1 / 11

Spezielle Anwendungen des VLSI – Entwurfs Applied VLSI design

Spezielle Anwendungen des VLSI – Entwurfs Applied VLSI design. Phase 5 Reliability - Electromigration Robert Mars. Metal wire. Thickness fixed by process parameters Width can be adapted by designer. Metal r eliability. Blacks´s Equation: lifetime of an interconnect scales with and

Télécharger la présentation

Spezielle Anwendungen des VLSI – Entwurfs Applied VLSI design

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Spezielle Anwendungen des VLSI – Entwurfs Applied VLSI design Phase 5 Reliability - Electromigration Robert Mars

  2. Metalwire • Thicknessfixedbyprocessparameters • Width canbeadaptedbydesigner

  3. Metalreliability • Blacks´s Equation: • lifetime of an interconnect scales with and • Source: ITRS (International Technology Roadmap for Semiconductors) 2011

  4. Metalreliability

  5. Electromigration • Metalionsmovetowardstheanode • Force on ions due toelectronscattering in directionofelectronflow • Electricfield in metalcauseselectrostaticforce on ions • Damagecausedbydivergences in atomicflux

  6. Enhancingreliability • WireWidening •  increasingcross-sectionarea • Passivation Layer •  preventdiffusion, betterdissipationofjouleheat • Gold Metallizations •  very high activationenergy • AlloyingofMetallization •  additionofTi-Si orCuto Al • Deposition Techniques •  i.e. MTTF smallerforSputteringthanelectron-beam deposition • Wirelength •  ifwireisshorterthan Blech lengthmechanical stress compensates material flow

  7. Thank you for your attention

  8. Quellen • http://www.synopsys.com/Tools/Verification/CapsuleModule/CustomSim-RA-wp.pdf • http://www.doitpoms.ac.uk/tlplib/electromigration/index.php • http://www.ece.mtu.edu/faculty/goel/EE-4271/Web-Interconnects.pdf

  9. Stresses

  10. JmaxCalculation • Quelle: http://www.itrs.net/Links/2011ITRS/2011Chapters/2011Interconnect.pdf

  11. Blech length • – activationvolume (m³) • – hydrostaticcomponentofmechanicalstress (kg m-1 s-2) • – electromigrationforce, whichcausesatomicmigration • - effectivevalence (represents the sign and the magnitude of the momentum exchange) • – resistivity (

More Related