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Enhanced Thermal Management Solutions for Thunderball 11.6" Control Board

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This document outlines strategic enhancements to manage thermal performance for the Thunderball 11.6" control board. Recommendations include enlarging PCB size, changing materials from SUS to aluminum, and employing high thermal conductivity materials like copper foil. These interventions lead to notable temperature improvements, particularly at the SOC and panel control board areas. The impacts of switching LED driver frequencies and altering air gaps suggest further optimization. The overall analysis highlights that while the Thunderball’s thermal performance is superior to competitor models, collaboration with panel vendors is essential to maintain efficiency.

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Enhanced Thermal Management Solutions for Thunderball 11.6" Control Board

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  1. 2014 Thunderball RFQ Thermal Simulation Kenson Hung | Thermal Dept.

  2. Panel control board skin suggest Update Target To improve panel skin temperature of control board area. Suggest: 1. Enlarge Panel PCB size. PCB_200x10 mm change to 190x16mm, improve~2.0’C 2. Change Panel B/L structure materials to Al metal. SUS metal to Al, improve~1.5’C 3. Attach high thermal conductivity materials on Panel control board area. attach Cu foil, improve~3’C 4. Changing switching Freq. of LED Driver Freq. From 1MHz to 0.44MHz, improve~1.0’C

  3. Thunderball 11.6” Swap air gap Skin temperature of Glass surface is helpless if gap from 0.1 change to 0.15. Original solution Swap air gap 0.10.15mm CPU area_41.4’C CPU area_41.5’C Glass skin A cover skin CPU area_44.7’C CPU area_44.7’C Version

  4. Thunderball 11.6” Summary table Skin temperature of SOC area is over 5.8’C if SOC+DDR power =2.5W. ＊ Skin temp. better than other machine meet spec +6.0’C (spec △T=9’C) +5.8’C (spec △T=9’C) meet spec +6.9’C (spec △T=9’C) Note. Due to Android OS can’t running 3DMark so use play gaming and 1080P movie to estimate. Version

  5. T40S - Skin Solution for 2.5W Attach CU foil on panel & A cover. Attach Cu foil on between SOC and Shield Can. Glass View A cover View * Skin solution on panel side (for SOC area hot spot) Cu foil: 100 x 60 x 0.1 mm * SOC solution on shield Can pad : 14 x 14 x 0.5 mm 0809 Update: * SOC solution on shield Can Cu foil : 50 x 50 x 0.05 mm (For T40S 2.5W) * Skin solution on panel side (for panel control board hot spot) Cu foil : 150 x 50 x 0.1 mm-convertor * Skin solution on bottom door (for SOC area hot spot) Cu foil : 150 x 90 x 0.1 mm Version

  6. Detail Power Consumption Simulation Model SOC WIFI eMMC 3G SOC+DDR Power data is refer Nvidia Tegra 4 DA_06681-R17 PMIC Scenario 1 – play “Riptide” game mode: SOC+DDR 2.50w+0.35W=2.85 / Total System Power 8.38W Scenario 2 – 1080P movie mode : SOC+DDR 0.65W / Total System Power 6.15 W Battery DDR Version

  7. Thunderball 11.6” Stack-Up Analysis Add Cu foil on between CPU and Shield Can for 2.5W require. (Detail stack-up please refer to ME proposal) Version

  8. Thunderball 11.6” Skin temperature for 2.5W Scenario 1_play game mode: T-ambient 30’C Glass View A cover View SOC area_47.6’C SOC area_44.8’C Glass surface Spec=39’C Class 2 surface Spec=54C Class 1 surface Spec=39C Panel convertor_45.9’C Control board_38.8’C • Based on simulation: • Glass skin of SOCarea is over 5.8’C • Glass skin of panel converter is over 6.9’C • A cover skin is under spec. Version

  9. Thermal Skin suggest Target: All skin temperature under SVTP spec Suggest: 1. For SOC area, increase the gap between M/B and Panel to 3.5mm (original gap=1.5mm) 2. For Panel control board area, need Panel vendor to add solution or reduce power consumption of Panel.

  10. Thunderball 11.6” Compare other machine • Result: • Thunderball skin temperature is better than other machine w/ FHD panel. • Panel control board will impact skin temperature, need co-work with panel vendor to reduce control board temperature.

  11. Thunderball 11.6” Skin temperature with skin solution Scenario 2_1080P movie mode: T-ambient 30’C Glass View A cover View SOC area_38.3’C Glass surface Spec=39’C Class 2 surface Spec=54C Class 1 surface Spec=39C Panel convertor_45.0C SOC area_40.5’C • Based on simulation: • Glass skin of panel converter is over 6.0’C • A cover skin is under spec. Version

  12. Thunderball 11.6”T50 Thermal design 1. IF T50 power consumption & behavior ～T40S (thermal design Target 2.5W) T40 thermal solution can leverage to T50 2. IF T50 power consumption & behavior > T40S Solution a : attach Cu foil on Shielding case to improve thermal capacity. Solution b : attach thermal pad that transfer M/B heat to Mid frame

  13. Thanks Version

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