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The DoD is enhancing its SATCOM capabilities by integrating advanced On The Move (OTM) technologies into ground vehicles like the EFV, leveraging the existing DSCS X-Band network. This project addresses the need for low-cost ground terminals that support OTM operations, moving beyond traditional dish and reflector systems. By developing affordable phased array systems, the DoD can ensure effective communication in current and future conflicts. Key deliverables include monthly reports and a comprehensive final report demonstrating the effectiveness of X-Band communications under $50K production costs.
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Company Name: FIRST RF Corp.Topic Name: On The Move (OTM) Ku/Ka SATCOM Capability for the EFV Contract : M67854-08-C-0026 Operational Payoff/Transition Targets: The DoD has traditionally relied on commercial satellite service providers for satellite communications capability in recent conflicts. The DoD now has the DSCS (X-Band) satellite capability to provide this service, however technologies enabling low cost ground terminals compatible with the DSCS network have not been developed. To take full advantage of the DSCS network, ground terminals must be developed supporting On The Move link capability. Traditional ground terminal SATCOM technologies are based on dish and reflector antenna solutions which are not compatible with OTM requirements. The development of low cost phased array systems will enable the DoD to integrate SATCOM capability on the EFV as well as other ground vehicles playing a critical role in today and future conflicts. Deliverables: Monthly reports, demonstration test report and final report X-Band array system provides low cost SATCOM communications capability Technical Objective Demonstrate a low cost X-Band SATCOM communications capability Technology Challenges Meet performance (G/T & EIRP) requirements with system production cost of less than $50K Technical Approaches: Perform trade studies between several FIRST RF dual polarized antenna technologies. Develop TX and RX module technologies with OTS components. Integrate antenna and module technologies to produce modular stackable sub-arrays to realize large array architecture. Phase 1 Phase II Option/Enhancement 02/07 – 08/07 07/08 – 09/10 04/11 - TBD FIRST RF Contact Info: Dave Massey, cdmassey@firstrf.com, (303) 449-5211 x160