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Materials & Processing for Si Compatibility

Materials & Processing for Si Compatibility. Charles T. Sullivan ctsulli@sandia.gov, 505/844-9254 Center for Compound Semiconductor Science and Technology Microsystem Science, Technology and Components Center Shawn Lin and Jim Fleming. Introductory overview Photonic Bandgap Materials .

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Materials & Processing for Si Compatibility

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  1. Materials & Processing for Si Compatibility Charles T. Sullivan ctsulli@sandia.gov, 505/844-9254 Center for Compound Semiconductor Science and Technology Microsystem Science, Technology and Components Center Shawn Lin and Jim Fleming Introductory overview Photonic Bandgap Materials Optical Interconnects for High Performance Computing Workshop Oak Ridge 11/8-9/99

  2. Possible Options for On-Chip Waveguide Interconnects • Hard dielectric waveguides • low-loss optical fiber compatibility • low index contrast N ~ 0.005 •  = 0.1 dB/cm to < 0.01 dB/cm • e.g., LPCVD-based buried BPSG/TEOS • higher-index for higher-density routing • high index contrast N > 0.1 •  < 0.1 dB/cm ? • e.g., LPCVD-based SiON/TEOS • Polymeric waveguides • low-temperature post-processing • low index contrast N ~ 0.05-0.005 •  ~ 0.1 dB/cm to 0.5 dB/cm, depending on  • e.g., fluorinated acrylates or polyimides

  3. Possible Applications of PBG Materials Bandstop is Largely Independent of Angle Transmission Wavelength (m)

  4. Simulated Electric Field Patterns for90-degree Waveguide Bend 2D Square Lattice 3D Square Lattice

  5. 1.2 1.0 theory 0.8 experiment 0.6 Transmission Efficiency 0.4 0.2 0 75 80 85 90 95 100 105 110 Frequency (GHz) 90-degree Waveguide Bend at Millimeter-Wave Frequencies

  6. The Microfabrication Challenge The minimum feature size for a lattice with bandgap of 1.5 micron is 0.18 microns!

  7. 3D Silicon Photonic Crystal at Mid-IR Frequencies Technology Challenges - precise stacking; - smooth planarization; - large area uniformity. Top View Side View poly-Si Si substrate 4-layer crystal

  8. Mold Process Flow

  9. The Simple Cubic StructureFabricated Using the Mold Process

  10. Fillet Flow Process

  11. Measured Results bandgap 100 3L 4L Transmission Efficiency 20 1.7 1.4 1.6 1.8 1.5 1.3 Wavelength (m) 1.5µm Bandgap Fillet Structure

  12. Novel Structures Under Investigation

  13. Defect Volume: 0.23 Modal Volume: 0.8l3 7 6 5 6.4m (0.6) 4 3 2 1 9.2m (0.8 ) Singlemode 3D Defect Cavity Higher-Q Results

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