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„ Prototyping the CBM Micro Vertex Detector” Group report Michal Koziel

„ Prototyping the CBM Micro Vertex Detector” Group report Michal Koziel Goethe-Univiersität , Frankfurt f or the CBM-MVD collaboration m.koziel@gsi.de. Outline. CBM experiment and its requirements Sensor development towards the CBM Micro Vertex Detector Prototyping the CBM-MVD

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„ Prototyping the CBM Micro Vertex Detector” Group report Michal Koziel

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  1. „Prototyping the CBM Micro Vertex Detector” Group report Michal Koziel Goethe-Univiersität, Frankfurt for the CBM-MVD collaboration m.koziel@gsi.de

  2. Outline • CBM experiment and its requirements • Sensor development towards the CBM Micro Vertex Detector • Prototyping the CBM-MVD • Mechanical integration • Readout electronics and DAQ • Data analysis • Outline & summary

  3. The MVD – required performances • CBM-MVD will: • improve secondary vertex resolution • background rejection in di-electron measurements • host highly granular silicon pixel sensors featuring fast read-out, excellentspatial resolution and robustness to radiation environment. MVD

  4. Research fields towards the MVD Sensor R&D Sensor R&D Mechanical integration System integration DAQ Prototype highlights: Data analysis • Provide cooling and support with low material budget employing advances materials • Develop sensor readout system capable to handle high data rates

  5. Sensor R&D

  6. Technology of choice: MAPS

  7. Progress in CMOS sensor development HR EPI 0.18 μm CMOS Standard EPI 0.35 μm CMOS HR EPI 0.35 μm CMOS

  8. Non-ionizing radiation tolerance Low resistivity EPI 10 Ω∙cm Shown: DPG Mainz 2012 HK 12.8 To be published in NIM A High resistivity EPI 1 kΩ∙cm High resistivityepitaxiallayerincreasesradiationhardnessbyone order ofmagnitude

  9. Ionizing tolerance Covered by Dennis Doering: the same session ! Presentation:HK 9.5: Montag, 4. März 2013, 12:15–12:30, HSZ-405 This session

  10. Mechanical integration Poster: HK 52.14: Mittwoch, 6. März 2013, HSZ 2.OG

  11. Progress towards the MVD Prototype Demonstrator >2015 Wire bonds 4 sensors ½ (!) of 1st station Flex Cable 200 µm Encapsulation ...will meet all requirements Final 2012 2010 2008 Sensor 50 µm Sensor: MIMOSA-20 ~200 frames/s few 1011neq/cm2 & ~300 kRad 750µm thick Sensor: MIMOSA-26 AHR ~10 kframes/s ~1013 neq/cm2& >300 kRad 50µm thin Sensor: synergy with ALICE (diff. geometry) FEB Readout speed: ~30 kframes/s Al heat sink Radiation tol.: >1013 neq/cm2& >1 Mrad 200 µm Glue Readout Serial/analog Readout CP/digital/high data rates FEB CVDdiamond Cooling & support: pCVD diamond(thermal grade) Cooling & support: TPG+RVC foam Material budget: ~ 2.45 % X0 Material budget: ~ 0.3 % X0

  12. Sensors for the MVD prototype MIMOSA-26 AHR: 0.35µm process, High Resistivity (HR) EPI (1 kΩ·cm) • Main features: • in pixel amplification • binary charge encoding • - discriminatorfor each column • - 0-suppression logic • pitch: 18.4μm • ∼ 0.7 million pixels 21.2 x 10.6 mm2

  13. Aspects addressed during prototyping phase Back scintillator Sensor integration on CVD diamond: Sensor Plane 4 • Adhesive bonding FPC Glue • Positioning DUT Plane 3 Carrier • Wire bonding r/o • Encapsulation T4 • Cooling optimization DUT micro-tracking T3 Double sided sensor integration Micro-tracking • Readout& control • Scalability • Reliability FPC Plane 2 T2 Plane 1 Beam T1 FPC Front scintillator Cooling FPC

  14. Test beam setup at Beam T3 T4 T1 T2 DUT 200 μm CVD diamond 1mm Al Material budget: 0.053 % X0 Material budget: 0.053 % X0 200 μm CVD diamond

  15. DAQ Poster:HK 52.1: Mittwoch, 6. März 2013, HSZ 2.OG

  16. Dedicated DAQ sensors based on MIMOSA-26 clock start reset JTAG FPC FPC FPC FEB FEB FEB driver board . . . LVDS, 1m 4x 80 Mbit/s (MIMOSA-26) converter board converter board converter board . . . LVDS 4x 80 Mbit/s readout controller board readout controller board Slow control board ~30 m readout controller board Hub readout controller board . . . 2 Gbit/s optical fiber to the MVD network General purpose add-on PC HADES TRB V2

  17. Tests before beam time • Stability runs • Slow control cross-check • Tests with radioactive sources • Threshold scans • Cooling check • Test with long cables • ... Laboratory setup Fully operational setup ready for travelling to CERN

  18. Full beam setup at SPS Beam telescope FEE DAQ Huber cooling system

  19. DAQ performance during beam tests 8 s 40 s CERN-SPS Spill structure 12 sensors running in parallel All sensors are synchronized: No deviations detected within 10 ns precision. ~8 s 110 ms 260 259 Frame number Frame number • DAQ runs very stable:No network errors, no data loss (5 days of tests) • Datarates: 6 MB/s - 25 MB/s but also overload test with +100 MB/s. • JTAG passed also all tests (100 000 programming cycles per chain). • In total 2TB of data stored The Readout Network was proven to be highly scalable.

