1 / 17

Corporate Overview

Corporate Overview. www.atmel.com. Everywhere You Are . Corporate Mission. To be an industry - lead ing supplier of advanced integrated circuits (ICs). Atmel is an industry leader in ICs for Smart Cards and secure Point-of-Sale Terminals. Technology Integration. MCU. NVM. Complete .

nanji
Télécharger la présentation

Corporate Overview

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Corporate Overview www.atmel.com Everywhere You Are 

  2. Corporate Mission To be an industry-leadingsupplier of advanced integrated circuits (ICs) Atmel is an industry leader in ICs for Smart Cards and secure Point-of-Sale Terminals Corporate Overview

  3. Technology Integration MCU NVM Complete System Solutions Analog & RF Corporate Focus Atmel focuses on System Solutionsbuilt around: • High-performance Microcontrollers (MCU) • Embedded Non Volatile Memories (NVM) • Radio Frequency (RF) • Analog • Security … to maintain leadership in key markets, including: • Flash Microcontrollers • #1 in 8-bit Flash microcontrollers • Secure Systems • #2 in secure ICs for smart cards • Automotive Corporate Overview

  4. Application Code Modules Operating Systems Protocol Stacks Device Drivers Nonvolatile Memory Sensor Micro- controller RF Analog Power Manage-ment Logic Application Support In partnership with applicationleaders, Atmel supplies: • Device Driver Software • Protocol Stacks • Operating Systems • Compilers • Application Code Modules • Development Tools • Reference Designs … to simplify application development Application-ready System Corporate Overview

  5. Everywhere you are  Wide Application Focus Atmel aims its products at a wide range of applications in high-growth markets: • Consumer • Computer/ Networking • Communications • Security/ Smart Cards • Automotive • Industrial/ Medical/ Military/ Aerospace Market Diversity Corporate Overview

  6. General-Purpose Application-Specific Non Volatile Memories Flash DataFlash® EEPROM/ Serial EEPROM Microcontrollers 80C51 (8-bit CISC) AVR®(8-bit RISC) ARM®(32-bit RISC) AVR32 (32-bit RISC) High-reliability MCUs (32-bit Power PC) Diopsis™ (Floating Point VLIW DSP) ASICs Customer Specific ASICs Rad. Hard ASICs FPGA Conversion (ULC) Secure Solutions Secure MCU Contactless Card Secure Memory CryptoMemory® Smart Card Reader RFID Trusted Platform Module Biometric ICs FingerChip® Communications Solutions ZigBee RF Products GSM/CDMA Cell Phone GPS Chipset Cordless Phone Analog/DigitalAudio Broadcast Car Access Tire Pressure Metering RF Remote Control License Free Industrial & Consumer ASSPs USB GPS Baseband Power Management Broadband Data Conversion Multimedia ICs Voice-over-IP (VoIP) Storage Interface Sound Processing (Dream™) MP3 Player DVD/CD Writer/Player Video Automotive ICs CAN / LIN Networking Automotive Sensors Driver ICs Watchdog ICs Single-function ICs Imaging ICs CCD/CMOS Image Capture Image Processors Integrated Digital Camera Module Common IP Blocks:MCU/DSP Cores & Peripherals, Standard Interfaces, Analog, Power Management, Embedded Nonvolatile Memory, RAM, ROM Foundry Services:SiGe Bipolar/BiCMOS, BCDMOS/BCD-on-SOI, CMOS Product Lines Corporate Overview

  7. Fabrication Processes Atmel develops advanced fabricationprocesses precisely adapted to its products: • CMOS • High-performance digital and analog • CMOS with Non Volatile Memory • Embedded EEPROM and Flash memory • BCDMOS and BCD-on-SOI • High-voltage, high temperature and high noise immunity for automotive applications • Silicon Germanium (SiGe) Bipolar and BiCMOS • High-frequency RF interfaces Leading-edge semiconductor fabrication processes Corporate Overview

  8. www.medea.org www.cordis.lu/ist www.eureka.be Research & Development Atmel participates in Collaborative R&D Projects for: • Leading-edge Technologies • Non Volatile Memory and Embedded NVM • Nanoscale CMOS technology and fabrication processes • Next-generation SiGe technology • Advanced Design, Fabrication and Packaging Techniques • Next-generation Products • Wireless Sensor Networks • Secure Communication Solutions • Multi-standard Broadcast Receivers • Long-range RF Identification (RFID) Products Partnership with Universities, Research Labs and Market-leading Customers Corporate Overview

