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ISPL MASS PRODUCTION Packaging Portfolio

Explore our extensive ISPL mass production packaging portfolio, featuring innovative solutions for non-standard plastics. Our offerings include advanced transfer molding, glob top encapsulation, and pre-molded plastic cases tailored for diverse applications. Additionally, we specialize in multi-chip modules (MCM) and multi-chip packaging (MCP), as well as chip-on-board (COB) technologies, with or without surface-mounted devices (SMD). Our high-quality laminates ensure robust protection and performance, making us your ideal partner for efficient packaging needs.

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ISPL MASS PRODUCTION Packaging Portfolio

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