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Nanosilver Technology for Miniaturized Electronics: High-Density Circuits & Modular Construction

Explore the world of nanosilver technology for miniaturized electronics featuring fine-feature conductors, encapsulated components, and stretchable circuitry. This innovative approach allows for quick and cost-effective prototyping, high component density, and rugged design, all while minimizing dead volume and enabling easy subsystem testing. Discover the advantages of embedded nanoparticle silver conductors and how they simplify fabrication processes, reduce layer count, and offer a green, additive approach to circuit design. From wearable sensors to miniature systems utilizing readily available components, this technology offers a versatile and efficient solution for low-volume production and simplified manufacturing scale-up.

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Nanosilver Technology for Miniaturized Electronics: High-Density Circuits & Modular Construction

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  1. Electronics Miniaturization using Fine-Feature Nanosilver conductors • Fine feature (<10 microns) trace/space capability • Maximum component density • Fully encapsulated silver conductors • Quick, inexpensive prototyping • Encapsulated component blocks • Rugged/robust • Minimize dead volume • Easy test of subsystems • Low Capital Equipment Costs

  2. Nano-silver conductor fabrication Laser ablate channels 1. 1st Squeegee Fill 5. Full oven cure Pulsed UV laser 2. Low T bake 4. Residue removal 3. 2nd Squeegee Fill Conductor resistivity ~ 3X bulk Ag Finished circuit

  3. Embedded nanoparticle silver conductors • Nanoparticle conductor advantages: • Eliminate photolithography • Conductor width limited only by laser focal spot size. • <10 micron trace/space demonstrated • Controllable aspect ratio • Additive, green process Embedded conductor Conventional conductor

  4. Substrates: Polyimide • ABF • LCP • MicroLam • Mylar • Alumina • 15 micron traces • Two sides with via

  5. Stretchable conductors Embedded conductor Polyimide

  6. Quasi-conformal circuitry Sensor MCU Stretchable circuits connect miniature modules • Wearable sensors • Conform to irregular shapes Embedding in elastic polymer 6

  7. Fine pitch coil on 1 mm tube

  8. High packing density 0201 resistors > 1000 components/cm3 8

  9. Narrow traces reduce layer count and cost Nanosilver • 2 layers • 15 to 30 micron traces • $1000 for first 10 substrates • 1 day turnaround Conventional copper • 4 layers • 75 micron traces • $7800 for first 10 substrates • 12 day turnaround 8 mm 12 mm

  10. Miniature systems using readily available SMT components • Low cost ASIC equivalent • Adaptable to prototyping/low volume production • Simple manufacturing scale-up

  11. Miniature module fabrication • Encapsulate components • Fabricate fine feature interconnects on thin substrates • Nanoparticale silver conductors • Laser direct-write processes • Connect components using conductive adhesives

  12. Component Encapsulation SMD Carrier film Mold Encapsulant Flat surface Exposed pads

  13. Thermal cycling tests -50C to +150C Testing of 50-component Daisy Chains Conductive epoxy Silver traces and pads 0 ohm surface mount resistor -50 C to 150 C 10 minute cycles Microvia Underfill Chain resistance vs time 500 cycles/no failure

  14. Using the modules Solder connection FR4 or Flex 3D stand alone assemblies Miniature subsystems connecting to PCB’s or cables

  15. Body orientation sensor • Accelerometer/magnetometer • Wireless transceiver • Modular construction • Mount on helmet • 20mm x 25mm footprint • Powered by coin cell Radio Programming cable (temporary) MCU/Sensor module

  16. 9-axis wireless motion sensor Miniature wireless sensors Radio Sensor module Radio Sensor module Microcontroller Microcontroller Battery Battery

  17. Smart cable

  18. Capital Equipment Required Paste fill & clean station Encapsulation mold Integrated Laser/PnP/Dispense

  19. Capital Equipment NOT required Resist exposure system Etching/Plating tanks Lamination Press Resist stripper

  20. Scaling to higher volume Encapsulation mold Epoxy Dispenser UV laser system Pick and Place Paste fill & clean station

  21. Summary • Highly miniaturized circuits using nanosilver conductors • Simplified design and fabrication • Modular construction • Quick/inexpensive prototyping • Green processes • Minimal capital equipment

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