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Electronics Miniaturization using Fine-Feature Nanosilver conductors

Electronics Miniaturization using Fine-Feature Nanosilver conductors. Fine feature (<10 microns) trace/space capability Maximum component density Fully encapsulated silver conductors Quick, inexpensive prototyping Encapsulated component blocks Rugged/robust Minimize dead volume

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Electronics Miniaturization using Fine-Feature Nanosilver conductors

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  1. Electronics Miniaturization using Fine-Feature Nanosilver conductors • Fine feature (<10 microns) trace/space capability • Maximum component density • Fully encapsulated silver conductors • Quick, inexpensive prototyping • Encapsulated component blocks • Rugged/robust • Minimize dead volume • Easy test of subsystems • Low Capital Equipment Costs

  2. Nano-silver conductor fabrication Laser ablate channels 1. 1st Squeegee Fill 5. Full oven cure Pulsed UV laser 2. Low T bake 4. Residue removal 3. 2nd Squeegee Fill Conductor resistivity ~ 3X bulk Ag Finished circuit

  3. Embedded nanoparticle silver conductors • Nanoparticle conductor advantages: • Eliminate photolithography • Conductor width limited only by laser focal spot size. • <10 micron trace/space demonstrated • Controllable aspect ratio • Additive, green process Embedded conductor Conventional conductor

  4. Substrates: Polyimide • ABF • LCP • MicroLam • Mylar • Alumina • 15 micron traces • Two sides with via

  5. Stretchable conductors Embedded conductor Polyimide

  6. Quasi-conformal circuitry Sensor MCU Stretchable circuits connect miniature modules • Wearable sensors • Conform to irregular shapes Embedding in elastic polymer 6

  7. Fine pitch coil on 1 mm tube

  8. High packing density 0201 resistors > 1000 components/cm3 8

  9. Narrow traces reduce layer count and cost Nanosilver • 2 layers • 15 to 30 micron traces • $1000 for first 10 substrates • 1 day turnaround Conventional copper • 4 layers • 75 micron traces • $7800 for first 10 substrates • 12 day turnaround 8 mm 12 mm

  10. Miniature systems using readily available SMT components • Low cost ASIC equivalent • Adaptable to prototyping/low volume production • Simple manufacturing scale-up

  11. Miniature module fabrication • Encapsulate components • Fabricate fine feature interconnects on thin substrates • Nanoparticale silver conductors • Laser direct-write processes • Connect components using conductive adhesives

  12. Component Encapsulation SMD Carrier film Mold Encapsulant Flat surface Exposed pads

  13. Thermal cycling tests -50C to +150C Testing of 50-component Daisy Chains Conductive epoxy Silver traces and pads 0 ohm surface mount resistor -50 C to 150 C 10 minute cycles Microvia Underfill Chain resistance vs time 500 cycles/no failure

  14. Using the modules Solder connection FR4 or Flex 3D stand alone assemblies Miniature subsystems connecting to PCB’s or cables

  15. Body orientation sensor • Accelerometer/magnetometer • Wireless transceiver • Modular construction • Mount on helmet • 20mm x 25mm footprint • Powered by coin cell Radio Programming cable (temporary) MCU/Sensor module

  16. 9-axis wireless motion sensor Miniature wireless sensors Radio Sensor module Radio Sensor module Microcontroller Microcontroller Battery Battery

  17. Smart cable

  18. Capital Equipment Required Paste fill & clean station Encapsulation mold Integrated Laser/PnP/Dispense

  19. Capital Equipment NOT required Resist exposure system Etching/Plating tanks Lamination Press Resist stripper

  20. Scaling to higher volume Encapsulation mold Epoxy Dispenser UV laser system Pick and Place Paste fill & clean station

  21. Summary • Highly miniaturized circuits using nanosilver conductors • Simplified design and fabrication • Modular construction • Quick/inexpensive prototyping • Green processes • Minimal capital equipment

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