  20. Data analysis Poster: HK 52.13: Mittwoch, 6. März 2013, HSZ 2.OG

  21. Data analysis Beam setup 20 – 120 GeVPions CERN SPS North Hall beam • Detection efficiency, Fake Hit Rate, Spatial resolution as a function of threshold voltage (DUT) • 4 inclination angles of 0 ,30 ,45, 60 • Temperature (-6, +6, +17 C) & threshold scans • High beam intensity runs (in average up to 10 hits/frame but due to the non-uniform beam it could also be ~100 hits / some of frames – to be confirmed) DUT =5.5 μm Plane 1 Plane 2 Plane 3 Plane 4 Data analysis flow: Cluster analysis 3D alignment Track selection with the 4-plane telescope (straight lines) Response of DUT to charged particles [Pixel pitch] 1 -> 18.4 μm

  22. Cluster shape studies Top 8 most frequently observed cluster shapes 5 7 8 6 3 4 1 2 Cluster classification will be used for further FPGA-based data compression Center of gravity used to compute the “hit” position

  23. Cluster multiplicity studies

  24. Detection Efficiency (DUT) signal Amplitude noise V threshold probe time NOISE = individual pixel feature V threshold Example: FHR < 10-5 Efficiency > 95% „safe” region

  25. Spatial Resolution (DUT) Spatial resolution: DUT only Correlation back - front • Resultforthe DUT: • σx= 3.3 µm FEB Al heat sink π- X (row) back sensor 200 µm Front sensor Reproducing the intrinsic parameters of the sensors validates the concept of the prototype. FEB Back sensor X (row) front sensor

  26. Outlook & summary p. 1 • Achieved: • Radiation tolerance of CMOS sensors meets the requirements of the CBM experiment concerning SIS-100 scenario. • Towards the CBM-MVD: • Readout time needs further improvements. Sensor R&D • Achieved: • An ultra low material budget (0.3% X0) double-sided micro-tracking device: 2x2 sensors, CVD Diamond, glue & FPC. • Development of tools & assembly procedures. • Towards the CBM-MVD: • Vacuum compatibility and integration into the CBM-MVD vacuum box • design the MVD platform in the target vacuum chamber • cable routing • finalize services (LV, cooling) • Improve in heat transfer. • Quality assurance while assembling (yields) Mechanical integration

  27. Outlook & summary p. 2 DAQ • Achieved: • Synchronization • Reliability • Scalability • Slow control & monitoring tools • Data quality • Towards the CBM-MVD: • Interface to the CBM DAQ • Optical data link between FEE and DAQ board • Achieved: • package for alignment and data analysis for test beam setup (telescope-DUT) • online monitoring software (test beam setup) • Towards the CBM-MVD: • Optimizing the digitizer based on data on sensor response • Performance studies of physics cases allowing for more realistic studies on detector performance Data analysis The successful test beam time validates the integration and readout concept, and concludes the prototype phase of the CBM-MVD plane 1&2

  28. Thank you for your attemtion ! Thank you for your attention...

  29. BACKUP

  30. Detector stations at the beam setup Setup: Telescope & DUT T2 Scint. 2 Scint. 1 DUT T1 T3 T4 *) no material in active area, cut-out **) conservative estimation of glue thickness Note: Beam: 20, 60, 120 GeV/c pions Telescope: 2 setups used, compact (shown) and stretched (s. front page). Beam

  31. How to integrate all those things ? CVD Al

  32. Tools ZOOM

  33. Bond encapsulation Wire bond encapsulation • Soft, silicon-based elastometerSylgard 186 • Used at CMS experiment at LHC. • Yield after encapsulation = 100 % (16 sensors)

  34. Which glue ? • Best: • High thermal conductivity • Easy to rework • Radiation tolerant • Strong • With low material budget • Low outgassing …a pity that such an adhesive does not exist.. Epotecny E505 Epotecny E501 Thor Labs S-10 High viscosity Medium viscosity Low viscosity Selected for prototype phase Sensor integration: Michal Koziel => m.koziel@gsi.de

  35. Underfilling “L-shape” adhesive Sensor (Si USA dummy -> Mimosa-26) 50-100 m separator (glue dot without metal filler) Support (glass -> CVD diamond) Pros & cons: Thermal management Reworkability Material budget ?

  36. Underfilling – problems to address Problem 1 sensor adhesive support Bonding is impossible Problem 2 Minimum sensor to support distance allowing glue dispersion glue thickness material budget

  37. Channeling Sensor (Si USA dummy -> Mimosa-26) Adhesive without metal filler Support (glass -> CVD diamond) Pros & cons: Thermal management Reworkability

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