High-Quality Solder Pot: Optimal Performance for SMT & THT Applications

Jan 12, 2026

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Discover the benefits of our advanced solder pot designed for both Surface Mount Technology (SMT) and Through-Hole Technology (THT) applications. Engineered with high-quality materials and a multi-level surface treatment, our solder pot ensures no reaction with solder, maximizing efficiency and minimizing waste. It offers versatile nozzle combinations ideal for varying throughput requirements. Achieve superior results in both normal and nitrogen atmospheres, reducing dross and enhancing productivity. Service-friendly design ensures easy maintenance.

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High-Quality Solder Pot: Optimal Performance for SMT & THT Applications

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Presentation Transcript

Soldering Zone
Solder Pot • Solderdoes not reactwiththepot • Service friendly • High-quality materials • Surfaceshave a multileveltreatment
Different Nozzel Combination • For all applications and throughput requirements • For SMT and THT applications
NitrogenAdvantages • Resultsunder normal atmosphere • Resultsundernitrogenatmosphere Quelle: FhG ISIT Quelle: FhG ISIT Quelle: FhG ISIT Quelle: FhG ISIT
Nitrogen • Withsolderpotcover
100% 80% 60% 40% 20% 0% 25 75 200 1200 20000 120000 210000 O [ppm] 2 Dross Generation Krätzeentwicklung [%] • Dross is wasted money
Wave Soldering