVue GoldenGate ADS EMPro Genesys IC-CAP

14. Perform Early Verification using Combination of H/W and S/WLTE FDD UL Throughput Test (TS 36.141), or BER/BLER C P R I STEP 1 Filter X A/D Filter 1 2 3 4 Signal Generator SystemVue – Generates signal, then closes the loop ~ ~ RU DU Customer Hardware eNodeB receiver DPD DU Gain X Filter A/D STEP 2 SystemVue – LTE decode VSA 89600 waveform recording Signal Analyzer SystemVue closed a loop to help measure LTE throughput APP NOTE 5990-6202EN

15. Resources: Agilent Website: www.agilent.com Agilent EEsof: www.eesof.com Agilent EEsof Channel on You Tube: www.youtube.com/user/AgilentEEsof

16. Thank YouQ&A Session