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B904 Integration

B904 Integration. Pre-Series Manufacture Final Production Plans. presented by John Coughlan RAL. B904 Integration. Firstly, apologies if this has already been covered in 2 previous meetings and/or is stating the obvious…

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B904 Integration

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  1. B904 Integration Pre-Series Manufacture Final Production Plans presented by John Coughlan RAL

  2. B904 Integration Firstly, apologies if this has already been covered in 2 previous meetings and/or is stating the obvious… …and approaching this problem from point of view of validating FED boards. Scope : only considering OFF Detector Electronics i.e. crates in USC55. Strategy : to have final Tracker DAQ system i.e. final racks destined for USC55 operational as test bed in B904 Schedule and Resources : need to identify one overall responsible for B904 hardware (CERN based). Subdivide tasks for hardware/firmware/software. Milestones. Arrive at System Test with all final components for 2 partitions asap; So many ‘new’ components still to be integrated… APVE, FMM, OptoFEC, OptoFED, LTC, TTCci, TTC splitter, CAEN CC, FRL… Distinguish System Tests vs Acceptance Tests FED System Test : Test 2? full crates together with final Tracker DAQ elements see above (and assoc S/W). Synchronisation. FED Acceptance Test : Follows on from UK acceptance tests see next slide Individual FEDs will be tested as far as possible with Opto inputs/SLINK at RAL. But using FED Testers not final system. Require system at B904 for CMS to validate FEDs (and other components) Envisage Full Crate of FEDs (Opto inputs or simu test frames) running continuously “soaking” with central Tracker DAQ Q. CMS Acceptance / Validation Policy? Either refill this crate with random sample of FEDs from batches or re test every FED. Both are doable, question of logistics. Target of ~ 50 boards / month commencing October 2005. FEDs go into storage at B904? awaiting installation in USC55.

  3. Acceptance/Validation of FEDs Testing by Assembly plant operatives 0. Quality Controls during Assembly process AOI, X-ray Boundary Scan Testing for Digital 1. Custom Tests at Assembly Plant BScan, VME crate 2. Tests at RAL & IC OptoRx, Full crate 3. Tests at CERN Prevessin 904 DAQ Integration VME Crate Testing for Analogue 4. Installation at CMS USC55 Test Flow from Assembly Plant to USC55 500 boards to test over 10 months. Essential to catch any manufacturing faults early.

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