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INNOVATION 3-D stack technology for different types of integrated circuit

3-D Chip Stacking to BuildCameras, Computers. S mall B usiness I nnovation R esearch. Irvine Sensors Corporation. Costa Mesa, CA. INNOVATION 3-D stack technology for different types of integrated circuit s that can provide sugar cube size cameras. ACCOMPLISHMENTS

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INNOVATION 3-D stack technology for different types of integrated circuit

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  1. 3-D Chip Stacking to BuildCameras, Computers Small Business Innovation Research Irvine Sensors Corporation Costa Mesa, CA INNOVATION 3-D stack technology for different types of integrated circuit s that can provide sugar cube size cameras ACCOMPLISHMENTS Produced neo-wafers by potting chips that can be thinned and stacked Re-routing the electrical connections so that electrical connections can be made along the stacked edge COMMERCIALIZATION  3-D stacking technology basis for $1.0 million contract with Boeing for miniature computer (mobile voice activated computers for soldiers)  Incorporating in infrared cameras for commercial market  Complex systems for portable electronics 3-D Stacked Module from Different Integrated Circuits GOVERNMENT/ SCIENCE APPLICATIONS Various NASA missions requiring highly integrated instruments such as the Mars landers and rovers 1993 Phase II; NAS7-1374 NASA/JPL Contact - Bedabrata Pain Company Contact - David Ludwig Jet Propulsion Laboratory Success Story #7-012

  2. INNOVATION 3-D stack technology for different types of integrated circuits that can provide sugar cube size cameras

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