1 / 8

Calice WP4

Calice WP4. Ray Thompson WP4 aims: look at Mechanical/Thermal/ Assembly issues Utilise Atlas SCT experience effort weighted to latter end of period conducting Glues Assembly concepts.

media
Télécharger la présentation

Calice WP4

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Calice WP4 • Ray Thompson • WP4 aims: look at Mechanical/Thermal/ Assembly issues • Utilise Atlas SCT experience • effort weighted to latter end of period • conducting Glues • Assembly concepts Ray Thompson Calice meeting Mar 07

  2. Conducting Glues Silver filled 2 part epoxy ( no mass loss no voids) Ag has high ~1/1000 solid Ag -interconecting particles choose particle size , viscosity,cure temp EPO-tek 4110 Areas of interest - resistance aging Interface problems oxide layer at Al/Ag interface Production wafers old CTE mismatch Si /PCB - glue flexible Glass transition temp CTE change 50 x10-6 to 150 x10-6 Corrosion/electro chemistry – Ok for N2 atmosphere Glue effects on wafer passivisation Ray Thompson Calice meeting Mar 07

  3. Glue test set up Programmable Environmental chamber Glue Robot Resistance measurements Keithley 236 SMU or 2000 DVM Labview Prague wafers 3x3 3mm square pixels Standard 6X6 10mm square pixels Ray Thompson Calice meeting Mar 07

  4. Resistance snake Tests By probing Rear Pcb pads can measure the resistance of individual glue dot joint pairs or the total resistance of the snake Silicon pads pcb R R total Pc board / gold DR 0.1 ohm/50 dots Ray Thompson Calice meeting Mar 07

  5. Spacers to define height Kapton Spacers to define height Ray Thompson Calice meeting Mar 07

  6. Long term Thermal Cycling 72 dot Snake test – continually powered 500 hr 20 to 70 degrees 1deg/min - Slow reduction in resistance over 100 hr then stable at ~ 1 ohm /dot - Resistance change each cycle as result of expansion / contraction - No evidence for beginnings of joint failure R ohms 1000 Temp cycle 72 dot Resistance R o 100 Time hrs Ray Thompson Calice meeting Mar 07

  7. “Virgin” glue joints show initial training behaviour Cured for some days no previous bias applied On first application of voltage IV curve can show high resistance at low voltage typically <500 mv then chaotic transitions to lower resistance states as the is voltage increased. Finally a step transition to “ normal “ state ~1 ohm typically at a few volts. Once this state has been established it seems permanent. The mechanism is probably a complex mixture of punch though of nanometer scale oxide interface films and mechanical breakthrough due to expansion by localised heating Initial resistance measurements with low voltage sources - many DVMs - can give very misleading results. This is consistent with our Atlas experience – few volts needed for initial measurement. Some evidence oxide films can restablish them selves if detectors left unbiased for months in normal air– can be ‘reset’ by few volts. Dot pair IV curves showing transition to low resistance Corresponding Resistance plot Ray Thompson Calice meeting Mar 07

  8. Summary ‘Virgin’ glue joints can show initial high resistance behaviour at low bias Bias > few volts enables conducting paths to be established Care needed when making DVM measurements Consistent with Atlas observations Thermal Cycling Tests show no indications of beginnings of joint failure Where now? Wrap up glue studies Move on to assembly studies Ray Thompson Calice meeting Mar 07

More Related