High-Density Design Component Solutions: Addressing Technology Challenges and Market Drivers
This document explores the evolving landscape of high-density design component solutions, focusing on critical technology challenges such as the need for smaller, faster, and more efficient circuits. It highlights how advancements in SMT, integration of passive components, and reduced PCB sizes can significantly lower production costs while enhancing performance. By utilizing smaller footprint components like ceramic chip capacitors and resistor arrays, designers can achieve greater functionality and efficiency in limited space. The interplay between component design, integration, and market demand shapes the future of electronic devices.
High-Density Design Component Solutions: Addressing Technology Challenges and Market Drivers
E N D
Presentation Transcript
HIGH DENSITY DESIGN COMPONENT SOLUTIONS
Technology Challenges • Market Drivers: • Make it smaller • Make it operate faster • Make it more efficient • Make it cheaper
Technology Challenge Smaller Circuits Design: Higher levels of circuit integration on silicon Use of smaller foot print components + Components can be placed closer together - Closer the components get to each other, the more unwanted signal noise coupling occurs • SMT 0603 – 0402 • CERAMIC CHIP CAPACITORS • CHIP RESISTORS • FERRITE CHIP BEADS • INDUCTORS
Technology Challenge Faster Speed of Operation: More done in shorter amount of time Higher complexity of functions & display + Smaller SMT Components Can Function at Higher Speeds. - Distances between components and traces become significant factors in limiting performance and creates need for control of signal integrity. MHz 1200 800 600 400 • SMT 0603 – 0402 • CERAMIC CHIP CAPACITORS • CHIP RESISTORS • FERRITE CHIP BEADS • INDUCTORS
Technology Challenge Less Power Consumed: More features using less power Thinner barrier silicon IC chips = lower voltage operation = less energy needed. + SMT Passive Components can function at lower voltages - Lower voltage IC have reduced tolerance to spikes – transients. Higher level of transient and noise control is required = more passive components needed (capacitors and TVS devices) - Lower ESR (lower loss) components needed • CERAMIC CHIP CAPACITORS • MLV – VARISTORS • LOW ESR ALUMINUM & TANTALUM CAPACITORS
Technology Challenge Reduced Cost of Products: • Reduce size of PCB = less cost • Use SMT = faster production and reduced cost to build • Reduce component count by component integration • Use smaller size components (less raw material = less $$$) + Many SMT Passive Components cost less than leaded equivalents + Integrated (multiple element passives) reduce board space and place costs • CERAMIC CHIP CAPACITORS & ARRAYS • CHIP RESISTORS & ARRAYS • FERRITE CHIP BEADS / INDUCTORS • PASSIVE ARRAYS (IPC)
Component Solution: Component Size Reduction NRC SERIES CHIP RESISTORS SMT Component Size 0201 • 0201 • NMC SERIES CERAMIC CHIP CAPACITORS NIN/NIS SERIES CHIP INDUCTORS 0805 0603 0402 0201 12mm 3mm NACxx SERIES SMT ALUMINUM ELECTROLYTIC CAPACITORS
Integrated Component Solution: Resistor Arrays High Density Design Solutions: Component Size Reduction and Integration Get More Components In Less Space 2 OR 4 OR 8 ELEMENTS CHIP RESISTORS 10 PIN 8 ELEMENTS 4 PIN 2 ELEMENTS NRSN SERIES RESISTOR ARAYS REPLACE WITH
Thick Film Resistor Arrays High Density Design Solutions: Component Size Reduction and Integration Quad flat pack or PLCC package IC 0.5mm (0.20”) ”) ~ 1.27mm (0.39”) pitch Four ‘0603’ resistors (1.6mm X 0.6mm each) Typically 0.2~0.5mm space between parts (3.0mm X1.6mm total) Component size, spacing, land patterns and connection layout takes up valuable board space! Placing four components = $$$$ 103 103 103 103 NRSNA4I2 Quad flat pack or PLCC package IC NRSNA4I4 0.5mm (0.20”) ~ 1.27mm (0.39”) pitch SUPERIOR PERFORMANCE IN HIGH SPEED CIRCUITS! 103 0.5mm (0.20”) pitch (Same or less pitch as IC!) ‘0804’ resistor arrays (2.0mm X 1.0mm total) NIC P/N: NRSNA4I4 Far less board space used and short connection layout frees up valuable board space! Placing one component = ¼ the placement cost = $$$ saved!
Integrated Component Solution: Capacitor Arrays High Density Design Solutions: Component Size Reduction and Integration Get More Components In Less Space NCA SERIES CAPACITOR ARRAY 1 PART: 4 ELEMENTS 1206 SIZE 4 ELEMENTS CERAMIC CAPACITORS REPLACE WITH
Integrated Component Solution: Capacitor Arrays High Density Design Solutions: Component Size Reduction and Integration 0603 Ceramic chip capacitor = ~$6/1000 = 0.6¢ each… 4 parts = 2.4¢ total. Placement cost = 0.5¢ ~ 5¢ each (industry estimates) lets say it's 2¢ per part = 8¢ for 4 parts. Total cost of 4 ceramic chip capacitor elements =10.4¢ Total board area = 1.6mm X 4.7mm = 7.52mm² C1 C2 C3 C4 1.6mm 4.7mm C1 C2 C3 C4 1.6mm 3.2mm • 4 Element capacitor array = ~$40/1000 = 4.0¢ each… 1 part = 4.0¢ total. Placement cost = 0.5¢ ~ 5¢ each (industry estimates) lets say it's 2¢ per part = 2¢ for 1 part. • Total cost of 4 ceramic chip capacitor elements = 6.0¢(42% savings) • Total board area = 1.6mm X 3.2mm = 5.12mm²(32% smaller) • Capacitor Array Benefits = Lower total cost and less board space used!
Integrated Component Solution: Passive Component Arrays High Density Design Solutions: Component Size Reduction and Integration Get More Components In Less Space SUPERIOR PERFORMANCE IN HIGH SPEED CIRCUITS! NPA SERIES PASSIVE ARRAY 1 PART: 8 ELEMENTS 1608 SIZE 8 ELEMENTS 4 CAPACITORS 4 RESISTORS REPLACE WITH
Integrated Component Solution: Passive Component Arrays High Density Design Solutions: Component Size Reduction and Integration NPASERIES - Four element R•C network arrayin EIA 1608 size package Capacitance values from 10 ~ 180pF Resistive element values from 10 ohm ~ 1K-ohm. R R R R C R C C C C 1608 size : 0.16” long X 0.08” wide 4.0mm long X 2.1mm wide
