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22 nd IEEE VLSI Test Symposium (VTS 2004) Napa Valley, CA

22 nd IEEE VLSI Test Symposium (VTS 2004) Napa Valley, CA. Welcome Message. André Ivanov General Chair. Keynote Address. Ulrich Seif Senior VP & Chief Information Officer National Semiconductor. Program Introduction. Irith Pomeranz Program Chair. The VTS Contents.

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22 nd IEEE VLSI Test Symposium (VTS 2004) Napa Valley, CA

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  1. 22nd IEEE VLSI Test Symposium(VTS 2004)Napa Valley, CA

  2. Welcome Message André Ivanov General Chair

  3. Keynote Address Ulrich Seif Senior VP & Chief Information Officer National Semiconductor

  4. Program Introduction Irith Pomeranz Program Chair

  5. The VTS Contents • Technical Paper Sessions • Special Sessions • Innovative Practices Track

  6. Technical Paper Selection • Expert reviewers recommended by the program committee • At least three reviews for every submitted paper • Multi-site program committee meeting (Fremont, CA; Princeton, NJ; Stuttgart, Germany)

  7. Thanks • 38 program committee members • 13 organizing committee member • 7 steering committee members • 237 reviewers • 747 reviews

  8. >2000 e-mail messages

  9. Special Thanks • Program committee members • Hans Manhaeve • Subhasish Mitra • Sudhakar Reddy • Organizing committee members • Pritha Roy • Burnie West

  10. Technical Paper Sessions Test Data Compression & Low-Speed ATE Memory Testing I,II Issues in Reliability Current Based Testing Logic BIST MEMs Testing and FPGA Testing Wireless and System Testing SoC Testing Pattern Debug, Yield Analysis and FPGA Testing Low-Voltage and Thermal Testing DelayTesting Defect-Oriented Testing Analog Testing I,II,III Defect Analysis and Fault Simulation

  11. Silicon Debug and Diagnosis Test and Repair of Large Memory Systems Test Compression Latest Results in Wireless Test SoC Test Practice in Japan Leading Edge Practices for Yield Enhancement Optimizing Manufacturing Process IP Track

  12. Special Sessions • Embedded Tutorials: • Challenges in Embedded Memory Test and Diagnosis • Advances in Wafer Probe Test • Reliability and Dependability • Design for Yield • Design for Manufacturability • Hot Topics: • Testing of Nanocircuits with High Defect Densities • Advances in 3D Packaging • Software Based Embedded Test • Panels: • Elevator Talks • Process Variation: How Severe is the Problem of D&T? • Defect-Based Testing and Burn-In: A Test Solution for Scaled Technology?

  13. Invited Keynote Kamalesh Ruparel Senior Director Cisco Systems

  14. TTTC Ned Kornfield Memorial Presentation Yervant Zorian TTTC Senior Past Chair

  15. Awards

  16. TTTC Naveena Nagi Award

  17. TTTC Most Successful Technical Meeting Award

  18. TTTC Most Populous Technical Meeting Award

  19. VTS 2003 Best Paper Award

  20. VTS 2003 Best Panel Award

  21. VTS 2003 Best IP Session Award

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