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Endcap Muons

Endcap Muons. John Layter US CMS Collaboration Meeting May 19, 2001. Outline. Muon System Overview CSC Production FAST Sites Electronics Progress Integration and Installation CPA, ETC Plans for the next six months Summary. CMS Endcap Muon System.

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Endcap Muons

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  1. Endcap Muons • John Layter • US CMS Collaboration Meeting • May 19, 2001

  2. Outline • Muon System Overview • CSC Production • FAST Sites • Electronics Progress • Integration and Installation • CPA, ETC • Plans for the next six months • Summary

  3. CMS Endcap Muon System • 360 CSCs, not counting ME1/1 and ME4 • 144 Large CSCs (3.4x1.5 m2): • 72 ME2/2 chambers • 72 ME3/2 chambers • Small CSCs (1.8x1.1 m2): • 72 ME1/2 chambers • 72 ME1/3 chambers • 20o CSCs (1.9x1.5 m2): • 36 ME2/1 chambers • 36 ME3/1 chambers • Frontend Electronics: • 170K Cathode channels • 140K Anode channels • Trigger&DAQ • (on-chamber part) • Alignment&Services

  4. Endcap Muon System

  5. EMU - Yearly BCWS • FY01 is the second largest year of EMU funding: • Production of chambers at Fermilab at nominal rate • Purchasing of significant part of FE electronics • Finalization of integration and installation design

  6. EMU Chamber Status • Fermilab Site (Panels for 410 CSCs; Assembly of 148 Large CSCs): • Panel production since 5/99; 52% of chambers done; on schedule • CSC assembly since 6/00; 32/148 large CSCs done; ~2 wks late • UF and UC Sites (Final Assembly and System Tests of Large CSCs) • First 5 CSCs arrived at UC and UF; long term HV test will start • Begin mounting and testing electronics 9/01, ~3 mo. late • Delivery of on-chamber electronics is on critical path • PNPI Site (114 smaller CSCs) • Critical tooling commissioned; 2 chambers assembled • PRR—June 7-8; start production in August • IHEP Site (148 smaller CSCs) • Critical tooling arrived, being commissioned, begin assembly • PRR—July 30-31; start production in September

  7. FNAL Factory Status - Chamber assembly at MP9 • 32 large CSCs assembled by May 2001 • > 20% complete • Production ~ at nominal rate • ~ On schedule

  8. Chamber Assembly Gluing Station (anode bars, gap bars are glued to panels) Winding Station (wires are wound directly on panels) Soldering Station (automated soldering of wires) Wire Tension/Spacing Station (tension and spacing of wires are checked) Ionized Air Knife Station (dust is removed from wires and panels) Assembly Station (panels are stacked to make chamber)

  9. CSCs at UC FAST Site

  10. CSCs at UC FAST Site

  11. CSC Production at PNPI Preproduction Prototype (P3) assembled at PNPI

  12. CSC production at IHEP • Critical tooling received Wire Tension measurement machine

  13. Functions of Electronics • Acquire precise muon data for offline analysis • Cathode strips: precise azimuthal position (in bending plane) in each layer by interpolation of induced strip charges. • Anode wires: precise timing and coarse radial position. • Generate primitives for Level 1 trigger • Identify Local Charged Track (LCT) segments using cathode and anode signals.

  14. Electronics System Layout

  15. Radiation Tolerance Tests • Measure Single Event Upset (SEU) and Total Ionization Dosage (TID) effects with 63 MeV proton beam at UC Davis. • Measure effects due to Displacement damage of bipolar and biCMOS with 1MeV neutrons at OSU. • Results: • Negligible degradation of analog performance due to TID (>10kRad) or displacement (2x1012 cm-2 neutrons). • No latch-ups observed up to p fluence of 2x1012 cm-2. • SEUs in FPGAs observed and cross sections measured. All SEUs recoverable by reloading FPGAs. SEU rate at peak LHC luminosity manageable for CFEB, but higher for ALCT.

  16. On-chamber Electronics I • Three out of four on-chamber boards designed and tested: • Cathode Front End Board (CFEB) • Anode Front End Board (AFEB) • Low Voltage Distribution Board (LVDB) • Most of the components for these boards (excluding rad hard LV-regulators) procured in quantities sufficient to start production • Production costs at or below estimates

  17. On-chamber Electronics II • LV-regulators (CERN design, standard for LHC experiments) are not available. Will define the schedule of production of CFEB and LVDB. On critical path • ALCT being redesigned using Xilinx FPGA (faster reloading) to deal with SEU problem. Preproduction boards to be delivered by September 2001. On critical path

  18. Status of On-chamber Boards

  19. Off-chamber Electronics • Progress made on next round of prototype boards and on VME custom backplane. • Updated versions of the prototype boards will be delivered to the FAST sites during this summer. • These will be used for tests of mass-produced on-chamber electronics assembled with chambers.

  20. Integration & Installation • Infrastructure: • Walkways • Piping, cooling, cabling • Chamber mounting • Installation: • Fixture • Strategy • Schedule

  21. Mounting Detail

  22. Chamber Mounts

  23. Mounting Precision

  24. Integration and installation design • EMU integration design advanced (mechanical, gas, cooling, power) • Installation procedures • being defined • Installation fixture • fully designed and built

  25. CSC installation fixture Counterweight movement keeps balance w/ or w/o chamber Chamber can rotate at any angle Counterweight

  26. Chamber Production and Installation Schedule (V31) • CMS Schedule V31: Installation of all CSCs on the surface at SX5, beginning in 2002. • Very tight, advanced by ~1 year compared to V30. Pressure on production and installation rate.

  27. EMU Critical Path Analysis - I • FY01: Delivery of on-chamber electronics is on the critical path: • ALCT Board redesign and start of production • Rad Hard Voltage regulators:  CFEB, LVDB production • FY02: CSC assembly at FAST sites and installation at CERN is on the critical path

  28. EMU Critical Path Analysis - II • FY03: CSC Installation (station ME3) is on the critical path: • short installation window (two shifts necessary) • FY04: CSC Installation (station ME1) is on the critical path: • RPCs must be installed before CSCs • HE, EE, SE, ME1/1 cables should be installed before CSCs • Short installation windows (two shifts) • Available Slack analysis: ~25-30 working days in 2002. Very tight in 2003 –2004. Need two shifts for production at IHEP and ME1/2,3 installation

  29. EMU – Estimate to Complete • EMU Estimate to Complete: 18.9 Actual Year M$ • Dominated by M&S (mostly electronics)

  30. Plans for the Next 6 Months • Continue CSC production at Fermilab. • Start production at PNPI and IHEP. • Continue FE electronics production. • Start electronics assembly and begin chamber tests at FAST sites. • Complete integration drawings for all chamber types. • Begin preparations for receiving and installing chambers at CERN.

  31. Summary • Nominal rate of chamber production at FNAL achieved. Chamber production on schedule. • FE electronics production started; first cost experience positive. • LV-regulators and trigger boards on the critical path; defines beginning of assembly at FAST sites. • Endcap infrastructure designed; installation fixture exists. • Adequate base program support is critical to maintain the schedule.

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