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CMS PIXEL Test Chip FCP130

CMS PIXEL Test Chip FCP130 . Fermilab F.Fahim , G.Deptuch , T.Zimmerman , A.Shenai , J. Hoff, M.Trimpl. Design of a test CMS pixels chip. Technology platform: GF130nm ASIC size: 5.5 mm x 8.5 mm Pixel size: 30 µm x 100 µm Analog part: 20 µm x 100 µm

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CMS PIXEL Test Chip FCP130

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  1. CMS PIXEL Test Chip FCP130 Fermilab F.Fahim, G.Deptuch, T.Zimmerman, A.Shenai, J. Hoff, M.Trimpl

  2. Design of a test CMS pixels chip • Technology platform: GF130nm • ASIC size: 5.5 mm x 8.5 mm • Pixel size: 30 µm x 100 µm • Analog part: 20 µm x 100 µm • Digital Part: 10 µm x 100 µm • Rows x Columns: 48 x 160 • Column pattern: A D D A - A D DA -…. • 4 columns are grouped together to create a superColumn (192 pixels) • Each ASIC has 40 super columns. • Analog Pixel options: • 1) Preamplifier + 3 bit Flash ADC (praying mantis ) + hit comparator (independent of ADC to get hit in the processing – to be reviewed on final realizations) • 2) Preamplifier + 3 bit ADC based on asynchronous conversion using in-pixel oscillator triggered by signal (more power consumption but more compact + perspectives for other uses) • Translation of major blocs to 65 nm node is planned to be done collaboratively with INFN 2 Farah Fahim - Fermilab

  3. Digital Encoder (7 to 3) Active transistor feedback resistance Comparator Vhit Vth6 Vth5 Vth4 Vth3 Vth2 Vth1 Vth0 Comparator Comparator Comparator Id Itail> Id+ Ileak Comparator Comparator Preamp (regulated Cascode) Source follower In Preamp Out Comparator Comparator Hit discReset Analog Front-End Leakage current compensation circuit • Dynamic range 0.32fC – 2.5fC • Power Consumption : 5uA (preamp ) + 8uA (all comparators) 3 Farah Fahim - Fermilab

  4. Vdd Vth native Vt ΔVth ΔVsig Clamp to maintain constant Idd In Out Gain with positive regeneration ΔVth Design Details Front-End discReset for switching same rate as bunch crossing clock • Low capacitance to minimize threshold transients Comparator (compact, single-ended architecture, Auto-zeroed, “lurk-trigger-done” – praying mantis low-power, fast, insensitive to corners) 4 Farah Fahim - Fermilab

  5. Analog simulations Transient simulation 2.5fC charge Charge pileup simulation (2.5fC charge @ 1Mhz) Farah Fahim - Fermilab

  6. Analog simulations Transient Noise analysis 0.32fC charge Preamplifier rms noise: 62e- Comparator rms jitter: 725ps Including Correlated double sampling noise: 86e- Farah Fahim - Fermilab

  7. Parametric Analysis Linearity 9 10 11 12 13 14 15 16 Vth (mV) A constant I/P charge of 1000e- threshold voltage(Vth) is varied from 10mV to 16mV, the comparator output pulse width is measured. Determined by comparator reset For a 500ps pulse width Vth must be set to 14.83mV Variable a = charge ( 5u = 2.5fC) Farah Fahim - Fermilab

  8. Corner Analysis With an input charge of 0.125fC, the comparator threshold voltage is varied from 11mV to 16mV Farah Fahim - Fermilab

  9. Montecarlo Analysis Comparator Mismatch only Time at which comparator responds (ns), I/P charge injected at 12.5ns Charge injected at 12.5ns; Comparing montecarlosims of process only, mismatch only and both for I/P charge of 800e- at Vth = 12mV Farah Fahim - Fermilab

  10. Layout Comparator Layout Pixel layout Analog C2 Dimension: 7um x 11um Post Layout simulations performed and layout is optimized. Capacitor C2 is critical and parasitic metal over the layout must be avoided. Dimension: 100um x 20um. Farah Fahim - Fermilab

  11. Digital Pixel • Thermometric encoder • Priority encoder sparsification • Hit processor • Mask/demask capability • Functionality finalized, parasitic extracted superColumn simulated. Simulations confirm performance. • Double pixel layout (20µm x 100µm) Farah Fahim - Fermilab

  12. Digital Simulation BXClk • Super column simulation • Previous_Frame has no hits (default pixel no. is 5) • Frame 1 has 2 hits: Pixel 1(16) and Pixel 48(63) • With ADC values of Max (7) and Min (0) respectively Hit alertConflux Read Strobe ADC Value Pixel no. Column no. Farah Fahim - Fermilab

  13. Top level considerations • Bunch crossing clock distribution across the chip (proposed solution does not suffer from ballistic deficit but relies on clock distribution) • Delays across the chip are chip size dependant • For a column with 48 pixels ~5mm long post layout simulations indicate around 800ps delay • Across columns(160) ~5mm, with the aid of digital place and route we estimate an additional delay of 200ps Supercolumn Layout (zoomed ~10 pixels) Farah Fahim - Fermilab

  14. Readout Electronics • Conflux: Asynchronous data readout scheme with implicit multiplexing of data • Uses a 4 phase handshaking protocol • FIFO2 daisy: enables daisy chaining of data from every pixel to the output. • Also used to communicate between the sparsification logic and Conflux Farah Fahim - Fermilab

  15. FIFO 2 daisy FIFO2daisy is a set of three 5-word deep FIFOs arranged in phases such that in any given BX Clock period, one FIFO is in the Write Phase, one is in the Read Phase and one is being reset. In the Write Phase, the FIFO accepts up to 5 words from the pixel matrix. In the Read Phase, the FIFO outputs any stored words to Conflux. At any time, the contents of all three FIFOs can be captured without interfering with normal operations. Then this captured word can be streamed out of one long daisy chain that includes all double columns. Farah Fahim - Fermilab

  16. Conflux Conflux – an asynchronous 2-to-1 multiplexor with data latching and utilizing a four-phase handshake Farah Fahim - Fermilab

  17. Design of a test CMS pixels chip • Architecture is defined and designed:Sparsified readout using priority encoder (VIPIC1)Second layer of sparsification and data transfer with Conflux (asynchronous digital pipeline system) • Layout of the analog pixel finished • 2 types of ADC’s are planned to be tested by dividing the matrix into 2 parts • Bump bonding to sensors built by Perdue U. • Submission in May depending on run availability • Depending on resources (manpower and funding) and exchange of ideas translation to 65 nm in collaboration with INFN. 17 Farah Fahim - Fermilab

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