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Advanced Strip Sensor Design with Optimized Chip Alignment and Coverage

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This document outlines the general features of a cutting-edge strip sensor design. The strip pitch measures 75 µm, incorporating 128 chip channels with a total chip width of 9600 µm. The forward disk radial coverage ranges from 17.0 to 4.5 cm across 13 chips, organized into 48 wedges with a 7.5º coverage angle each. The design includes inner and outer wedges, allowing effective placement on a 4" wafer. This architecture emphasizes precision and efficiency in particle detection and sensor performance.

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Advanced Strip Sensor Design with Optimized Chip Alignment and Coverage

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  1. FVTX Strip Sensor Design General features: • Strip pitch = 75 µm • # chip channels = 128;  chip width = 128 x 75 µm = 9600 µm • Forward disk radial coverage (cca) = 17.0 – 4.5 cm = 12.5 cm • # of chips = 12.5 cm/0.960 cm = 13 chips • azimuthal coverage is by 48 wedges; each wedge covers angle of 7.5º + 2 x 0.5 mm overlap • each wedge consists of two symmetric parts (each covering 3. 75º) + 2 x 0.5 mm overlap • to place on 4” wafer: 2 types of wedges are needed: inner and outer (next page) • the inner wedge is 7 chips long in the radial direction, the outer wedge is 6 chips long Vaclav Vrba, Prague

  2. Narrow and wide wedges Four inner wedges on a wafer Three outer wedges on a wafer Vaclav Vrba, Prague

  3. Inner and outer wedges inner outer Vaclav Vrba, Prague

  4. Wedge layout Zoom in … one chip bonding pads testing pads (both staged) Guard ring Cutting edge Vaclav Vrba, Prague

  5. 4 chips prototype Zoom in … a) one chip b) Cutting edge Vaclav Vrba, Prague

  6. 6 inches wafer – 3 wedges Vaclav Vrba, Prague

  7. 6 inches wafer – 4 wedges Vaclav Vrba, Prague

  8. Conclusions • ccc Vaclav Vrba, Prague

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