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RBSP Electric Field and Waves Instrument (EFW)

RBSP Electric Field and Waves Instrument (EFW). Electrical Peer Review DCB Michael Ludlam. Overview. Sept 2nd & 3rd 2009. EFW ELECTRICAL PEER REVIEW. DCB board hosts: the Z80 processor contained in the Actel RTAX FPGA PROM, SRAM and EEPROM program memory.

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RBSP Electric Field and Waves Instrument (EFW)

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  1. RBSPElectric Field and Waves Instrument(EFW) Electrical Peer Review DCB Michael Ludlam EFW ELECTRICAL PEER REVIEW

  2. Overview Sept 2nd & 3rd 2009 EFW ELECTRICAL PEER REVIEW • DCB board hosts: • the Z80 processor contained in the Actel RTAX FPGA • PROM, SRAM and EEPROM program memory. • Switched SDRAM TM memory (short term) • Switched FLASH TM memory (long term) • Spacecraft interface using LVDS • Interface with BEB, DFB and PCB (on LVPS) • ADC for digitalization of HK • LDO regulators for 3.3V and 1.5V supplies. 2

  3. Requirements Requirements as listed in the DCB Specification document RBSP_EFW_DCB_003E Sept 2nd & 3rd 2009 EFW ELECTRICAL PEER REVIEW 2

  4. Schematic & Layout Sept 2nd & 3rd 2009 EFW ELECTRICAL PEER REVIEW • Flight Schematic RBSP_EFW_DCB_004K • Layout for ETU built to RBSP_EFW_DCB_004G, layout for flight built to RBSP_EFW_DCB_004K • Changes from ETU: • Buffers run as warm spare for the flash, SDRAM. • Removal of filter on regulator supplies (no longer necessary after SEU testing of parts). • Corrected switch to SDRAM and flash • Minor changes to layout to correct layout errors • Added buffer enable control to the flash to FPGA • Changed DIN96 connector to the new KA98 connector. • Added Analog Spare nets to connector for spares. • Differences between ETU and Flight: • FPGA on ETU board is Aldec adaptor board with A3P1500 part. • Oscillator is commercial part. • Other parts are engineering versions of flight parts. • Board will be manufactured from FR4 (4101/26) 2

  5. Grounding Sept 2nd & 3rd 2009 EFW ELECTRICAL PEER REVIEW Connection from DGND to chassis is close to front plate. Connection from DGND to AGND is at the ADC. 2

  6. Thermal Sept 2nd & 3rd 2009 EFW ELECTRICAL PEER REVIEW 2

  7. Mass Sept 2nd & 3rd 2009 EFW ELECTRICAL PEER REVIEW NTE is 667g CBE is 543g CBE includes front panel, connectors, shield, wedgelocks. Staking plan – Single CQFP (FPGA) part needs to be staked carefully, other dual flatpacks will require standard staking. 2

  8. Power Sept 2nd & 3rd 2009 EFW ELECTRICAL PEER REVIEW 1.8VD    50mA 3.6VD    135mA (SDRAM no FLASH) 5VD    4mA 5VA 15mA  -5VA    10mA 10VA 1mA average. -10VA 0mA average. 2

  9. Radiation Sept 2nd & 3rd 2009 EFW ELECTRICAL PEER REVIEW • All DCB Active parts are rad hard / rad tolerant or have undergone a TID test. TID requirement is now 13kRad after ray trace analysis. • All DCB Active parts are SEU immune up to 80MeV/cm2 or have a waiver. • Parts with waiver: • LTC1604 (ADC) • Flash memory • Parts on S/C interface have been tested by APL for DDD. No other interface out of IDPU box. 2

  10. ETU Testing Sept 2nd & 3rd 2009 EFW ELECTRICAL PEER REVIEW • Board has supported FSW, FPGA and IDPU testing. • No modifications have been necessary other than described above. • Still to be done: • Minor tweaks of signal trace impedances. • PCB circuitry checkout 2

  11. Flight Test Plan Sept 2nd & 3rd 2009 EFW ELECTRICAL PEER REVIEW Short test plan was written for ETU testing. This will be developed into a test procedure for the flight board. Once the board is populated and delivered to UCB functionality that can be checked at a hardware only level will be verified before handing over to FPGA verification and FSW verification. 2

  12. Parts List & Derating Sept 2nd & 3rd 2009 EFW ELECTRICAL PEER REVIEW 2

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