  9. Facilities 8000 employees worldwide • San Jose, USA • Corporate Headquarters, Test, R&D • Colorado Springs, USA • 0.25-micron 6-inch Wafer Fab, Test, R&D • Rousset, France • 0.13-micron8-inch Wafer Fab, Test, R&D • Heilbronn, Germany • 0.5-micron6-inch SiGe/ Bipolar/ BiCMOS/ BCDMOS Wafer Fab, Test, R&D • North Tyneside, England • 0.13-micron 8-inch Wafer Fab, R&D • Grenoble, France • CCD Fab, Assembly, R&D • Philippines • Assembly, Test • 27 Design Centers • Berkeley, Colorado Springs, Columbia, Raleigh, San Jose, Chicago, Camberley, East Kilbride, North Tyneside, Helsinki, Stockholm, Trondheim, Semur-en-Auxois, Grenoble, Nantes, Paris, Rousset, Lisbon, Milan, Patras, Duisberg, Dresden, Heilbronn, Ulm, Bucarest, Shanghai, Tokyo • 22 Sales Offices Worldwide Atmel Corporate Headquarters, San Jose Atmel also uses fabrication sub-contractors to ensure the best technology mix in its products Corporate Overview

  10. Automotive Products 5% Non Volatile Memory Mixed Signal ASSPs 22% 9% ASICs 13% Microcontrollers Secure Products 20% 14% RF Wireless ASSPs 17% Revenue Split by Product Category Atmel Product Revenues 2005 Corporate Overview

  11. Revenue Split by Region Atmel Product Revenues 2005 Corporate Overview

  12. High-volume, high-integration, low-cost, low-power-consumption ASSPs and ASICs Consumer Applications Applications: • DVD and MP3 Players • Music Synthesis/Karaoke • Electronic Games • AM/FM and Digital Radios • TV/Video, White Goods • Digital Cameras Products: • DVD Chipset and Laser Controller ICs • ISM-band Radio Link ICs • Image Sensor / Processor ICs • MP3 Decoder • Dream™ Sound Synthesis ICs • ARM®-based 32-bit Microcontrollers • AVR® 8-bit and 32-bit Microcontrollers • AM/FM Receivers and Amplifiers • DAB Receiversand Decoders • TV/Video ICs • IR Remote Receiver ICs • Power Management ICs Corporate Overview

  13. Highly integrated analog/digitaland RF Systems-on-Chip Communications Applications Applications: • GSM/GPRS/CDMA/UMTS Mobile Phones • Cordless and Corded Phones • Secure Mobile Radios • Global Positioning System (GPS) • Personal Locators • Infrastructure Systems Products: • GSM/GPRS Baseband Processor • RF Transceivers, Power Amps and Front-end ICs • RF Standard Building Blocks • Cordless and Corded Phones ICs • GPS Receiver and Baseband ProcessorChipset • Miniature Digital Camera Modules • ARM®-based Std Products, ASSPs and ASICs • Power Management ICs Corporate Overview

  14. Market-leading products conforming to stringent automotive industry standards Automotive Applications Applications: • Vehicle Body Electronics • Vehicle Access • Power Train Management • Telematics (Navigation) • Entertainment (Car Radio, Car Media) • Tire Pressure Metering Systems (TPMS) Products: • Sensors (Rain Sensor) • Vehicle Network/Multiplexing (CAN, VAN, LIN, etc.) • GPS Receiver and Baseband ProcessorChipset • Receivers for Analog and Digital Broadcast Systems • ICs for Wireless Control (Keyless Entry, etc.) • TPMS ICs • Smart Drivers and Intelligent Bridges • AVR® 8-bit and 32-bit Microcontrollers • Single-function ICs • Customized ASICs Corporate Overview

  15. Process Roadmap Process Roadmap 2003 2004 2005 2006 0.25 µm MCU Flash MCU Digital/Analog ASIC Digital/Analog ASSP Programmable Logic Flash CMOS Logic & Flash 0.18 µm 0.13 µm 0.09 µm Secure MCU EEPROM ASIC EEPROM ASSP EEPROM 0.25 µm CMOS Embedded EEPROM 0.18 µm 0.15 µm 0.35 µm RF RF ASSP Foundry SiGe- BiCMOS 0.18 µm 0.13 µm Corporate Overview

  16. Key Technology for RF Products Silicon Germanium (SiGe) 1 GHz 2 GHz 5 GHz 10 GHz GaAs SiGe Si GSM ISM DCSPCS DECT WLAN Blue-tooth RF Links PDC GPS WLAN ISM Corporate Overview

  17. Manufacturing Facilities: Germany/UK • Heilbronn, Germany • Process: SiGe, Bipolar, BiCMOS, BCDMOS • Wafer Size: 6-inch (150mm) • Technology: 0.5µm • Fabrication, Product R&D • North Tyneside, UK • Process: CMOS, SiGe BiCMOS, NVM, Smart Card Technologies • Wafer Size: 8-inch (200mm) • Technology: 0.18µm, 0.13µm • Usable Clean Room Area: 75,000 sq ft (7,500 sq m) • Fully Equipped Capacity: 10,000 wafers/week Corporate Overview

More Related