HFT PIXEL Progress
110 likes | 301 Vues
HFT PIXEL Progress. Face to Face 13 May-2009 Wieman. Sector structures. ladder fabrication and tooling. ladder fabrication and tooling. ladder fabrication and tooling. finalizing mechanical designs and developing rapid production methods. ladder fabrication and tooling. ladder with
HFT PIXEL Progress
E N D
Presentation Transcript
HFT PIXEL Progress Face to Face 13 May-2009 Wieman
ladder fabrication and tooling finalizing mechanical designs and developing rapid production methods
ladder fabrication and tooling ladder with silicon heater chips (50 m thick)
wire bonding 50 m silicon to flex PC vacuum chuck to secure flex and silicon flat against solid surface to remove bounce Any bounce then no bond Good News after a couple of minor modifications to the vacuum chuck the wire bonding machine is happy Rhonda is happy
Air cooling of silicon detectors – Computational Fluid Dynamics (CFD) analysis • Silicon power: 100 mW/cm2 (~ power of sunlight) • 240 W total Si + drivers air flow path – flows along both inside and outside surface of the sector
Air cooling – CFD analysis stream lines with velocity • air flow velocity 9-10 m/s • maximum temperature rise above ambient: 12 deg C • sector beam surface – important component to cooling • dynamic pressure force 1.7 times gravity silicon surface temperature velocity contours
Full sized cooling tests 9 inch diameter tube mocks up ISC Thermal camera window not shown > 300 CFPM air flow for verification of cooling capability dust collector for air supply Cooling tests will begin as soon as prototype sectors completed