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Materials Selection for Instrumentation Trace Production in LARP

This presentation by D. Cheng on Sep 23, 2013, outlines current trace production in LARP, experienced issues, available materials, fabrication processes, impregnation preparations, and experiences with traces. It discusses pinholes, impregnation issues, and potential heater/instrumentation materials.

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Materials Selection for Instrumentation Trace Production in LARP

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  1. Instrumentation Trace Material Selection D. Cheng Sept 23, 2013

  2. Outline • Current LARP trace production • Issues experienced • Other materials available D. Cheng

  3. LARP Coil Instrumentation *Modified cross-linked epoxy system, AS 1084 *** Joined by single strip of 3M VHB F-9460PC D. Cheng

  4. Instrumentation Trace Fabrication Process • Design and print artwork (negative mask) • Cut trace laminated material to length • Cover conductive laminate with resist • Expose resist under negative mask with UV light • Wash the uncured resist from laminate • Etch laminated material with cured resist pattern • Conductive layer covered by resist remains • Remaining resist washed off by stripping agent D. Cheng

  5. Instrumentation Trace Impreg. Preparations • Electrical QA • Bond additional layer of Kapton • 25 µm (earlier iterations) • 50 µm (current) • Perforate polyimide layers • Install during coil impregnation D. Cheng

  6. Experiences with Traces During Coil Fabrication • “Pinholes” have caused electrical failures • A few were caused by materials • Some were caused by the handling • Additional layers (25 µm or 50 µm) of Kapton were added for protection • Some laminated traces did not fully impregnate D. Cheng

  7. Pinholes Material flaw (inclusion) that caused a hipot failure during electrical QA D. Cheng

  8. Impregnation Between Polyimide Layers Coil 14 OL, end of ramp area, post-impregnation, sectioned Coil 14 OL, end of ramp area, trace peeled off Lack of fill between layers Coil itself shows good impregnation D. Cheng

  9. Potential Heater/Instrumentation Materials • Current trace designs specify 50 µm thick polyimide backing, therefore the following options exist: *Modified cross-linked epoxy system, AS 1084 **Apical AV is similar in thermal conductivity as Kapton HN (0.19 W/mK) D. Cheng

  10. Materials Options Summary D. Cheng

  11. Additional Slides D. Cheng

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