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IB stave assembly

IB stave assembly. A. Di Mauro, C. Gargiulo , J. Van Beelen ITS-MFT mini-week 12.03.2014. TDR procedure. Main steps: HIC assembly + HIC gluing on C-fibre support . TDR procedure. B. A. HIC assembly by laser ball soldering

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IB stave assembly

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  1. IB stave assembly A. Di Mauro, C. Gargiulo, J. Van Beelen ITS-MFT mini-week 12.03.2014

  2. TDR procedure Main steps: HIC assembly + HIC gluing on C-fibre support ITS-MFT mini-week - IB stave - A. Di Mauro

  3. TDR procedure B A • HIC assembly by laser ball soldering • Tooling: vacuum table (A) to hold chips (with x,y,z micrometric adjsutment), vacuum table (B) to hold FPC, soldering macor grid with conical holes (0.4-0.9), ball pick-up A B INFN BARI ITS-MFT mini-week - IB stave - A. Di Mauro

  4. TDR procedure • HIC assembly by laser ball soldering • Nine chips are placed above the vacuum table A and precisely aligned with respect to each other • The FPC is placed above the vacuum table B and held in a position defined by reference pinholes • The FPC is aligned with respect to the subjacent array of chips by matching the holes with the connection pads on the chip surface • The soldering grid, aiming to gently press the FPC against the chip, is placed above the stack-up and aligned with respect to the holes in the FPC • The loaded ball pick-up tool is aligned above the stack-up corresponding to the first chip and overlapped to the soldering grid; then the balls are released • The laser soldering of each connection is performed in sequence • The last four steps are repeated to connect all remaining chips and complete the HIC • Electrical tests and metrology of chips positions ITS-MFT mini-week - IB stave - A. Di Mauro

  5. TDR procedure • HIC gluing on C-fibre support • No details were provided ITS-MFT mini-week - IB stave - A. Di Mauro

  6. Procedure update • Optimization of laser soldering • Insulation of chips from aluminium vacuum table (acting as heat sink) using a thin macor plate • Soldering under N2/H2 (95/5) mixture + gas exhaust holes • Soldering under vacuum ITS-MFT mini-week - IB stave - A. Di Mauro

  7. Procedure update gas exhaust hole FPC antipad Ø 600 µm + (10 to 15 µm) FPC pad Ø 400 µm + (10 to 16 µm) Hole Ø 200 µm ± 10 µm 10 µm Solder mask Ball Ø 200 µm +/- 8 µm 25 µm Copper Polyimide Polyimide 50 µm 25 µm Copper 10 µm Solder mask Chip 50 µm ITS-MFT mini-week - IB stave - A. Di Mauro

  8. Procedure update • Soldering under vacuum • Advantages wrt to N2/H2: • No exhaust holes • Environmental conditions for soldering: faster and reproducible ITS-MFT mini-week - IB stave - A. Di Mauro

  9. Procedure update Further considerations (apparently not inter-correlated): • Al sputtering done in batches of 50x150 cm: try to maximize no. of FPCs fitting in such a surface • Safe handling of HIC during all phases • Ensure repeatability of chips alignment • FPC holes’ position accurate “enough”, spread compensated by larger chip pads (to be verified) ITS-MFT mini-week - IB stave - A. Di Mauro

  10. Al-FPC layout under study • Double no. of FPCs in each foil • Easier cutting of extra material (wings) at the end of stave assembly ITS-MFT mini-week - IB stave - A. Di Mauro

  11. FPC/HIC frame • Frame holding FPC from soldering until stave assembly: • easier handling • possible protection with additional lids • The frame (FPC) has pinholes (targets) to be used as reference for placement/alignment during the various phases • The same pinholes (or additional ones) match pinhole in the C-fibre connectors

  12. Reviewed procedure • Mount FPC on frame using reference pinholes • Place chips on vacuum table and align with respect to reference pinholes (on table) matching those of the frame • Overlap soldering grid to FPC • Release soldering balls inside the grid using the pick-up tool (for all chips) • Fix lid and start vacuum • Laser soldering of 9 chips • Electrical test + metrology of HIC (final position of chips wrt to frame pinholes) • Glue HIC on C-fibre support using jig with pinholes in connectors • Final metrology to transfer chips position to external target (details to be worked out) ITS-MFT mini-week - IB stave - A. Di Mauro

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