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LOI Backup Document: R&D

LOI Backup Document: R&D. Feb Stave Mtg 2012. Topics. Overview of systems needs for R&D: The R&D needed for the tracker falls into a number of broad categories, detailed below.

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LOI Backup Document: R&D

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  1. LOI Backup Document: R&D Feb Stave Mtg 2012

  2. Topics • Overview of systems needs for R&D: The R&D needed for the tracker falls into a number of broad categories, detailed below. • Mechanical: The basic element of the tracker is a stave, built up from a thermo-mechanical stave core. The stave core is composed of various carbon based materials, adhesives, and cooling structures. These materials and their fabrication and assembly is an R&D topic. The staves are mounted on light carbon fiber barrels, also a topic of R&D. • Sensors: This covers the design of prototyping of silicon strip sensors. • Cooling: This covers the basic cooling system, cooling plant, and requirement. • Electrical: This covers the FEE, hybrids, modules, and data transmission within the stave. • Powering: This covers the alternative powering schemes, serial and DC-DC, and their control, monitoring, and power protection aspects. This also covers the HV distribution and monitoring within the stave. • Services: This covers all the off-stave services, in particular optical vs copper, cable plant and cable use/re-use scenarios, and coolant distribution. • Assembly: This covers the processes for manufacturing during production including hybrids, modules, cores, flex, staves, and module mounting. • Alignment: This covers mechanical alignment and monitoring with is not part of the assembly process. • Trigger: This covers the application of the stave tracker to a Level 1 track trigger.

  3. Ongoing Status Reports • Stave Core Fabrication: Tim Jones and David Lynn • Petal Core Fabrication: Carlos Lacasta • Mechanical Bus Co-Cure: Georg Viehhauser and Carl Haber • Supermodule Mechanics: Frank Cadoux DECLINED • P-type Sensor Development: NobuUnno, HartmutSadrozinski • Cooling Studies: Georg Viehhauser • Development of the ABC-next 130 nm Chip: Francis Anghinolfi • Development of the Hybrid Controller Chip: Mitch Newcomer DONE • Development of the SPP Serial Powering Chip: Mitch Newcomer • Development of the DC-DC Conversion ASIC and PCB Package: Georges Blanchot • Hybrid: Ashley Greenall • Module: Tony Affolder • Stavelet Test Program: Peter Phillips • Petal Electrical Program: Ingrid Gregor • Supermodule Electrical Test Program: Didier Ferrere DECLINED • Digital Data Transmission on the Stave and the BCC Chip: Carl Haber DONE • Power Protection and Serial Powering: David Lynn and Mitch Newcomer DONE • Cabling and Services Survey and Analysis: Sergio Diez Cornell • Hybrid Assembly Process: Ashley Greenall • Module Assembly Process: Tony Affolder • Stave Mounting Process: Martin Gibson DONE • Low Mass Tape Development: Tony Weidberg DONE • HSIO Data Acquisition System: David Nelson and Carl Haber • Alignment R&D: Richard Nickerson • Level-1 Track Trigger R&D ROI based: NEED Author • Level-1 Track Trigger R&D Self Seeded: Maurice Garcia-Sciveres

  4. Pending R&D Needs • HV Multiplexing: David Lynn DONE • Additional Cabling Studies: Sergio Diez-Cornell • Optical Data Transmission to the Stave: Tony Weidberg • The Petlet Program: Ingrid Gregor • Application of the RCE system to stave DAQ Su Dong

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